A stem for a semiconductor package includes an eyelet including a flat plate having a first surface and a second surface opposite to the first surface, a cavity opening to the first surface of the flat plate, and a metal block protruding from the second surface of the flat plate, and a lead extending through the flat plate from the first surface to the second surface, wherein a volume of the metal block is substantially the same as a volume of the cavity.

A stem for a semiconductor package includes an eyelet including a flat plate having a first surface and a second surface opposite to the first surface, a cavity opening to the first surface of the flat plate, and a metal block protruding from the second surface of the flat plate, and a lead extending through the flat plate from the first surface to the second surface, wherein a volume of the metal block is substantially the same as a volume of the cavity.

An optical module includes an optical semiconductor element a stem including a signal pin and a ground pin; and a circuit board, the circuit board including a signal through-hole, a ground through-hole, a ground layer, and a junction part, the signal through-hole being configured to be pierced by the signal pin, the ground through-hole being configured to be pierced by the ground pin, the signal line being configured to be electrically connected with the signal pin, the ground layer being configured to be electrically connected with the ground pin, the junction part being configured to connect the assistance through-hole and the ground layer around the assistance through-hole with the stem. The circuit board has a first distance between the assistance through-hole and the signal through-hole, the first distance being smaller than a second distance between the ground through-hole and the signal through-hole.

An optical module includes an optical semiconductor element a stem including a signal pin and a ground pin; and a circuit board, the circuit board including a signal through-hole, a ground through-hole, a ground layer, and a junction part, the signal through-hole being configured to be pierced by the signal pin, the ground through-hole being configured to be pierced by the ground pin, the signal line being configured to be electrically connected with the signal pin, the ground layer being configured to be electrically connected with the ground pin, the junction part being configured to connect the assistance through-hole and the ground layer around the assistance through-hole with the stem. The circuit board has a first distance between the assistance through-hole and the signal through-hole, the first distance being smaller than a second distance between the ground through-hole and the signal through-hole.

An embodiment of a semiconductor package includes a leadframe having leads, a mold compound partly encasing the leadframe so that the leads protrude from the mold compound, a power transistor die attached to the leadframe at a first side of the leadframe, and a driver die attached to the leadframe at a second side of the leadframe opposite the first side so that the power transistor die and the driver die are disposed in a stacked arrangement. The driver die is configured to control the power transistor die. The driver die is in direct electrical communication with the power transistor die only through the leadframe and any interconnects which attach the power transistor die and the driver die to the leadframe. Corresponding methods of manufacturing the semiconductor package are also described.

A semiconductor laser device disclosed in this application is characterized; wherein one of the reflective surface and the secondary reflective surface is constituted by a dielectric multi-layer film that is formed on a PD chip for measuring a light quantity of the laser light; and wherein an inclination angle of the reflective surface is set to a value obtained by subtraction of a value that is less than an inclination angle of beam center, from 45 degrees, while an inclination angle of the secondary reflective surface is set to a value obtained by subtraction of a value that is more than the inclination angle of beam center, from 45 degrees.

A semiconductor laser device disclosed in this application is characterized; wherein one of the reflective surface and the secondary reflective surface is constituted by a dielectric multi-layer film that is formed on a PD chip for measuring a light quantity of the laser light; and wherein an inclination angle of the reflective surface is set to a value obtained by subtraction of a value that is less than an inclination angle of beam center, from 45 degrees, while an inclination angle of the secondary reflective surface is set to a value obtained by subtraction of a value that is more than the inclination angle of beam center, from 45 degrees.

An optical semiconductor device comprises: a first wiring pattern provided on a carrier mounting surface of a dielectric substrate; a first reference potential pattern surrounding the first wiring pattern; a carrier block provided on the carrier mounting surface and having a main surface, a side surface, and a second wiring pattern and a second reference potential pattern constituting coplanar lines; and an optical semiconductor element provided on the main surface. One end portion of the second wiring pattern extends to at least an end edge on the side surface side in the main surface and is conductively joined to the first wiring pattern with a conductive joining material therebetween. One end portion of the second reference potential pattern extends to at least the end edge on the side surface side in the main surface and is conductively joined to the first reference potential pattern with a conductive joining material therebetween.

An optical module includes: amounting substrate; a support block on which the mounting substrate is mounted; and a stem having a support surface to support the support block, the stem having a pedestal portion with a tip face in a protruding direction and with an upper surface spreading along the protruding direction; a relay board on the upper surface; a connection block fixed to the tip face; and wires connecting the support block and the mounting substrate to the connection block. The connection block has a surface made of a conductor. The connection block has a first bonding surface facing the same direction as the tip face of the pedestal portion and a second bonding surface facing the same direction as the upper surface. The wires include first and second wires having their ends bonded to the first and second bonding surface, respectively.

An optical module includes: amounting substrate; a support block on which the mounting substrate is mounted; and a stem having a support surface to support the support block, the stem having a pedestal portion with a tip face in a protruding direction and with an upper surface spreading along the protruding direction; a relay board on the upper surface; a connection block fixed to the tip face; and wires connecting the support block and the mounting substrate to the connection block. The connection block has a surface made of a conductor. The connection block has a first bonding surface facing the same direction as the tip face of the pedestal portion and a second bonding surface facing the same direction as the upper surface. The wires include first and second wires having their ends bonded to the first and second bonding surface, respectively.