H01P5/183

THREE-DIMENSIONAL MICROSTRUCTURES

An apparatus comprising a first power combiner/divider network and a second power combiner/divider network. The first power combiner/divider network splits a first electromagnetic signal into split signals that are connectable to signal processor(s). The second power combiner/divider network combines processed signals into a second electromagnetic signal. The apparatus includes a three-dimensional coaxial microstructure.

Directional signal coupler-divider
12181514 · 2024-12-31 ·

Low loss high directivity signal couplers use one or two U-shaped wire loops inserted into a slot of a low loss transmission line; the low diameter coaxial cable ending in wire loop sensors, which are inserted into the slot of the transmission line lead to a coupled, an isolated and a divided port. High, capacitively induced, electrical current, because of the proximity between the signal conductor of the airline and the wire loop, compares favorably with the antiphase magnetically induced current component in the wire loop sensor and leads to increased coupling, division and directivity over a wide frequency range starting at a few hundred MHz and exceeding 18 GHz. The signal coupler-divider is used in hybrid load pull tuners with instantaneous vector signal measurement capability.

Adjustable power divider and directional coupler

A power divider including an input port receiving an electrical power input, a coupled port transmitting a portion of the power input, and a transmitted port transferring a remaining portion of the power input from the input port. A first conductor produces an electrical field and electrically connects the input port to the transmitted port. And, a second conductor, disposed within electrical field of the first conductor, electrically connects to the coupled port, the second conductor. The first and second conductors are configured to be variably spaced to vary the coupling factor between the input and transmitted portions of the input power.

HIGH POWER PHASE SHIFTER
20170163236 · 2017-06-08 ·

A variable capacitance cell includes a hybrid coupler including a first port, a second port, a third port, and a fourth port. A first variable capacitance is connected to the second port. The first variable capacitance includes one or more first variable micro-electromechanical system (MEMS) capacitor. A second variable capacitance is connected to the third port. The second variable capacitance includes one or more second variable MEMS capacitors. Control signals are applied to the first and second variable capacitances to selectively change the capacitances of the first and second variable capacitances, thereby modifying a phase difference between a signal input at the first port and a signal output from the fourth port.

MULTI-STAGE BROADBAND DIRECTIONAL COUPLER
20170141451 · 2017-05-18 ·

An improved multi-stage broadband directional coupler with at least one line junction between two successive coupling sections has a) a change in the line thickness (LD) and/or b) a change in the line width (LB) and/or c) a change in the coupling distance (KA) between the adjacent coupling sections of the two coupling lines. An electrically conductive cover connected to the coupler housing is provided adjacent to the at least one line junction.

Method for fabricating miniature structures or devices such as RF and microwave components

Multi-layer, multi-material fabrication methods include depositing at least one structural material and at least one sacrificial material during the formation of each of a plurality of layers wherein deposited materials for each layer are planarized to set a boundary level for the respective layer and wherein during formation of at least one layer at least three materials are deposited with a planarization operation occurring before deposition of the last material to set a planarization level above the layer boundary level and wherein a planarization occurs after deposition of the last material level above the layer boundary level and wherein a planarization occurs after deposition of the last material whereby the boundary level for the layer is set. Some formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g. selective etching operations and/or back filling operations).

Tapered airline directional coupler
09543631 · 2017-01-10 · ·

A tapered airline directional coupler includes a housing having a length with an input end and an output end, the housing having a slot formed therein extending between the input end and the output end. The coupler also includes a main conductor in electrical communication with an input port connector mounted on the housing at the input end thereof and with an output port connector mounted on the housing at the output end thereof, and a coupled conductor in electrical communication with and extending between a forward coupling port connector mounted on the housing adjacent to the input end thereof and a reverse coupling port connector mounted on the housing adjacent to the output end thereof. Each of the slot, the main conductor and the coupled conductor has a cross-sectional area that varies depending upon where the cross-section is taken along the length of the housing.

COAXIAL DIRECTIONAL MICROWAVE COUPLER
20250266599 · 2025-08-21 · ·

A coaxial directional microwave coupler includes an outer conductor and a plurality of inner conductors at least partially surrounded by the outer conductor. The coaxial directional microwave coupler is implemented in accordance with specified equations, wherein Z.sub.0e and Z.sub.0o are desired design impedances, and K and K are complete elliptic integrals of a first kind. A method of implementing a coaxial directional microwave coupler includes at least partially surrounding a plurality of inner conductors by an outer conductor, and implementing the coaxial directional microwave coupler in accordance with specified equations, wherein Z.sub.0e and Z.sub.0o are desired design impedances, and K and K are complete elliptic integrals of a first kind.

Structural arrangements for spatial power-combining devices
12525696 · 2026-01-13 · ·

Power-combining devices and more particularly spatial power-combining and related structural arrangements are disclosed. Such structural arrangements involve mechanical connections between center waveguide sections and input and/or output coaxial waveguide sections that provide scalable structures for different operating frequency bands, improved mechanical connections, and/or improved assembly. Exemplary structural arrangements include structures that extend through center waveguide sections and into input and/or output coaxial waveguide sections, integrated mechanical structures within the center waveguide section, compression fit arrangements, dielectric inserts arranged within channels of coaxial waveguide sections, and/or various combinations thereof.

WIDEBAND DUAL DIRECTIONAL COUPLER
20260074408 · 2026-03-12 ·

Provided is a wide band dual directional coupler including: first, second, third, and fourth ports; a main transmission line connecting the first and second ports; a first coupling circuit unit outputting a first coupled signal for a signal input to the first port to the third port; and a second coupling circuit unit outputting a second coupled signal for a signal input to the second port to the fourth port. The first coupling circuit unit includes: a first coupled line acquiring a portion of a signal traveling from the first port to the second port; a first equalizer; and a first matching resistor connected to the first coupled line. The second coupling circuit unit comprises: a second coupled line acquiring a portion of a signal traveling from the second port to the first port; a second equalizer; and a second matching resistor connected to the second coupled line.