Systems and methods are provided for amplifying multiple input signals to generate multiple output signals. An example system includes a first channel, a second channel, and a third channel. The first channel is configured to receive one or more first input signals, process information associated with the one or more first input signals and a first ramp signal, and generate one or more first output signals. The second channel is configured to receive one or more second input signals, process information associated with the one or more second input signals and a second ramp signal, and generate one or more second output signals. The first ramp signal corresponds to a first phase. The second ramp signal corresponds to a second phase. The first phase and the second phase are different.

Circuits and devices related to radio-frequency amplifiers. In some embodiments, a radio-frequency amplifier can include a plurality of narrow band power amplifiers. Each narrow band power amplifier can be configured to operate with a high voltage in an average power tracking mode and be capable of being coupled to an output filter associated with a respective individual frequency band. Each narrow band power amplifier can be sized smaller than a wide band power amplifier configured to operate with more than one of the frequency bands associated with the plurality of narrow band power amplifiers.

A radio frequency circuit includes a first radio frequency circuit, a second radio frequency circuit, and a first switch circuit. The first switch circuit includes a first terminal connected to an antenna connection terminal, a second terminal connected to the first radio frequency circuit, and a third terminal connected to the second radio frequency circuit. The first radio frequency circuit includes a first power amplifier circuit supporting a first power class, and a first filter circuit connected to the first power amplifier circuit and having a passband that includes a first band. The second radio frequency circuit includes a second power amplifier circuit supporting a second power class having a maximum output power greater than a maximum output power of the first power class. The second radio frequency circuit includes a second filter circuit connected to the second power amplifier circuit and having a passband that includes the first band.

A high-frequency module includes: a module substrate that has major surfaces that face each other; a plurality of post electrodes placed on the major surface; and a power amplification component placed on the major surface. The power amplification component includes: a base material that has major surfaces and that face each other, the major surface being located between the major surface and the major surface; an amplification transistor formed on a side of the major surface of the base material; and a metal electrode placed on the major surface and connected to the amplification transistor.

A semiconductor device includes an equalizer for receiving a first signal and outputting a second signal that has been adjusted to compensate for attenuation of the first signal. A filter is connected to the output terminal of the equalizer. A cancellation circuit operates to cancel a DC offset in the output of the equalizer. A processing circuit is configured to control the cancellation circuit to cancel the DC offset according to an output from the filter. The processing circuit sets a time constant for the filter to a first value to permit the cancellation circuit to cancel the DC offset when the equalizer is in a first state, and then sets the time constant to a second value when the equalizer is set to a second state to permit the cancellation circuit to cancel the DC offset when the equalizer is in the second state.

Aspects of the disclosure include a front-end module comprising one or more receive ports configured to be coupled to a transceiver, at least one low-noise amplifier configured to be coupled to the one or more receive ports, one or more antenna ports configured to be coupled to one or more respective antennas, and a multiplexer coupled to the one or more receive ports and to the one or more antenna ports, the multiplexer being configured to route a signal received at the one or more antenna ports to a selected receive port of the one or more receive ports.

Aspects of this disclosure relate to methods of manufacturing bulk acoustic wave components. Such methods include plasma dicing to singulate individual bulk acoustic wave components. A buffer layer can be formed over a substrate of bulk acoustic wave components such that streets are exposed. The bulk acoustic wave components can be plasma diced along the exposed streets to thereby singulate the bulk acoustic wave components.

The present invention, a Digital Power Amplifier (DPA) with filtered output relates to the transmission circuitry of wireless communications systems and more particularly to high frequency power amplifier circuits using digital intensive techniques on cost efficient semiconductor technologies. Today, we experience an ever-increasing need for low cost, low power wireless transmitters in the millimeter wavelength region. Current solutions rely on analog PA circuits. The background art does not contain a solution for bridging the gap between the operation frequencies of the digital circuits on a cost-efficient technology such as CMOS and the millimeter wavelength transmission frequencies demanded in numerous applications. The DPA allowing the direct feeding of digital data to a high frequency amplifying circuit. In this way, design challenging and costly analog processing up-conversion stages are avoided. The DPA comprises a bank of switching amplifying elements, a switch capacitor trap filter taping on the bank of switching amplifying elements for shaping the frequency characteristic of the produced radio frequency (RF) waveform and an adaptive biasing circuit able of dynamically controlling the power consumption within the switching amplifying elements. It can have a wide spectrum of applications where low cost but high efficiency power amplifiers are needed, such as in the Internet of Things (IoT), Wi-Fi and 5G cellular communications.

A multi-band power amplifier module includes at least one transmission input terminal, at least one power amplifier circuit that receives a first transmission signal and a second transmission signal through the at least one transmission input terminal, a first filter circuit that allows the first transmission signal to pass therethrough, a second filter circuit that allows the second transmission signal to pass therethrough, at least one transmission output terminal through which the first and second transmission signals output from the first and second filter circuits are output, a transmission output switch that outputs each of the first and second transmission signals output from the at least one power amplifier circuit to the first filter circuit or the second filter circuit, and a first tuning circuit that adjusts impedance matching between the at least one power amplifier circuit and the at least one transmission output terminal.

One example includes a device that is comprised of a pre-power amplifier, a power amplifier, a signal path, and a dynamic bias circuit. The pre-power amplifier amplifies an input signal and outputs a first amplified signal. The power amplifier receives the first amplified signal and amplifies the first amplified signal based on a dynamic bias signal to produce a second amplified signal at an output thereof. The signal path is coupled between an output of the pre-power amplifier and an input of the power amplifier. The dynamic bias circuit monitors the first amplified signal, generates the dynamic bias signal, and outputs the dynamic bias into the signal path.