An electronic device may be provided with first, second, and third antennas and a dock flex. A first feed terminal for the first antenna may be coupled to a second feed terminal for the second antenna over a first path. The first path may be coupled to ground over a second path. Tuning components may be interposed on the first and second paths. The third antenna may be patterned on a first portion of the dock flex. Front end components for the first antenna may be mounted to a second portion of the dock flex. The first and second portions may extend from a tail of the dock flex. The tail may be wrapped around a plastic support block to hold the second portion over the first portion. The plastic support block may have a snap hook clip that holds the second portion in place.

An antenna includes a radiator that is electrically coupled to a feed stalk having a common-mode rejection (CMR) filter therein. The CMR filter is configured to suppress common mode radiation from the radiator by providing a frequency dependent impedance to a pair of common mode currents within the feed stalk, which is sufficient to increase a return loss associated with the pair of common mode currents to a level of greater than −6 dB across a frequency range including a frequency of the common mode radiation.

An antenna includes a radiator that is electrically coupled to a feed stalk having a common-mode rejection (CMR) filter therein. The CMR filter is configured to suppress common mode radiation from the radiator by providing a frequency dependent impedance to a pair of common mode currents within the feed stalk, which is sufficient to increase a return loss associated with the pair of common mode currents to a level of greater than −6 dB across a frequency range including a frequency of the common mode radiation.

An electronic device may include a transmission line path having a signal conductor embedded in a substrate. A contact pad may be patterned on a surface of the substrate. A radio-frequency component may be mounted to the contact pad using solder. Multi-layer impedance matching structures may couple the signal conductor to the contact pad. The matching structures may include a set of via pads and a set of conductive vias coupled in series between the signal conductor and the contact pad. The area of the via pads may vary across the set of via pads and/or the aspect ratio of the conductive vias may vary across the set of conductive vias. The matching structures may perform impedance matching between the signal conductor and the radio-frequency component at frequencies greater than 10 GHz while occupying a minimal amount of space in the device.

An electronic device may include a transmission line path having a signal conductor embedded in a substrate. A contact pad may be patterned on a surface of the substrate. A radio-frequency component may be mounted to the contact pad using solder. Multi-layer impedance matching structures may couple the signal conductor to the contact pad. The matching structures may include a set of via pads and a set of conductive vias coupled in series between the signal conductor and the contact pad. The area of the via pads may vary across the set of via pads and/or the aspect ratio of the conductive vias may vary across the set of conductive vias. The matching structures may perform impedance matching between the signal conductor and the radio-frequency component at frequencies greater than 10 GHz while occupying a minimal amount of space in the device.

An antenna apparatus includes first and second antennas. First and second radiating elements include parallel extending portions. A first coil is connected between the first radiating element and a first feed circuit connection portion. A second coil is connected between the second radiating element and a ground conductor. The first and second coils are coupled to each other in additive polarity. A phase adjustment circuit adjusts a phase difference between currents respectively flowing through the first and second radiating elements to greater than or equal to about 90 degrees and less than about 180 degrees in a communication frequency band of the second antenna. Where a frequency of a fundamental of the first radiating element is f1 and a frequency of a fundamental of the second radiating element is f2, f1>f2, and 3f2−f1>f1−f2 are satisfied.

An antenna apparatus includes first and second antennas. First and second radiating elements include parallel extending portions. A first coil is connected between the first radiating element and a first feed circuit connection portion. A second coil is connected between the second radiating element and a ground conductor. The first and second coils are coupled to each other in additive polarity. A phase adjustment circuit adjusts a phase difference between currents respectively flowing through the first and second radiating elements to greater than or equal to about 90 degrees and less than about 180 degrees in a communication frequency band of the second antenna. Where a frequency of a fundamental of the first radiating element is f1 and a frequency of a fundamental of the second radiating element is f2, f1>f2, and 3f2−f1>f1−f2 are satisfied.

RFID tag RFIC modules are provided with each module including an RFIC, an antenna connection first electrode, an antenna connection second electrode, an RFIC connection first electrode, an RFIC connection second electrode, an impedance matching circuit that matches impedance between the RFIC and an antenna, and a rectangular substrate. A first coil and a second coil of the impedance matching circuit are juxtaposed in/on the substrate, and a straight line passing through center of gravity of the coil opening of the first coil and center of gravity of the coil opening of the second coil is inclined with respect to one side of the substrate, and directions of this inclination are different between the first RFIC module and the second RFIC module.

RFID tag RFIC modules are provided with each module including an RFIC, an antenna connection first electrode, an antenna connection second electrode, an RFIC connection first electrode, an RFIC connection second electrode, an impedance matching circuit that matches impedance between the RFIC and an antenna, and a rectangular substrate. A first coil and a second coil of the impedance matching circuit are juxtaposed in/on the substrate, and a straight line passing through center of gravity of the coil opening of the first coil and center of gravity of the coil opening of the second coil is inclined with respect to one side of the substrate, and directions of this inclination are different between the first RFIC module and the second RFIC module.

A radiating system of a wireless device transmits and receives electromagnetic wave signals in a frequency region and comprises an external port, a radiating structure, and a radiofrequency system. The radiating structure includes: a ground plane layer with a connection point; a radiation booster with a connection point and being smaller than 1/30 of a free-space wavelength corresponding to a lowest frequency of the frequency region; and an internal port between the radiation booster connection point and the ground plane layer connection point. The radiofrequency system includes: a first port connected to the radiating structure's internal port; and a second port connected to the external port. An input impedance at radiating structure's disconnected internal port has a non-zero imaginary part across the frequency region. The radiofrequency system modifies impedance of the radiating structure to provide impedance matching to the radiating system within the frequency region at the external port.