Patent classifications
H01Q1/241
Systems and methods for determining the optimal location for the installation of a reception antenna
A system for locating an optimal location of a reception antenna that has an unmanned aerial vehicle (UAV), a wireless internet service provider (WISP) tower configured for transmitting radio signals, and an antenna removably coupled to the unmanned aerial vehicle, the antenna configured for receiving the radio signals. Further, the system has a processor for automatically flying the UAV to a height, for rotating the unmanned aerial vehicle at the height and detecting the radio signals from the at least one WISP tower as the UAV rotates to determine an optimal azimuth, and if the radio signals received are not conducive for the provision of wireless services at the height, the processor moves the UAV to different heights and rotates the UAV until radio signals received are conducive for the provision of wireless services thereby determining an optimal azimuth and location altitude range for a reception antenna.
High tolerance connection between elements
This is directed to connecting two or more elements using an intermediate element constructed from a material that changes between states. An electronic device can include one or more components constructed by connecting several elements. To provide a connection having a reduced or small size or cross-section and construct a component having high tolerances, a material can be provided in a first state in which it flows between the elements before changing to a second state in which it adheres to the elements and provides a structurally sound connection. For example, a plastic can be molded between the elements. As another example, a composite material can be brazed between the elements. In some cases, internal surfaces of the elements can include one or more features for enhancing a bond between the elements and the material providing the interface between the elements.
Functional Housing Structure for an Electronic Device
A functional housing structure for an electronic device. The functional housing structure includes a first layer of dielectric material or meta material and an electronic circuitry arrangement. The electronic circuitry arrangement is at least partially embedded in the first layer, which is molded around the of the electronic circuitry arrangement.
NONRECIPROCAL AND RECONFIGURABLE PHASED-ARRAY ANTENNAS
A nonreciprocal phased-array antenna includes an array of resonant antennas a.sub.1, . . . , a.sub.n. During transmission, an outbound signal having a frequency f.sub.0 and a phase shift φ.sub.di caused by propagation through a data network feeds into each resonant antenna a.sub.i. Each resonant antenna a.sub.i upconverts the outbound signal using a modulation signal having a frequency f.sub.m and a phase shift φ.sub.mi caused by propagation through a modulation network to produce an upconverted radiated signal having a frequency f.sub.0+f.sub.m and a phase proportionate to φ.sub.di+φ.sub.mi. During reception, an inbound signal of frequency f.sub.0+f.sub.m is received at each resonant antenna a.sub.i and is downconverted using the modulation signal to produce a downconverted signal having a frequency f.sub.0 and a phase proportionate to −φ.sub.mi. After passing through the data network to the inbound port, the downconverted signal has a phase proportionate to φ.sub.di−φ.sub.mi.
ANTENNA STRUCTURE AND ELECTRONIC DEVICE COMPRISING SAME
The present disclosure relates to a 5.sup.th generation (5G) or pre-5G communication system for supporting higher data transmission rates than a 4.sup.th generation (4G) communication system such as long-term evolution (LTE). An antenna module in a wireless communication system includes: a printed circuit board (PCB); a radio frequency integrated circuit (RFIC); and a plurality of antenna elements for emitting a radio frequency (RF) signal, wherein the plurality of antenna elements may be disposed in a first area of a first surface of the PCB, and the RFIC may be disposed in a second area, different from the first area, of the first surface of the PCB.
GLASS ANTENNA
The present invention provides a glass antenna to be provided on a window glass of a vehicle, and the glass antenna includes a hot portion, a ground portion, and an antenna main body connected to the hot portion and the ground portion. The glass antenna is configured to receive radio waves with a frequency band of 600 MHz to 5 GHz.
HYBRID ANTENNA STRUCTURE
A hybrid antenna structure includes a first metal element, a second metal element, a third metal element, a cable, and a proximity sensor. The first metal element has a feeding point. The second metal element is adjacent to and separate from the first metal element. A coupling gap is formed between the second metal element and the first metal element. The third metal element is coupled to a connection point on the second metal element. The proximity sensor is coupled through the cable to the third metal element. The second metal element and the third metal element are used as both a sensing pad and a radiation element.
ANTENNA, WIRELESS COMMUNICATION MODULE, AND WIRELESS COMMUNICATION DEVICE
Provided is a novel antenna, wireless communication module, and wireless communication device. The antenna includes a first conductor, a second conductor, a third conductor, a fourth conductor, and a feed line. The second conductor faces the first conductor in a first direction. The third conductor is along the first direction, located between the first conductor and the second conductor, and configured to capacitively connect the first conductor and the second conductor. The fourth conductor is along the first direction, separated from the third conductor in a second direction intersecting the first direction, and electrically connected to the first conductor and the second conductor. The feed line is electrically connected to the third conductor. The antenna is bending deformable in cross-sectional views along the first direction and the second direction.
ANTENNA MODULE
An antenna module includes a first antenna radiator including a feeding terminal, a second antenna radiator, a first ground radiator, a second ground radiator and a capacitive element. The second antenna radiator is disposed on one side of the first antenna radiator, and a first gap is formed between a main portion of the second antenna radiator and the first antenna radiator. The first ground radiator is disposed on another side of the first antenna radiator, and a second gap is formed between the first antenna radiator and the first antenna radiator. The second ground radiator is disposed between the second antenna radiator and the first ground radiator, and a third gap is formed between the second ground radiator and a first branch of the second antenna radiator. The capacitive element is disposed on the third gap and connects the second antenna radiator and the second ground radiator.
Scanning antenna and method for manufacturing scanning antenna
A scanning antenna includes a transmission and/or reception region including a plurality of antenna units and a non-transmission and/or reception region other than the transmission and/or reception region. The scanning antenna includes a TFT substrate, a slot substrate, a liquid crystal layer, a seal portion surrounding the liquid crystal layer, a wall structure (additional seal portion) disposed in a region surrounded by the seal portion in the non-transmission and/or reception region, a reflective conductive plate, a first spacer structure defining a first gap between a first dielectric substrate and a second dielectric substrate in the transmission and/or reception region, and a second spacer structure disposed in the wall structure and defining a second gap wider than the first gap. The wall structure includes a first main side face and a second main side face that intersect a surface of the first dielectric substrate, and at least one of the first main side face and the second main side face includes a plurality of recessed portions and/or a plurality of protruding portions when viewed from a normal direction of the first dielectric substrate.