A mechanical device for converting direct current into three-phase alternating current includes a contact unit having at least two receiving regions for receiving electrical energy as direct current and at least three output regions for outputting electrical energy as alternating current. A first receiving region contacts a positive pole of a direct current feed. A second receiving region contacts a negative pole of the direct current feed. A first output region provides a first alternating current, a second output region provides a second alternating current, and a third output region provides a third alternating current. A contacting unit receives the direct current and/or outputs the alternating current, and an assembly provides contact of the output regions with three phases of a dynamoelectric rotating machine. An isolator between two of the output regions and the contact prevents the contact from making contact with the two output regions at a same time.

A mechanical device for converting direct current into three-phase alternating current includes a contact unit having at least two receiving regions for receiving electrical energy as direct current and at least three output regions for outputting electrical energy as alternating current. A first receiving region contacts a positive pole of a direct current feed. A second receiving region contacts a negative pole of the direct current feed. A first output region provides a first alternating current, a second output region provides a second alternating current, and a third output region provides a third alternating current. A contacting unit receives the direct current and/or outputs the alternating current, and an assembly provides contact of the output regions with three phases of a dynamoelectric rotating machine. An isolator between two of the output regions and the contact prevents the contact from making contact with the two output regions at a same time.

A power semiconductor package includes a first group of semiconductor dies attached to a first side of a substrate and evenly distributed over a width of the substrate and a second group of semiconductor dies attached to the first side of the substrate and evenly distributed over the substrate width. Each die in the first and second groups has all terminals at one side which is attached to the first side of the substrate and an insulated or isolated face at a side opposite the side with the terminals. A first intermediary metal layer of the substrate forms a first DC terminal. A second intermediary metal layer of the substrate forms a second DC terminal. These intermediary metal layers are insulated from one another and form a parallel plate waveguide. Additional power semiconductor package embodiments are described.

A mechanical device for converting direct current into three-phase alternating current includes a contact unit having at least two receiving regions for receiving electrical energy as direct current and at least three output regions for outputting electrical energy as alternating current. A first receiving region contacts a positive pole of a direct current feed. A second receiving region contacts a negative pole of the direct current feed. A first output region provides a first alternating current, a second output region provides a second alternating current, and a third output region provides a third alternating current. A contacting unit receives the direct current and/or outputs the alternating current, and an assembly provides contact of the output regions with three phases of a dynamoelectric rotating machine. An isolator between two of the output regions and the contact prevents the contact from making contact with the two output regions at a same time.