The invention relates to an optoelectronic component comprising a housing, an optoelectronic semiconductor chip and an optical element. The housing comprises a lead frame which has two external electrical contact points and two contact portions. The housing also comprises a housing body in which the lead frame is embedded, wherein each contact portion extends laterally out of one of the external electrical contact points in each case to a mounting surface of the housing, and therefore contact surfaces of the contact portions are exposed on the mounting surface. An electrical contact structure of the optical element is electrically conductively connected to the contact surfaces of the contact portions.

An embodiment of a semiconductor package includes a leadframe having leads, a mold compound partly encasing the leadframe so that the leads protrude from the mold compound, a power transistor die attached to the leadframe at a first side of the leadframe, and a driver die attached to the leadframe at a second side of the leadframe opposite the first side so that the power transistor die and the driver die are disposed in a stacked arrangement. The driver die is configured to control the power transistor die. The driver die is in direct electrical communication with the power transistor die only through the leadframe and any interconnects which attach the power transistor die and the driver die to the leadframe. Corresponding methods of manufacturing the semiconductor package are also described.

A semiconductor laser device comprises a stem serving as a base; a laser diode LD submount having surface electrodes arranged thereon and joined to the surface of the stem; an LD chip joined to the surface electrode and connected with the surface electrode; and leads fixed in through holes formed in the stem by means of sealing parts and electrically connected to the surface electrodes via embedded layers in via holes formed in the LD submount, wherein grooves are formed in portions of the sealing parts or in portions of the LD submount around the connections between the leads and the embedded layers, to obtain a good modulated light waveform.

A semiconductor laser device comprises a stem serving as a base; a laser diode LD submount having surface electrodes arranged thereon and joined to the surface of the stem; an LD chip joined to the surface electrode and connected with the surface electrode; and leads fixed in through holes formed in the stem by means of sealing parts and electrically connected to the surface electrodes via embedded layers in via holes formed in the LD submount, wherein grooves are formed in portions of the sealing parts or in portions of the LD submount around the connections between the leads and the embedded layers, to obtain a good modulated light waveform.

An optical module includes: a conductive stem having first and second surfaces; some lead pins including a signal lead pin; a sub-mount substrate having an interconnection pattern; a photoelectric device mounted on the sub-mount substrate and electrically connected to the interconnection pattern; a dielectric block having a metallization pattern on a surface; and a signal wire electrically connecting the metallization pattern to the interconnection pattern. Each lead pin includes a shaft portion inside a corresponding one of the through holes, a first end portion projecting from the first surface, and a second end portion projecting from the second surface. The signal lead pin has the first end portion larger in diameter than the shaft portion. The dielectric block is opposed to and fixed to a tip face of the first end portion of the signal lead pin. The metallization pattern is electrically continuous to the tip face.

An optical module includes: a conductive stem having first and second surfaces; some lead pins including a signal lead pin; a sub-mount substrate having an interconnection pattern; a photoelectric device mounted on the sub-mount substrate and electrically connected to the interconnection pattern; a dielectric block having a metallization pattern on a surface; and a signal wire electrically connecting the metallization pattern to the interconnection pattern. Each lead pin includes a shaft portion inside a corresponding one of the through holes, a first end portion projecting from the first surface, and a second end portion projecting from the second surface. The signal lead pin has the first end portion larger in diameter than the shaft portion. The dielectric block is opposed to and fixed to a tip face of the first end portion of the signal lead pin. The metallization pattern is electrically continuous to the tip face.

A light source device includes: a base comprising a bottom portion and a peripheral wall portion; a semiconductor laser located on the bottom portion; a cap connected to an upper surface of the peripheral wall portion, wherein the cap and the base define a sealed space; a translucent portion located in the peripheral wall portion or the cap, the translucent portion being configured to transmit a beam emitted from the semiconductor laser; and first and second lead terminals located in the sealed space and crossing from a first inner surface of the peripheral wall portion to a second inner surface of the peripheral wall portion. The semiconductor laser is located between the two lead terminals. The translucent portion is located on an optical axis of the beam emitted from the semiconductor laser.

A light source device includes: a base comprising a bottom portion and a peripheral wall portion; a semiconductor laser located on the bottom portion; a cap connected to an upper surface of the peripheral wall portion, wherein the cap and the base define a sealed space; a translucent portion located in the peripheral wall portion or the cap, the translucent portion being configured to transmit a beam emitted from the semiconductor laser; and first and second lead terminals located in the sealed space and crossing from a first inner surface of the peripheral wall portion to a second inner surface of the peripheral wall portion. The semiconductor laser is located between the two lead terminals. The translucent portion is located on an optical axis of the beam emitted from the semiconductor laser.

A laser device includes: a semiconductor laser, at least one driver that supplies the semiconductor laser with a current; a modulator that modulates the current supplied to the semiconductor laser; and at least one electric line for conveying the current from at least one driver to the semiconductor laser. The at least one electric line is a wire in a form of a tape, and includes the first conductive layer, the second conductive layer, and the insulating layer which are extending in the longitudinal direction of the wire. The first conductive layer and the second conductive layer are stacked, with the insulating layer in between, in the direction of thickness of the wire.

Provided is a laser emitting circuit that causes a LD array including a plurality of LDs to simultaneously or sequentially emit pulsed laser light. The laser emitting circuit includes the plurality of laser diodes of which anodes are electrically connected to one another, switching elements that are electrically connected to cathodes of the respective laser diodes and control current flowing through each of the laser diodes, drive circuits that control the switching elements, and a series circuit in which a capacitor and a resistor are electrically connected in series. The series circuit has one end electrically connected to anode of the laser diodes and another end grounded. The laser emitting circuit further includes a laser diode power supply input terminal that is electrically connected to anodes of the plurality of laser diodes and is for supplying electric charge to the capacitor, a drive circuit power supply input terminal for supplying power to the drive circuits, and pulse signal input terminals that are electrically connected to the respective drive circuits and input a pulse signal.