A terminal device is provided. The terminal device includes a feed, a metal frame, and a radiating patch. At least two grooves are disposed on an outer surface of the metal frame, two through-holes are disposed in each groove, the radiating patch is disposed in each groove, the metal frame is grounded, two antenna feeding points are disposed on each radiating patch, the feed is connected to one feeding point through one through-hole, the antenna feeding points in each groove are in a one-to-one correspondence with the through-holes, and each radiating patch is insulated from the groove by using a non-conducting material.

An antenna arrangement is provided that includes a patch radiator, a feed arrangement, for the patch radiator and a cavity for the feed arrangement. The feed arrangement includes a slot in a conductive layer located between the patch radiator and the cavity.

The disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. An antenna module is provided. The antenna module includes a flexible printed circuit board (FPCB) including a first surface directed in a first direction and a second surface directed in a second direction that forms a predetermined first angle with respect to the first direction, a first antenna deployed on one surface of the first surface, and a second antenna deployed on one surface of the second surface.

An antenna device (10) includes a substrate (100) including a first surface (102), a first antenna (200) provided on the substrate (100), a second antenna (300) provided on the substrate (100), and a third antenna (400) provided on the first surface (102) of the substrate (100), and a center point (CP) of the third antenna (400) is positioned on the same side as an end portion (EP2) of the second antenna (300) furthest from the first antenna (200), relative to a center line (CL) passing through a center of a line (L) connecting an end portion (EP1) of the first antenna (200) furthest from the second antenna (300) and the end portion (EP2) of the second antenna (300) furthest from the first antenna (200), or relative to a center line (CL) of the first surface (102) of the substrate (100).

An antenna array that utilizes ground guard rings and metamaterial structures is disclosed. In certain embodiments, the antenna array is constructed from a plurality of antenna unit cells, wherein each antenna unit cell is identical. The antenna unit cell comprises a top surface, that contains a patch antenna and a ground guard ring. A reactive impedance surface (RIS) layer is disposed beneath the top surface and contains the metamaterial structures. The metamaterial structures are configured to present an inductance to the patch antennas, thereby allowing the patch antennas to be smaller than would otherwise be possible. In some embodiments, the metamaterial structures comprise hollow square frames. An antenna array constructed using this antenna unit cell has less coupling than conventional antenna arrays, which results in better performance. A ground skirt surrounds the perimeter of the antenna array to improve radiation phase pattern balance within the array.

An antenna array that utilizes ground guard rings and metamaterial structures is disclosed. In certain embodiments, the antenna array is constructed from a plurality of antenna unit cells, wherein each antenna unit cell is identical. The antenna unit cell comprises a top surface, that contains a patch antenna and a ground guard ring. A reactive impedance surface (RIS) layer is disposed beneath the top surface and contains the metamaterial structures. The metamaterial structures are configured to present an inductance to the patch antennas, thereby allowing the patch antennas to be smaller than would otherwise be possible. In some embodiments, the metamaterial structures comprise hollow square frames. An antenna array constructed using this antenna unit cell has less coupling than conventional antenna arrays, which results in better performance. Furthermore, this new antenna array also requires less space than conventional antenna arrays.

Systems and methods relating to patch antennas. A patch antenna has a substrate, a resonant metal plate at one side of the substrate, and a ground plane at the other opposite side of the substrate. Two feed pins are used to couple the antenna to other circuitry. The feed pins pass through the substrate and holes in at the ground plane. The feed pins are physically disconnected from both the resonant metal plate and the ground plane. The feed pins are capacitively coupled to the resonant metal plate to provide an electronic connection between other circuitry and the patch antenna.

Embodiments described herein may be related to apparatuses, processes, and techniques related to contactless transmission within a package that combines radiating elements with vertical transitions in the package, in particular to a waveguide within a core of the package that is surrounded by a metal ring. A radiating element on one side of the substrate core and above the waveguide surrounded by the metal ring communicates with another radiating element on the other side of the substrate core and below the waveguide surrounded by the metal ring. Other embodiments may be described and/or claimed.

An electronic device may have an antenna embedded in a substrate. The substrate may have first layers, second layers on the first layers, and third layers on the second layers. The antenna may include a first patch on the first layers that radiates in a first band, a second patch on the second antenna layers that radiates in a second band, and a parasitic patch on the third layers. A short path may couple ground to a location on the first patch that allows the first patch to form a ground extension in the second band for the second patch without affecting performance of the first patch in the first band. The first layers may have a higher dielectric permittivity than the second and third layers to minimize the thickness of the substrate without requiring a separate dielectric loading layer over the substrate.

An electronic device may be provided with a phased antenna array on an antenna module. The array may include low band antennas and high band antennas that radiate at frequencies greater than 10 GHz. The module may include antenna layers, transmission line layers, and ground traces that separate the antenna layers from the transmission line layers. The low band antennas and the high band antennas may have radiators patterned onto the antenna layers. The radiators may be fed by transmission lines on the transmission line layers. The antenna layers may have a dielectric permittivity that is greater than the dielectric permittivity of the transmission line layers. This may serve to reduce the lateral footprint of the low band and high band antennas, which allows the antennas to be interleaved along a common linear axis in the phased antenna array, thereby minimizing the lateral footprint of the antenna module.