Methods and systems for providing crosstalk compensation in a jack are disclosed. According to one method, the crosstalk compensation is adapted to compensate for undesired crosstalk generated at a capacitive coupling located at a plug inserted within the jack. The method includes positioning a first capacitive coupling a first time delay away from the capacitive coupling of the plug, the first capacitive coupling having a greater magnitude and an opposite polarity as compared to the capacitive coupling of the plug. The method also includes positioning a second capacitive coupling at a second time delay from the first capacitive coupling, the second time delay corresponding to an average time delay that optimizes near end crosstalk. The second capacitive coupling has generally the same overall magnitude but an opposite polarity as compared to the first capacitive coupling, and includes two capacitive elements spaced at different time delays from the first capacitive coupling.

Methods and systems for providing crosstalk compensation in a jack are disclosed. According to one method, the crosstalk compensation is adapted to compensate for undesired crosstalk generated at a capacitive coupling located at a plug inserted within the jack. The method includes positioning a first capacitive coupling a first time delay away from the capacitive coupling of the plug, the first capacitive coupling having a greater magnitude and an opposite polarity as compared to the capacitive coupling of the plug. The method also includes positioning a second capacitive coupling at a second time delay from the first capacitive coupling, the second time delay corresponding to an average time delay that optimizes near end crosstalk. The second capacitive coupling has generally the same overall magnitude but an opposite polarity as compared to the first capacitive coupling, and includes two capacitive elements spaced at different time delays from the first capacitive coupling.

An electronic device includes a printed circuit board, an integrated circuit, a connector, a choke module and a compensation module. The integrated circuit is disposed on the printed circuit board. The connector is disposed on the printed circuit board. The choke module is disposed on the printed circuit board and coupled between the integrated circuit and the connector. The compensation module is disposed on the printed circuit board and coupled between the choke module and the connector.

An electronic device includes a printed circuit board, an integrated circuit, a connector, a choke module and a compensation module. The integrated circuit is disposed on the printed circuit board. The connector is disposed on the printed circuit board. The choke module is disposed on the printed circuit board and coupled between the integrated circuit and the connector. The compensation module is disposed on the printed circuit board and coupled between the choke module and the connector.

The present disclosure relates to a telecommunications jack including a housing having a port for receiving a plug. The jack also includes a plurality of contact springs adapted to make electrical contact with the plug when the plug is inserted into the port of the housing, and a plurality of wire termination contacts for terminating wires to the jack. The jack further includes a circuit board that electrically connects the contact springs to the wire termination contacts. The circuit board includes a multi-zone crosstalk compensation arrangement for reducing crosstalk at the jack.

The present disclosure relates to a telecommunications jack including a housing having a port for receiving a plug. The jack also includes a plurality of contact springs adapted to make electrical contact with the plug when the plug is inserted into the port of the housing, and a plurality of wire termination contacts for terminating wires to the jack. The jack further includes a circuit board that electrically connects the contact springs to the wire termination contacts. The circuit board includes a multi-zone crosstalk compensation arrangement for reducing crosstalk at the jack.

A multicore cable-with-connector includes: a connector, which includes a first ground guard between first and second pads and connected to first and second central conductors on a first surface of a substrate and a second ground guard between third and fourth pads connected to third and fourth central conductors on a second surface. When viewed in a first direction, a projected image of the first guard overlaps 50% or more of projected images of first and second layered structures respectively composed of the first pad and portion of the first conductor and the second pad and portion of the second conductor, and a projected image of the second guard overlaps 50% or more of projected images of third and fourth layered structures respectively composed of the third pad and portion of the third central conductor and the fourth pad and portion of the fourth conductor.

A multicore cable-with-connector includes: a connector, which includes a first ground guard between first and second pads and connected to first and second central conductors on a first surface of a substrate and a second ground guard between third and fourth pads connected to third and fourth central conductors on a second surface. When viewed in a first direction, a projected image of the first guard overlaps 50% or more of projected images of first and second layered structures respectively composed of the first pad and portion of the first conductor and the second pad and portion of the second conductor, and a projected image of the second guard overlaps 50% or more of projected images of third and fourth layered structures respectively composed of the third pad and portion of the third central conductor and the fourth pad and portion of the fourth conductor.

Disclosed herein are various communications systems allowing for multiple contacts points between plug contacts in a communications plug and plug interface contacts (PICs) in a communications jack. In some disclosed implementations, a communications plug including a first and a second plug contact mated with a communications jack having a first and a second plug PIC may form a plurality of plug/jack interfaces. The plug/jack interfaces may form multiple current paths between the communications plug and the communications jack. When a signal propagates between the communications plug and the communications jack, it may be split in the communications plug between a first current path and a second current path, and recombined in the communications jack after traveling through the plurality of plug/jack interfaces.

Disclosed herein are various communications systems allowing for multiple contacts points between plug contacts in a communications plug and plug interface contacts (PICs) in a communications jack. In some disclosed implementations, a communications plug including a first and a second plug contact mated with a communications jack having a first and a second plug PIC may form a plurality of plug/jack interfaces. The plug/jack interfaces may form multiple current paths between the communications plug and the communications jack. When a signal propagates between the communications plug and the communications jack, it may be split in the communications plug between a first current path and a second current path, and recombined in the communications jack after traveling through the plurality of plug/jack interfaces.