A phosphor integrated laser-based light source includes a thermally conductive material arranged on a package base adjacent to a laser diode chip and an optically transparent material coupled to the thermally conductive material. A groove extends between the thermally conductive material and the optically transport material and is aligned to receive electromagnetic radiation from the laser diode chip. A wavelength conversion material is coupled to the optically transparent material and is configured to receive at least a portion of the electromagnetic radiation emitted into the groove and transmitted through the optically transparent material. A reflective material surrounds sides of the optically transparent material and the wavelength conversion material.

A light source module includes a first semiconductor laser element hermetically sealed, a second semiconductor laser element hermetically sealed, and firth to fourth optical elements. A first laser beam prior to reaching the first optical element has divergence angle θfd1 in a direction along a second optical axis and divergence angle θsd1 in a direction along a third optical axis, and satisfy 90°>θfd1>θsd1>0°. Divergence angle θfd12 of a first laser beam in the direction along the second optical axis decreases from divergence angle θfd1, the first laser beam having exited the first optical element. A component of a first laser beam in the direction along the second optical axis is collimated, the first laser beam having exited the second optical element. The same applies to the second semiconductor laser element.

A light source module includes a first semiconductor laser element hermetically sealed, a second semiconductor laser element hermetically sealed, and firth to fourth optical elements. A first laser beam prior to reaching the first optical element has divergence angle θfd1 in a direction along a second optical axis and divergence angle θsd1 in a direction along a third optical axis, and satisfy 90°>θfd1>θsd1>0°. Divergence angle θfd12 of a first laser beam in the direction along the second optical axis decreases from divergence angle θfd1, the first laser beam having exited the first optical element. A component of a first laser beam in the direction along the second optical axis is collimated, the first laser beam having exited the second optical element. The same applies to the second semiconductor laser element.

An optical sensor package includes an emitter die mounted to an upper surface of a package substrate. A sensor die is mounted to the upper surface of the package substrate using a film on die (FOD) adhesive layer that extends over the upper surface and encapsulates the emitter die. The sensor die is positioned in a stacked relationship with respect to the emitter die such that a light channel region which extends through the sensor die is optically aligned with the emitter die. Light emitted by the emitter die passes through the light channel region of the sensor die. The emitter die and the sensor die are each electrically coupled to the package substrate.

Provided is a light emitting device including: a base material mounted on a wiring substrate; a light emitting element array provided on the base material; a first conductive pattern provided on the surface of the base material, the first conductive pattern including a first facing region connected to the light emitting element array, the first facing region being along a side surface of the light emitting element array and facing to the light emitting element array, and a first extending region extended beyond the first facing region; and penetrating members penetrating the base material from the first conductive pattern to a back surface side of the base material, each penetrating member being connected to the first facing region or the first extending region.

A package for at least one laser diode includes: leads configured to be electrically connected to the at least one laser diode; a base including a mounting surface on which the at least one laser diode is to be mounted and a lateral wall located around the mounting surface so as to surround the at least one laser diode, the lateral wall defining first through-holes and including a light-transmissive part configured to transmit a laser beam emitted from the at least one laser diode; and a lead holding member bonded to the lateral wall of the base and defining second through-holes. The leads are disposed through the first through-holes and the second through-holes. At least a central portion of each of the leads is made of copper.

A light emitting device includes: at least one semiconductor laser element; and a light-transmissive member including: an upper surface, a lower surface, and a light-transmissive region through which laser light emitted from the at least one semiconductor laser element is transmitted from the lower surface to the upper surface, wherein: at least the light-transmissive region is made of sapphire, the light-transmissive member includes an incident surface on which the laser light is incident, the incident surface being an a-plane of the sapphire, and the light-transmissive member is oriented such that a polarization direction of the laser light incident on the incident surface is parallel or perpendicular to a c-axis of the sapphire in a top view.

A light emitting device includes: at least one semiconductor laser element; and a light-transmissive member including: an upper surface, a lower surface, and a light-transmissive region through which laser light emitted from the at least one semiconductor laser element is transmitted from the lower surface to the upper surface, wherein: at least the light-transmissive region is made of sapphire, the light-transmissive member includes an incident surface on which the laser light is incident, the incident surface being an a-plane of the sapphire, and the light-transmissive member is oriented such that a polarization direction of the laser light incident on the incident surface is parallel or perpendicular to a c-axis of the sapphire in a top view.

A shutdown circuit may include a filter, for receiving a laser trigger signal for a laser emitter, that is configured to output a filtered signal. The shutdown circuit may include a logic gate configured to receive the filtered signal and at least one of a first signal based on a signal from a photodiode or a second signal based on a signal from a conductive path. The shutdown circuit may include a flip-flop configured to receive an output of the logic gate and to output an enablement signal that is based on the output of the logic gate, and a driver circuit for a switch configured to control current flow to the laser emitter. The driver circuit may be configured to receive the enablement signal and the laser trigger signal and to output the laser trigger signal based on whether the enablement signal is a first or a second voltage.

Packaged light emitter module can provide improved safety features to facilitate sensing the presence of moisture or a mechanical defect such as a crack in a transmissive cover (22) that may result in a safety hazard caused by the emitted light (24) if the defect or other situation is not addressed in a timely manner. Different electrically conductive structures, such as different electrically conductive traces (20, 22), allow monitoring and detection of mechanical defects to be decoupled from monitoring and detection of problems arising from the presence of moisture. The decoupling can allow the respective configuration for each of the electrically conductive structures to be optimized for detection of particular situations that may lead to a safety hazard.