A semiconductor laser device is specified comprising an edge emitting semiconductor laser diode, which emits laser light along a horizontal direction during operation, a reflector element, which deflects a first part of the laser light in a vertical direction, while a second part of the laser light continues to propagate in the horizontal direction, and a detector element, which is arranged at least partly in a beam path of the second part of the laser light. An optoelectronic beam deflection element for a semiconductor laser device is furthermore specified.

A plurality of waveguide structures are formed in at least one silicon layer of a first member. The first member includes: a first surface of a first silicon dioxide layer that is attached to a second member that consists essentially of an optically transmissive material having a thermal conductivity less than about 50 W/(m.Math.K), and a second surface of material that was deposited over at least some of the plurality of waveguide structures. An array of phase shifters is formed in one or more layers of the first member. An array of temperature controlling elements are in proximity to the array of phase shifters.

An electronic package and a method for fabricating an electronic package are provided. An encapsulation layer encapsulates a first electronic component and a plurality of conductive pillars, and is defined with a reservation region and a removal region adjacent to the reservation region. A circuit structure is disposed on the encapsulation layer. The removal region and the circuit structure therewithin are removed for an optical communication element to protrude from a lateral surface of the encapsulation layer when the optical communication element is disposed on the circuit structure, so as to avoid a packaging material used in a subsequent process from being adhered to a protruding portion of the optical communication element.

An electronic package and a method for fabricating an electronic package are provided. An encapsulation layer encapsulates a first electronic component and a plurality of conductive pillars, and is defined with a reservation region and a removal region adjacent to the reservation region. A circuit structure is disposed on the encapsulation layer. The removal region and the circuit structure therewithin are removed for an optical communication element to protrude from a lateral surface of the encapsulation layer when the optical communication element is disposed on the circuit structure, so as to avoid a packaging material used in a subsequent process from being adhered to a protruding portion of the optical communication element.

A surface emitting laser device includes: a first semiconductor layer of a first conductive type; a second semiconductor layer including a first light reflecting layer of the first conductive type, a light generating layer, and a second light reflecting layer of a second conductive type, which are laminated in this order from a first semiconductor layer side; a laser diode structure partitioned in a plateau shape including a top surface by a removal portion in which the second semiconductor layer is dug down, and configured to emit a laser beam to the first semiconductor layer side; a first insulating layer formed inside the laser diode structure; and a second insulating layer covering the top surface.

In an embodiment a laser diode includes a surface emitting semiconductor laser configured to emit electromagnetic radiation and an optical element arranged downstream of the semiconductor laser in a radiation direction, wherein the optical element includes a diffractive structure or a meta-optical structure or a lens structure, wherein the optical element and the semiconductor laser are cohesively connected to each other, and wherein the semiconductor laser and the optical element are integrated with the laser diode.

A light source device includes: a base comprising a bottom portion and a peripheral wall portion; a semiconductor laser located on the bottom portion; a cap connected to an upper surface of the peripheral wall portion, wherein the cap and the base define a sealed space; a translucent portion located in the peripheral wall portion or the cap, the translucent portion being configured to transmit a beam emitted from the semiconductor laser; and first and second lead terminals located in the sealed space and crossing from a first inner surface of the peripheral wall portion to a second inner surface of the peripheral wall portion. The semiconductor laser is located between the two lead terminals. The translucent portion is located on an optical axis of the beam emitted from the semiconductor laser.

A light source device includes: a base comprising a bottom portion and a peripheral wall portion; a semiconductor laser located on the bottom portion; a cap connected to an upper surface of the peripheral wall portion, wherein the cap and the base define a sealed space; a translucent portion located in the peripheral wall portion or the cap, the translucent portion being configured to transmit a beam emitted from the semiconductor laser; and first and second lead terminals located in the sealed space and crossing from a first inner surface of the peripheral wall portion to a second inner surface of the peripheral wall portion. The semiconductor laser is located between the two lead terminals. The translucent portion is located on an optical axis of the beam emitted from the semiconductor laser.

An optical module includes: an optical component; a light receiving element receiving a laser beam through the optical component; a package housing the optical component and the light receiving unit; and a shielding portion that prevents stray light, which is generated by at least one of the laser beam and the laser beam emitted through the optical component is reflected or scattered in the package or at the optical component, from being incident on the light receiving element.

An optical module includes: an optical component; a light receiving element receiving a laser beam through the optical component; a package housing the optical component and the light receiving unit; and a shielding portion that prevents stray light, which is generated by at least one of the laser beam and the laser beam emitted through the optical component is reflected or scattered in the package or at the optical component, from being incident on the light receiving element.