A low profile phased array antenna that is configured to be manufactured using additive manufacturing techniques is provided. In one or more embodiments, the phased array can include a plurality of signal ears, ground ears, and clustered pillars that can be arranged in relation to a base plate such that each component of the antenna can be manufactured from a single piece of material, thereby allowing for the use of additive manufacturing techniques which can substantially reduce the cost and time of the manufacturing process. The phased array can include a signal ear that include one or more posts that interface with an airgap located within a base plate of the array, wherein the size of the airgap in relation to the size of the post is configured to achieve an optimal level of impedance matching.

A low profile phased array antenna that is configured to be manufactured using additive manufacturing techniques is provided. In one or more embodiments, the phased array can include a plurality of signal ears, ground ears, and clustered pillars that can be arranged in relation to a base plate such that each component of the antenna can be manufactured from a single piece of material, thereby allowing for the use of additive manufacturing techniques which can substantially reduce the cost and time of the manufacturing process. The phased array can include a signal ear that include one or more posts that interface with an airgap located within a base plate of the array, wherein the size of the airgap in relation to the size of the post is configured to achieve an optimal level of impedance matching.

An antenna device for a vehicle, comprising: an antenna base that is attached to a predetermined site of a vehicle; an antenna case forming an accommodation space with the antenna base; a first antenna portion accommodated in the accommodation space and corresponding a first frequency band; and a second antenna portion accommodated in the accommodation space and corresponding a second frequency band lower than the first frequency band, wherein at least a portion of a region of the first antenna portion and at least a portion of a region of the second antenna portion overlap each other, wherein a limiting circuit is connected to a power feeding portion of at least one antenna portion of the first antenna portion and the second antenna portion, and wherein the limiting circuit limits transmission of signals with frequencies outside a frequency band corresponded by the antenna portion.

An antenna device for a vehicle, comprising: an antenna base that is attached to a predetermined site of a vehicle; an antenna case forming an accommodation space with the antenna base; a first antenna portion accommodated in the accommodation space and corresponding a first frequency band; and a second antenna portion accommodated in the accommodation space and corresponding a second frequency band lower than the first frequency band, wherein at least a portion of a region of the first antenna portion and at least a portion of a region of the second antenna portion overlap each other, wherein a limiting circuit is connected to a power feeding portion of at least one antenna portion of the first antenna portion and the second antenna portion, and wherein the limiting circuit limits transmission of signals with frequencies outside a frequency band corresponded by the antenna portion.

An antenna apparatus includes a circuit board and an antenna body. The antenna body includes a first radiator and a second radiator that are indirectly coupled. The first radiator comprises a first stub and a second stub that are opposite to, but do not touch each other to form a first gap, the first stub and the second stub are located on a first side edge of the circuit board, a second gap is configured between the first stub and the first side edge, and also between the second stub and the first side edge. The second radiator is located on the circuit board to form a third gap in-between. A vertical projection of the second radiator is located on the first surface. The first stub and the second stub are electrically connected to reference ground of the circuit board separately.

An antenna apparatus includes a circuit board and an antenna body. The antenna body includes a first radiator and a second radiator that are indirectly coupled. The first radiator comprises a first stub and a second stub that are opposite to, but do not touch each other to form a first gap, the first stub and the second stub are located on a first side edge of the circuit board, a second gap is configured between the first stub and the first side edge, and also between the second stub and the first side edge. The second radiator is located on the circuit board to form a third gap in-between. A vertical projection of the second radiator is located on the first surface. The first stub and the second stub are electrically connected to reference ground of the circuit board separately.

An impedance matching method for a low-profile ultra-wideband array antenna is provided. The method includes: connecting an arm of a balanced end of a hyperbolic microstrip balun in series with an open circuit line; directly coupling the open circuit line to a radiator layer; connecting another arm of the balanced end of the hyperbolic microstrip balun to the radiator layer via a metallized via hole, and welding an unbalanced end of the hyperbolic microstrip balun to a coaxial line, so that the coaxial line feeds a power to the antenna via the hyperbolic microstrip balun. In this method, the open circuit line is integrated between the hyperbolic microstrip balun and the radiator layer of the antenna to achieve an impedance matching of the ultra-wideband antenna and to simplify a structure of a matching circuit.

An impedance matching method for a low-profile ultra-wideband array antenna is provided. The method includes: connecting an arm of a balanced end of a hyperbolic microstrip balun in series with an open circuit line; directly coupling the open circuit line to a radiator layer; connecting another arm of the balanced end of the hyperbolic microstrip balun to the radiator layer via a metallized via hole, and welding an unbalanced end of the hyperbolic microstrip balun to a coaxial line, so that the coaxial line feeds a power to the antenna via the hyperbolic microstrip balun. In this method, the open circuit line is integrated between the hyperbolic microstrip balun and the radiator layer of the antenna to achieve an impedance matching of the ultra-wideband antenna and to simplify a structure of a matching circuit.

An electronic device having an antenna structure is disclosed. The antenna structure includes a substrate, a first radiating portion, a second radiating portion connected to the first radiating portion, a grounding portion, a shorting portion connected between the second radiating portion and the grounding portion, a third radiating portion, a first grounding extension portion connected between the third radiating portion and the grounding portion, and a first capacitive element coupled between a first section and a second section of the shorting portion. The coupling of the shorting portion, the first grounding extension portion, and the third radiating portion generates a first operating frequency band, and the coupling of the first radiating portion, the shorting portion, the first grounding extension portion, and the third radiating portion generates a second operating frequency band, which is higher than the first operating frequency band, through the matching of the first capacitive element.

A radiating system comprises a radiating structure, first and second external ports, and a radiofrequency system. The radiating structure comprises a ground plane layer including a connection point, a single radiation booster including a connection point, and a first internal port defined between the connection points of the single radiation booster and the ground plane layer. The first and second external ports each provide operation in at least one frequency band. The radiofrequency system includes a first port connected to the first internal port of the radiating structure, and second and third ports respectively connected to the first and second external ports.