An object of the invention is to suppress that resistance against vibrations is reduced, while reducing the number of components. A power conversion device according to the present invention includes: a power semiconductor module that converts a DC current into an AC current; a plate conductor that transfers the DC current or the AC current; a resin sealing material that seals the plate conductor; and an electric component that is used to control the power semiconductor module, wherein the resin sealing material includes a supporting member that supports the electric component, and wherein the plate conductor is buried in a portion of the resin sealing material that is disposed to face the electric component.

The present invention provides an adaptively modulated multi-state inverter system, comprising: a split capacitor, four bridge arms and an isolation switch group, on each of the four bridge arms a pair of complementary power switch groups is arranged; the isolation switch group comprises four fuses and six bidirectional thyristors. The output branches of the first bridge arm, the second bridge arm and the third bridge arm are respectively connected in series with a fuse to output a three-phase voltage, and at three-phase output voltage side two shared auxiliary branches are arranged, one auxiliary branch starts from the fourth bridge arm output branch on which a fuse is connected in series and is then connected to the output terminal of the three-phase voltage via three bidirectional thyristors. The other auxiliary branch starts from the DC side feed branch from the midpoint of the split capacitor, and is connected with the output terminal of the three-phase voltage via three bidirectional thyristors respectively. The invention also provides a modulating method of the multi-state inverter system. The use of the adaptive modulating technology enables the multi-state inverter to have the functions of overcurrent protection, isolation of faulty bridge arms and fault-tolerant control on any single and double bridges.

An induction heating generator includes a rectifier circuit (10). Four capacitors (C1, C2, C3, C4) form a bridge circuit between two output terminals of the rectifier circuit (10). The bridge circuit includes a first capacitor series (C1, C2) and a second capacitor series (C3, C4). An induction coil (L) is interconnected in the center of the bridge circuit. At least two semiconductor switches (S1, S2) are connected in each case parallel to one of the capacitors (C1, C2) of the first capacitor series (C1, C2). The induction heating generator includes a control circuit block (14, 16, 18, 20, 22) for controlling the control electrodes of the semiconductor switches (S1, S2). A shunt element (SE) is connected in series with the first capacitor series (C1, C2).

Switched capacitor multilevel inverter (SCMLI) configuration for high-frequency medium voltage applications is presented. A 5L-SCMLI basic configuration is further extended to 9L operation with a reduced number of active switches having self voltage boosting and balancing ability. Further, the proposed 9L-SCMLI is extended up to n level being considered as the basic configuration for the extension of horizontal extension (HE) and vertical extension (VE). A generalized switching table is provided for the proposed extensions. Design of the size of capacitor demonstrated for the proposed 9L-SCMLI.

A power conversion device comprises: a power conversion circuit that converts a supplied electric power; a current detection circuit that detects a current; a control circuit that controls an operation of the power conversion circuit; and a multilayer substrate that is provided with the power conversion circuit, the current detection circuit, and the control circuit. The multilayer substrate includes a printed wiring, and the printed wiring includes a transmission pattern that transmits a detection signal detected by the current detection circuit to the control circuit. An on-off fluctuation unit of the power conversion circuit fluctuates. The whole of the transmission pattern is disposed at a position different from the on-off fluctuation unit in a direction perpendicular to a plate surface of the multilayer substrate.

A power conversion device comprises: a power conversion circuit that converts a supplied electric power; a current detection circuit that detects a current; a control circuit that controls an operation of the power conversion circuit; and a multilayer substrate that is provided with the power conversion circuit, the current detection circuit, and the control circuit. The multilayer substrate includes a printed wiring, and the printed wiring includes a transmission pattern that transmits a detection signal detected by the current detection circuit to the control circuit. An on-off fluctuation unit of the power conversion circuit fluctuates. The whole of the transmission pattern is disposed at a position different from the on-off fluctuation unit in a direction perpendicular to a plate surface of the multilayer substrate.

An electronic circuit has an output node that outputs a DC signal indicating a temporal change rate of a voltage of a measurement target node, a first capacitor and a first resistor that are connected in series between the measurement target node and a first reference voltage node, a second capacitor that is connected between the output node and a second reference voltage node, a first switch that switches whether or not to short-circuit the first reference voltage node and the output node, and a rectifier circuit that flows a current to a connection node between the first capacitor and the first resistor from the output node, and cuts off a current to the output node from the connection node.

An alternating current (AC)-side symmetrically-split single-phase inverter for decoupling, which includes an H-bridge inverter, the H-bridge inverter includes an upper half-bridge structure and a lower half-bridge structure that are symmetrical to each other, the upper half-bridge structure includes an upper half-bridge first unit and an upper half-bridge second unit in parallel, the upper half-bridge first unit includes an insulated-gate bipolar transistor G1, a diode D1, and a capacitor C3 in parallel, the upper half-bridge second unit includes an insulated-gate bipolar transistor G3, a diode D3, and a capacitor C4 in parallel; and the lower half-bridge structure includes a lower half-bridge first unit and a lower half-bridge second unit in parallel, the lower half-bridge first unit includes an insulated-gate bipolar transistor G2, a diode D2, and a capacitor C1 in parallel, the lower half-bridge second unit includes an insulated-gate bipolar transistor G4, a diode D4, and a capacitor C2 in parallel.

A high-frequency power supply circuit includes an amplifier circuit. In the amplifier circuit, one end of an inductor is connected to a direct-current power supply. One end of a switching element is connected to the other end of the inductor. A parallel capacitor is connected in parallel to the switching element. One end of an LC series circuit is connected to the one end of the switching element. A circuit capacitor is connected between the other end of the LC series circuit and the other end of the switching element. The amplifier circuit amplifies a signal having a unique frequency input to a control terminal of the switching element. The amplifier circuit outputs, to a load, a current having the frequency from a connection point between the other end of the LC series circuit and the circuit capacitor.

An electronic circuit has an output node that outputs a DC signal indicating a temporal change rate of a voltage of a measurement target node, a first capacitor and a first resistor that are connected in series between the measurement target node and a first reference voltage node, a second capacitor that is connected between the output node and a second reference voltage node, a first switch that switches whether or not to short-circuit the first reference voltage node and the output node, and a rectifier circuit that flows a current to a connection node between the first capacitor and the first resistor from the output node, and cuts off a current to the output node from the connection node.