A scanning antenna includes a transmission and/or reception region including a plurality of antenna units and a non-transmission and/or reception region other than the transmission and/or reception region. The scanning antenna includes a TFT substrate, a slot substrate, a liquid crystal layer provided between the TFT substrate and the slot substrate, a seal portion provided in the non-transmission and/or reception region and surrounding the liquid crystal layer, and a reflective conductive plate disposed opposing a second main surface of a second dielectric substrate with a dielectric layer interposed between the reflective conductive plate and the second main surface. The slot electrode includes an opening or a recessed portion formed in the non-transmission and/or reception region and in the region surrounded by the seal portion.

An antenna assembly has a dielectric substrate. A plurality of end fire antennas in a Yagi-Uda configuration is positioned around edges of the dielectric substrate.

An antenna module (1) according to the present disclosure has a dielectric substrate (20), an array antenna (10) including a plurality of patch antennas (111), an RFIC (40) electrically connected to the plurality of patch antennas (111), a signal conductor post (131) electrically connected to the RFIC (40), and a ground conductor post (132) set at a ground potential. The ground conductor post (132) is arranged, when viewed from a direction perpendicular to a first main surface of the dielectric substrate (20), between the signal conductor post (131) and a first side surface closest to the signal conductor post (131) of the dielectric substrate (20) in a polarizing direction of radio frequency signals to be emitted or received by the plurality of patch antennas (111).

Disclosed herein is an antenna module that includes solder balls provided on a surface of the element body having an antenna element. The solder balls include a signal ball disposed at an intersection between the second row virtual line and the second column virtual line and first to fourth ground balls disposed, out of a plurality of intersections between the first to third row virtual lines and the first to third column virtual lines, at any of intersections other than those at which the signal ball is disposed. No solder ball is disposed, out of the intersections between the plurality of row and column virtual lines, at least at some of the plurality of intersections other than those at which the first signal ball or first to fourth ground balls are disposed.

An electromagnetic bandgap (EBG) structure for improving isolation characteristics between antennas of a MIMO antenna array. The structure includes an EBG unit cell formed on a metal layer over a composite dielectric substrate and over a ground plane. The ground plane may include a defected ground structure to further improve isolation, and another metal layer including a substrate integrated waveguide may be included at an interface of the composite dielectric substrate.

A liquid crystal antenna and a method for forming a liquid crystal antenna are provided. The liquid crystal antenna includes a first substrate; a second substrate opposite to the first substrate; and a liquid crystal layer disposed between the first substrate and the second substrate. A first conductive layer is disposed on a side of the first substrate facing toward the second substrate; a second conductive layer is disposed on a side of the second substrate facing toward the first substrate; the second conductive layer at least includes a plurality of radiation electrodes; an external metal layer is disposed on a side of the first substrate facing away from the liquid crystal layer; and the external metal layer is connected to a fixed potential.

An antenna assembly is provided. The antenna assembly includes a first flexible printed circuit board (FPCB) for multiple first antennas, a second flexible printed circuit board (FPCB) for multiple second antennas, a metal plate including multiple holes, a first adhesive material layer for bonding between the metal plate and the first FPCB, and a second adhesive material layer for bonding between the metal plate and the second FPCB, wherein the metal plate is disposed such that the multiple first antennas are located in the multiple holes, respectively and the multiple second antennas to be located in the multiple holes, respectively.

A light-transmitting antenna includes a substrate, a first and a second conductive pattern. The first and the second conductive pattern is disposed on a first and a second surface of the substrate respectively. The first conductive pattern includes a first feeder unit, a first and a second radiation unit, a first and a second coupling unit and a first parasitic unit. The first feeder unit is connected to the second radiation unit. The first and the second radiation unit are located between the first and the second coupling unit. One side and the other side of the first parasitic unit is connected to the second coupling unit and adjacent to the first coupling unit respectively. The second conductive pattern includes a second feeder unit, a third coupling unit, a second parasitic unit, and a fourth coupling unit.

Disclosed herein is an antenna module that includes a ground pattern, a radiation electrode disposed on the ground pattern, a feed electrode disposed between the ground pattern and the radiation electrode, and a ground conductor surrounding the radiation electrode and feed electrode in a plan view. The planar size of the radiation electrode is smaller than the planar size of the feed electrode.

Disclosed herein is an antenna module that includes first and second signal pads, an antenna element, and first and second filters. The first signal pad is coupled to the antenna element through the first to fourth conductor patterns of the first filter. The second signal pad is coupled to the antenna element through the fifth to eighth conductor patterns of the first filter. The second, third, sixth and seventh conductor patterns extend along the diagonal line of the antenna element. The second and sixth conductor patterns face each other with the diagonal line interposed therebetween. The third and seventh conductor patterns face each other with the diagonal line interposed therebetween. The first, fourth, fifth and eighth conductor patterns extend in the second direction, respectively with respect to the second, third, sixth and seventh conductor patterns.