A multi-band power amplifier module includes at least one transmission input terminal, at least one power amplifier circuit that receives a first transmission signal and a second transmission signal through the at least one transmission input terminal, a first filter circuit that allows the first transmission signal to pass therethrough, a second filter circuit that allows the second transmission signal to pass therethrough, at least one transmission output terminal through which the first and second transmission signals output from the first and second filter circuits are output, a transmission output switch that outputs each of the first and second transmission signals output from the at least one power amplifier circuit to the first filter circuit or the second filter circuit, and a first tuning circuit that adjusts impedance matching between the at least one power amplifier circuit and the at least one transmission output terminal.

Disclosed are methods for biasing amplifiers and for manufacturing bias circuits bias for biasing amplifiers. A power amplifier bias circuit can include an emitter follower device and an emitter follower mirror device coupled to form a mirror configuration. The emitter follower device can be configured to provide a bias signal for a power amplifier at an output port. The power amplifier bias circuit can include a reference device configured to mirror an amplifying transistor of an amplifying device of the power amplifier. The emitter follower mirror device can be configured to provide a mirror bias signal to the reference device. A node between the emitter follower device and the emitter follower mirror device can have a voltage of approximately twice a base-emitter voltage (2Vbe) of the amplifying transistor.

A first system includes first and second buck-boost amplifiers. The first amplifier is connected to a battery, includes a first inductor and a first plurality of switches connected to the first inductor, and drives first and second loads. The second amplifier is connected to the battery, includes a second inductor and a second plurality of switches connected to the second inductor, and drives the first and second loads. A controller drives the first and second plurality of switches to operate each of the first and second amplifiers in a single inductor multiple output mode. A second system includes multiple buck-boost amplifiers connected to a battery and driving respective loads. Each amplifier includes inductors and switches connected to the inductors. A controller drives the switches to utilize one or more inductors based on an amount of power used by each amplifier to drive the respective loads.

Various buck-boost amplifier architectures are disclosed. In some architectures, a plurality of amplifiers use one or more inductors from a shared bank of inductors as needed to deliver variable amounts of power to respective loads. In some architectures, each amplifier includes multiple inductors and switches that are controlled to vary the number of inductors used in an amplifier based on a power requirement of the amplifier to drive its load. In some architectures, the switches include well switching devices. In some architectures, each amplifier drives multiple loads and is operated in a single inductor multiple output (SIMO) mode. In all architectures, the loads include speakers, piezo elements, and motors.

Disclosed are methods for biasing amplifiers and for manufacturing bias circuits bias for biasing amplifiers. A power amplifier bias circuit can include an emitter follower device and an emitter follower mirror device coupled to form a mirror configuration. The emitter follower device can be configured to provide a bias signal for a power amplifier at an output port. The power amplifier bias circuit can include a reference device configured to mirror an amplifying transistor of an amplifying device of the power amplifier. The emitter follower mirror device can be configured to provide a mirror bias signal to the reference device. A node between the emitter follower device and the emitter follower mirror device can have a voltage of approximately twice a base-emitter voltage (2Vbe) of the amplifying transistor.

A multi-band power amplifier module includes at least one transmission input terminal, at least one power amplifier circuit that receives a first transmission signal and a second transmission signal through the at least one transmission input terminal, a first filter circuit that allows the first transmission signal to pass therethrough, a second filter circuit that allows the second transmission signal to pass therethrough, at least one transmission output terminal through which the first and second transmission signals output from the first and second filter circuits are output, a transmission output switch that outputs each of the first and second transmission signals output from the at least one power amplifier circuit to the first filter circuit or the second filter circuit, and a first tuning circuit that adjusts impedance matching between the at least one power amplifier circuit and the at least one transmission output terminal.

A variable load power amplifier that improves the performance of a power amplifier that provides both envelope tracking (ET) and average power tracking (APT). The variable load power amplifier can include a plurality of amplifiers that are each selectively connectable into one of a plurality of parallel combinations, each of the plurality of parallel combinations characterized by a corresponding load line. The variable load power amplifier can also include a plurality of control elements arranged to selectively connect one or more of the plurality of amplifiers into one of the plurality of parallel combinations, each of the plurality of control elements having a respective input terminal provided to receive a respective control signal, each of the plurality of control elements responsive to the respective control signal.

Aspects of this disclosure relate to methods of manufacturing bulk acoustic wave components. Such methods include plasma dicing to singulate individual bulk acoustic wave components. A buffer layer can be formed over a substrate of bulk acoustic wave components such that streets are exposed. The bulk acoustic wave components can be plasma diced along the exposed streets to thereby singulate the bulk acoustic wave components

Aspects of this disclosure relate to bulk acoustic wave components. A bulk acoustic wave component can include a substrate, at least one bulk acoustic wave resonator on the substrate, and a cap enclosing the at least one bulk acoustic wave resonator. The cap can include a sidewall spaced apart from an edge of the substrate. The sidewall can be 5 microns or less from the edge of the substrate.

A multi-band power amplifier module includes at least one transmission input terminal, at least one power amplifier circuit that receives a first transmission signal and a second transmission signal through the at least one transmission input terminal, a first filter circuit that allows the first transmission signal to pass therethrough, a second filter circuit that allows the second transmission signal to pass therethrough, at least one transmission output terminal through which the first and second transmission signals output from the first and second filter circuits are output, a transmission output switch that outputs each of the first and second transmission signals output from the at least one power amplifier circuit to the first filter circuit or the second filter circuit, and a first tuning circuit that adjusts impedance matching between the at least one power amplifier circuit and the at least one transmission output terminal.