Disclosed herein is a system comprising: an optical system with a focal plane; an apparatus at the focal plane; a filter; wherein the apparatus comprises an array of vertical-cavity surface-emitting lasers (VCSELs) on a first substrate and an array of detectors on a second substrate, the detectors configured to detect laser beams that are emitted by the VCSELs and backscattered by an object; wherein the first substrate is mounted to the second substrate and is configured to allow the laser beams that are emitted by the VCSELs and backscattered by the object to transmit through the first substrate and reach the detectors; wherein the filter is configured to prevent light other than the laser beams from passing.

A VCSEL projector and method for using the same are disclosed. In one embodiment, the apparatus comprises a vertical cavity surface emitting laser (VCSEL) array comprising a plurality of VCSELs; a micro-lens array coupled to the VCSEL array and having a plurality of lenses, and each of the plurality of lenses is positioned over a VCSEL in the VCSEL array; and a projection lens coupled to the micro-lens array (MLA), where light emitted by the VCSEL array is projected as a sequence of patterns onto an object by the projection lens.

A method, system, and article of efficient illuminator and camera sensor synchronization to capture images comprises generating a sequence of frames each associated with a captured image and comprising operating an electronic shutter using vertical-blanks (vblanks) occurring between the last reset of a previous frame and a first read of a current frame consecutively after the previous frame of the sequence of frames. The generating also comprises receiving, by at least one camera sensor, from at least one infra-red-related illuminator and limited to a time within or equal to the vblanks so that the illuminator is turned on and off at the same vblank, and sensing the received light at the camera sensor to convert the light into image data to form the frames in the sequence of frames.

A laser diode includes a semiconductor structure having an n-type layer, an active region, and a p-type layer. One of the n-type and p-type layers includes a lasing aperture thereon having an optical axis oriented perpendicular to a surface of the active region between the n-type and p-type layers. First and second contacts are electrically connected to the n-type and p-type layers, respectively. The first and/or second contacts are smaller than the lasing aperture in at least one dimension. Related arrays and methods of fabrication are also discussed.

A light-emitting device includes a light-emitting unit. The light-emitting unit includes an array of multiple light-emitting element groups, each including multiple light-emitting elements. In the light-emitting unit, the multiple light-emitting element groups are sequentially driven along the array such that, for each of the multiple light-emitting element groups, the multiple light-emitting elements included in the light-emitting element group are concurrently set to a state of emitting light or a state of not emitting light.

A laser array includes a plurality of laser emitters arranged in a plurality of rows and a plurality of columns on a substrate that is non-native to the plurality of laser emitters, and a plurality of driver transistors on the substrate adjacent one or more of the laser diodes. A subset of the plurality of laser emitters includes a string of laser emitters that are connected such that an anode of at least one laser emitter of the subset is connected to a cathode of an adjacent laser emitter of the subset. A driver transistor of the plurality of driver transistors is configured to control a current flowing through the string.

A laser diode includes a semiconductor structure having an n-type layer, an active region, and a p-type layer. One of the n-type and p-type layers includes a lasing aperture thereon having an optical axis oriented perpendicular to a surface of the active region between the n-type and p-type layers. First and second contacts are electrically connected to the n-type and p-type layers, respectively. The first and/or second contacts are smaller than the lasing aperture in at least one dimension. Related arrays and methods of fabrication are also discussed.

A printing system is disclosed which comprises a writing module, and a member having an imaging surface configured to carry a polymer and movable relative to the writing module. The writing module is configured to direct onto the imaging surface a plurality of individually controllable light beams that are spaced from one another in a direction transverse to the direction of movement of the imaging surface, incidence of a light beam on a spot on the imaging surface serving to soften or liquefy the polymer carried by the imaging surface at the spot. The polymer softened or liquefied at the spot can transfer to a substrate or serve as an adhesive on the imaging surface. The writing module comprises a plurality of integrated electronic modules each having an array of individually controllable light sources, each light source producing a respective one of the light beams. In the invention, each light source comprises at least two Vertical-Cavity Surface-Emitting Laser (VCSEL) light-emitting semiconductor junctions connected in series with one another and configured to direct light onto the imaging surface at the same spot as one another.

A printing system is disclosed which comprises a writing module, and a member having an imaging surface configured to carry a polymer and movable relative to the writing module. The writing module is configured to direct onto the imaging surface a plurality of individually controllable light beams that are spaced from one another in a direction transverse to the direction of movement of the imaging surface, incidence of a light beam on a spot on the imaging surface serving to soften or liquefy the polymer carried by the imaging surface at the spot. The polymer softened or liquefied at the spot can transfer to a substrate or serve as an adhesive on the imaging surface. The writing module comprises a plurality of integrated electronic modules each having an array of individually controllable light sources, each light source producing a respective one of the light beams. In the invention, each light source comprises at least two Vertical-Cavity Surface-Emitting Laser (VCSEL) light-emitting semiconductor junctions connected in series with one another and configured to direct light onto the imaging surface at the same spot as one another.

In some implementations, a vertical cavity surface emitting laser (VCSEL) device includes a substrate layer and a first set of epitaxial layers for a bottom-emitting VCSEL disposed on the substrate layer. The first set of epitaxial layers may include a first set of mirrors and at least one first active layer. The VCSEL device may include a second set of epitaxial layers for a top-emitting VCSEL disposed on the first set of epitaxial layers for the bottom-emitting VCSEL. The second set of epitaxial layers may include a second set of mirrors and at least one second active layer. The top-emitting VCSEL and the bottom-emitting VCSEL may be configured to emit light in opposite light emission directions.