A laser device includes a base plate, a plurality of light-emitting chips, a frame and a collimating lens group. The plurality of light-emitting chips are configured to emit laser beams. The laser beams emitted by the plurality of light-emitting chips each have a first axis and a second axis. The collimating lens group is disposed on a side of the frame away from the base plate, and includes a plurality of collimating lenses. The plurality of collimating lenses correspond to the plurality of light-emitting chips. The collimating lens is configured to reduce a divergence angle of the laser beam incident on the collimating lens, so as to make a reduction of the divergence angle of the laser beam passing through the collimating lens in the first axis less than a reduction of the divergence angle of the laser beam passing through the collimating lens in the second axis.

A laser device includes a base plate, a plurality of light-emitting chips, a frame and a collimating lens group. The plurality of light-emitting chips are configured to emit laser beams. The laser beams emitted by the plurality of light-emitting chips each have a first axis and a second axis. The collimating lens group is disposed on a side of the frame away from the base plate, and includes a plurality of collimating lenses. The plurality of collimating lenses correspond to the plurality of light-emitting chips. The collimating lens is configured to reduce a divergence angle of the laser beam incident on the collimating lens, so as to make a reduction of the divergence angle of the laser beam passing through the collimating lens in the first axis less than a reduction of the divergence angle of the laser beam passing through the collimating lens in the second axis.

A laser module can include: a laser chip having a plurality of laser diodes; a focusing lens optically coupled to each of the plurality of distinct laser diodes; and a photonic integrated circuit (PIC) having a plurality of optical inlet ports optically coupled to the plurality of laser diodes through the focusing lens. The laser module can include an optical isolator optically coupled to the focusing lens and PIC and positioned between the focusing lens and PIC. The laser chip can include a fine pitch laser array. The laser module can include a plurality of optical fibers optically coupled to an optical outlet port of the PIC. The laser module can include a hermetic package containing the laser chip and having a single focusing lens positioned for the plurality of laser diodes to emit laser beams there through.

There are provided a light emitting device capable of suitably forming light from a plurality of light emitting elements and a distance measuring device.

A light emitting device according to the present disclosure includes a substrate, a plurality of light emitting elements provided at a first surface of the substrate, and a plurality of lenses provided at a second surface of the substrate. The plurality of lenses includes a first lens other than a spherical lens and an ellipsoidal lens.

An optical fiber support structure includes: a first portion configured to support an optical fiber including a core wire and a covering surrounding the core wire, the core wire including a core and a cladding; a second portion attached to the first portion; and a relaxing portion that is connected to an end portion of the core wire and that is positioned between the first portion and the second portion, the relaxing portion having a light receiving surface configured to receive light input from a space, an area of the light receiving surface being larger than an area of the end portion of the core wire.

An optical fiber support structure includes: a first portion configured to support an optical fiber including a core wire and a covering surrounding the core wire, the core wire including a core and a cladding; a second portion attached to the first portion; and a relaxing portion that is connected to an end portion of the core wire and that is positioned between the first portion and the second portion, the relaxing portion having a light receiving surface configured to receive light input from a space, an area of the light receiving surface being larger than an area of the end portion of the core wire.

A device for cooling a laser diode pump comprising a Low Size Weight Power Efficient (SWAP) Laser Diode (LSLD) assembly, including a laser diode coupled to a submount on a first surface, the submount comprising a first thermally conductive material and a heatsink coupled to a second surface of the submount, wherein the heatsink comprises a second thermally conductive material, the heatsink comprising one or more members formed on a side opposite the coupled submount. The device further comprising a housing coupled to the LSLD assembly, the housing comprising a carrier structure having an aperture configured to support the LSLD assembly on a first side and having a plurality of channels on a second side, a bottom segment configured to couple to the carrier segment to create an enclosure around the channels between a top side of the bottom segment and the second side of the carrier structure, an inlet and outlet formed in the housing for transporting a coolant into and out of the channels in the enclosure, wherein the members are disposed within the enclosure so as to expose the members to the coolant.

A light emission device includes: a plurality of semiconductor light-emitting elements; an optical element configured to collimate light emitted from each of the plurality of semiconductor light-emitting elements and output a plurality of collimated beams; a converging portion having a surface of a hyperboloid or a paraboloid configured to converge the plurality of collimated beams; and a wavelength-converting portion including a transmissive region, and a reflective region that surrounds the transmissive region, the transmissive region including a light-incident surface at which the plurality of collimated beams that have been converged by the converging portion enter, wherein the transmissive region includes a phosphor adapted to be excited by the plurality of collimated beams that have been converged by the converging portion.

A light emission device includes: a plurality of semiconductor light-emitting elements; an optical element configured to collimate light emitted from each of the plurality of semiconductor light-emitting elements and output a plurality of collimated beams; a converging portion having a surface of a hyperboloid or a paraboloid configured to converge the plurality of collimated beams; and a wavelength-converting portion including a transmissive region, and a reflective region that surrounds the transmissive region, the transmissive region including a light-incident surface at which the plurality of collimated beams that have been converged by the converging portion enter, wherein the transmissive region includes a phosphor adapted to be excited by the plurality of collimated beams that have been converged by the converging portion.

A VCSEL illuminator module includes a module forming a physical cavity having electrical contacts positioned on an inner surface of the module that feed through the module to electrical contacts positioned on an outer surface of the module. A VCSEL device is positioned on the inner surface module and includes electrical contacts that are electrically connected to the electrical contacts on the inner surface of the module. The VCSEL device generates an optical beam when current is applied to the electrical contacts. An optical element is positioned adjacent to an emitting surface of the VCSEL device and is configured to modify the optical beam generated by the VCSEL device.