A dipole antenna is disclosed. The dipole antenna includes a first arm, a second arm, and a first conductive plate. The first conductive plate is placed inside one of the first arm or the second arm. The first conductive plate creates a cavity inside the one of the first arm or the second arm.

An antenna apparatus includes a first radiation area, a phase adjustment area and a second radiation area. The first radiation area is disposed opposite to the second radiation area. The first radiation area is connected to one end of the phase adjustment area. The other end of the phase adjustment area is connected to the second radiation area. The first radiation area includes a feeding point of the antenna apparatus. The second radiation area includes a ground point of the antenna apparatus. The phase adjustment area is used to adjust a phase of a signal fed by the feeding point, to change a direction of a space electromagnetic field formed by an electromagnetic signal radiated by each of the first radiation area and the second radiation area.

An article is provided with a wireless communication device that is constructed to be attached to the article without using an adhesive. The article with the wireless communication device includes a wireless IC chip, a power feeding circuit board including a terminal electrode to which the wireless IC chip is connected, an article, and a conductive thread for attaching the power feeding circuit board to the article. The conductive thread contacts the terminal electrode and functions as a radiator while the power feeding circuit board is attached to the article.

A device, comprising: an antenna array provided with a plurality of antennas each having a semiconductor layer having terahertz-wave gain; and a coupling line for mutual frequency-locking of at least two of the antennas at a frequency of the terahertz-wave, wherein the coupling line is connected to a shunt device, and the shunt device is connected in parallel to the semiconductor layer of each of the two antennas.

A device, comprising: an antenna array provided with a plurality of antennas each having a semiconductor layer having terahertz-wave gain; and a coupling line for mutual frequency-locking of at least two of the antennas at a frequency of the terahertz-wave, wherein the coupling line is connected to a shunt device, and the shunt device is connected in parallel to the semiconductor layer of each of the two antennas.

An RFID integrated circuit, in addition to having conductive pads to electrically couple to an antenna, may also include a conductive bridge configured to electrically connect different portions of the antenna together. In some embodiments, the conductive bridge may be used to form a multi-turn antenna segment.

A vibration transducer for sensing vibrations includes a first flexible triboelectric member, a second flexible triboelectric member, a plurality of attachment points, a first electrode and a second electrode. The first flexible triboelectric member includes a first triboelectric layer and a material being on a first position on a triboelectric series. A conductive layer is deposited on the second side thereof. The second flexible triboelectric member includes a second triboelectric layer and a material being on a second position on the triboelectric series that is different from the first position on the triboelectric series. The second triboelectric member is adjacent to the first flexible triboelectric member. When the first triboelectric member comes into and out of contact with the second triboelectric member as a result of the vibrations, a triboelectric potential difference having a variable intensity corresponding to the vibrations can be sensed between the first and second triboelectric members.

Implementations of antennas may include a meandering T-matching structure, a first meandering feed line coupled to the meandering T-matching structure, and a first radiating part coupled to the first meandering feed line. Implementations may include a second meandering feed line coupled to the meandering T-matching structure, and a second radiating part coupled to the meandering feed line. A gap may physically separate the first meandering feed line and the second meandering feed line.

Implementations of antennas may include a meandering T-matching structure, a first meandering feed line coupled to the meandering T-matching structure, and a first radiating part coupled to the first meandering feed line. Implementations may include a second meandering feed line coupled to the meandering T-matching structure, and a second radiating part coupled to the meandering feed line. A gap may physically separate the first meandering feed line and the second meandering feed line.

An IC tag according to the present invention includes: an IC chip (2); a dipole antenna (3) for electrically transmitting and receiving information stored in the IC chip (2); and a sheet-shaped substrate (1) that supports the IC chip (2) and the dipole antenna (3). In this IC tag, 0.1R/L2.5 is satisfied, where R is a resistance value between two ends (S1, S2) of the dipole antenna (3) and L is a length of a path that connects the two ends (S1, S2) of the dipole antenna (3) while extending along the dipole antenna (3) without passing through the IC chip (2).