Disclosed herein are sealed devices comprising a first glass substrate; a second glass substrate; an optional sealing layer between the first and second glass substrates; and at least one seal between the first and second glass substrates. The sealed devices may comprise at least one cavity containing at least one component chosen from laser diodes, light emitting diodes, organic light emitting diodes, quantum dots, and combinations thereof. Also disclosed herein are display devices comprising such sealed devices and methods for making sealed devices.

An optical element module which can adsorb a foreign matter and absorb moisture remaining in the module with use of a simple structure which does not require a complicated production process is provided. An optical element module (101) includes a sealed housing (11, 12) and an optical element 1 mounted in the sealed housing (11, 12), said optical element module (101) further including polyurethane (13) having self-adherence and a desired shape, the polyurethane (13) being fixed inside said optical element module (101) with use of the self-adherence of the polyurethane (13).

An optical module includes: an optical component; a base portion on which the optical component is mounted; a housing that includes sidewalls extending from the base portion in a height direction to surround the base portion; a cover member that defines, along with the housing, an accommodation space in which the optical component is disposed; and a resin for fixing the housing to the cover member. The cover member includes: an opposing surface that faces the base portion of the housing in the height direction; a first lateral cover surface extending along the height direction; and a second lateral cover surface extending in the height direction. The second lateral cover surface is disposed on an opposite side of the first lateral cover surface.

A high air-tightness device is provided with a bottom plate (1), a frame body wall (2) and a shell body cover (3). The materials of said parts are one and more of metal, glass and ceramic, and the junctions among the parts are sealed by extruding a hollow-core metal sealing ring (12) by thread. The device is provided with one and more of a window glass (17), a pipeline (10), a pipeline interface, an openable and closable valve (11), an electrode communicating inside with outside and a threaded opening, and the device is connected and sealed by extruding the hollow-core metal sealing ring using the internal or external threaded part to move straight or rotate; or the device is pre-sealing formed by one and more of a metal solder welding processing technique, a metal welding processing technique, a glass welding processing technique and a sintering ceramic formed processing technique. The materials of each part for isolating inside from outside during the sealing are one and more of metal, glass and ceramic. Vacuum, special gas and liquid can be sealed within the high air-tightness device for a long time. The high air-tightness device is easy to be opened and re-sealed, and has easy maintenance and low cost.

The present invention describes a method and apparatus for mounting a semiconductor disc laser (SDL). In particular there is described a cooling apparatus assembly (12) for mounting the semiconductor disc laser (1) the cooling apparatus assembly comprising a crystalline heat spreader (8) made of diamond, sapphire or SiC and optically contacted to the SDL (1). The apparatus further comprises a heatsink (13) made of copper and a recess (16) located on a first surface (15) of the heatsink. A pliable filler material (17) which may be In or an In alloy is provided within the recess (16) such that when a sealing plate (19) is fastened to the heatsink the SDL (1) is hermetically sealed within the recess. Hermetically sealing the SDL within the recess is found to significantly increase the lifetime of the device comprising the SDL. The heat sink (13) may be water cooled with pipes (14) delivering the water. In case the sealing plate (19) is made from for example Invar, it has an aperture (20).

In one embodiment, the method serves for producing semiconductor lasers and includes the following steps in the order indicated: A) applying a multiplicity of edge emitting laser diodes on a mounting substrate, B) applying an encapsulation element, such that the laser diodes are applied in each case in a cavity between the mounting substrate and the associated encapsulation element, C) operating the laser diodes and determining emission directions of the laser diodes, D) producing material damage in partial regions of the encapsulation element, wherein the partial regions are uniquely assigned to the laser diodes, E) collectively removing material of the encapsulation element, said material being affected by the material damage, with the result that individual optical surfaces for beam shaping arise for the laser diodes in the partial regions, and F) singulating to form the semiconductor lasers.

A laser device comprises a hermetic housing that has an interior and is made at least in part of printed circuit board material, a laser element located in the interior, and at least one inorganic layer which hermetically shields the interior from the printed circuit board material.

A laser device comprises a hermetic housing that has an interior and is made at least in part of printed circuit board material, a laser element located in the interior, and at least one inorganic layer which hermetically shields the interior from the printed circuit board material.

Data rate that can be supported by a photodetector can be limited by the aperture size of the photodetector. In some embodiments, the minimum aperture diameter can be about 30 um. This limitation is due, for example, to an inability of the optics to focus the beam to a smaller spot, and the mechanical tolerances of the assembly process. The techniques described in the present disclosure can reduce the optical spot size and improve on the mechanical tolerances that are achievable, thereby improving the photodetector and VCSEL manufacturing processes and systems. A photodetector or VCSEL system design with higher data rate and lower production cost can be achieved using the techniques described herein.

Embodiments of the disclosure provide an optical sensing system, an integrated transmitter module for the optical sensing system, and an optical sensing method performed using the optical sensing system. The exemplary optical sensing system includes an integrated transmitter module configured to emit an optical signal into an environment surrounding the optical sensing system. The integrated transmitter module includes a laser emitter, one or more driving integrated circuits, and one or more optics integrated into a chamber that is hermetically sealed. The optical sensing system further includes a photodetector configured to receive the optical signal reflected from the environment and convert the received optical signal to an electrical signal. The optical sensing system additionally includes a readout circuit configured to convert the electrical signal to a digital signal. The photodetector and the readout circuit are located outside the chamber enclosing the integrated transmitter module.