An electric component socket in which a first electric component is housed in a first plate, a second plate is disposed to face the second electric component, a third plate is disposed at a middle position between the first and the second plates, and a plurality of electric contacts are used to electrically connect the first and second electric components, the electric contact includes: a spring part that is inserted into an insertion hole in the third plate; first and second contact parts extending from both terminals of the spring part, and inserted into insertion holes in the first and second plates to be in contact with electrodes of the first and second electric components.

An electrical connector that has a housing, a contact carrier slidably coupled to the housing, at least one spring member received inside of the housing and adjacent the contact carrier for abutment with the contact carrier, and an interposer received in the receiving end of the contact carrier and remote from the spring member. The contact carrier is slidable with respect to the housing along a mating axis between unmated and mated positions.

A test socket (14) for a testing an integrated circuit (12) with controlled impedance while maintaining the structural integrity of the test pins (20). The pin (20) can have a sidewall with a thick portion 32 and a thinner portion (30) along the length of the pin. The pin can have projections (42) which provide a standoff from the slot (40). The sidewalls themselves can have projections or lands (60, 61) which extend into the slot and provide stability for the pin (20).

A connection device to which a relay connector is applied includes relay terminals that have first connection portions capable of being elastically deformed along a first direction, second connection portions capable of being elastically deformed along the first direction, and coupling portions connecting the first and second connection portions, and are formed integrally with the first and second connection portions, and the coupling portions, and a holding unit that holds the relay terminal and has reaction force receiving portions supporting the coupling portions with such positional relation that first counterpart terminals are capable of being connected to the first connection portions from one side in the first direction and second counterpart terminals are capable of being connected to the second connection portions from the other side in the first direction and receiving reaction forces with elastic deformation of the first and second connection portions.

Connectors with a staggered pin orientation can reduce crosstalk amongst signal pins. In one example, a connector to couple a card or module to a motherboard includes connector housing and a plurality of pins. Each of the plurality of pins includes two ends including a card or module-facing end to couple with the card or module and a motherboard-facing end to couple with the motherboard. Each of the plurality of pins includes a middle section in the connector housing. One or both of the ends include one or more bends relative to the middle section. The plurality of pins includes alternating signal pins and ground pins, wherein the signal pins having an opposite orientation relative to the ground pins.

A socket connector includes a substrate having an upper surface and a lower surface. The substrate has a ground plane between the upper surface and the lower surface. The substrate includes contact channels between the upper and lower surfaces. The socket connector includes socket contacts received in corresponding contact channels. Each socket contact includes a contact body, an upper mating element, and a lower mating element. The upper mating element is deflectable relative to the contact body and extends to the upper surface to interface with a first electrical component. The lower mating element is deflectable relative to the contact body and extends to the lower surface to interface with a second electrical component. A plurality of the socket contacts are electrically connected to the ground plane.

An electrical contact test assembly that has a small size, a very low inductance, is able to handle high frequency and high current testing, and one that is easy to assemble, handle and maintain. An electrical contact assembly that comprises a shorter length of contact achieved by sandwiching an inner holder in between two rows of contacts and keeping them together via an adhesive between each of the two rows of contacts and the inner holder. In this way, very small sizes of contacts are more easily assembled and handled. The low inductance then allows for high frequency testing. An electrical contact assembly that comprises a one-piece contact without the complexity of other designs such as screws, springs, etc, allowing higher currents and tri-temperature testing.

The present invention provides for a method and structure for forming three-dimensionally routed dielectric wires between discrete points on the two or more parallel circuit planes. The wires may be freely routed in three-dimensional space as to create the most efficient routing between the two arbitrarily defined points on the two or more parallel circuit planes. Metalizing the outer surfaces of these three dimensional dielectric wires electrically coupling the discrete wires to their respective discrete contact points. Two or more of these wires may be in intimate contact to one another electrically coupling to each other as well as to two or more discrete contact pads. These electrically coupled contact pads may be on opposite sides or on the same side of the structure and the formed metalized wires may originate on one side and terminate on the other or originate and terminate from the same side.

The present invention provides for a method and structure for forming three-dimensionally routed dielectric wires between discrete points on the two or more parallel circuit planes. The wires may be freely routed in three-dimensional space as to create the most efficient routing between the two arbitrarily defined points on the two or more parallel circuit planes. Metalizing the outer surfaces of these three dimensional dielectric wires electrically coupling the discrete wires to their respective discrete contact points. Two or more of these wires may be in intimate contact to one another electrically coupling to each other as well as to two or more discrete contact pads. These electrically coupled contact pads may be on opposite sides or on the same side of the structure and the formed metalized wires may originate on one side and terminate on the other or originate and terminate from the same side.

Various aspects are related to a connector, e.g., for connecting two boards with one another. The connector may include a housing and a plurality of pins. The housing may include a first housing surface and a second housing surface opposite the first housing surface. Each pin of the plurality of pins may include a first portion protruding arcuately from the first housing surface and a second portion protruding arcuately from the second housing surface.