Patent classifications
H03H7/1775
High frequency multilayer filter
A high frequency multilayer filter may include a plurality of dielectric layers and a signal path having an input and an output. The multilayer filter may include an inductor including a conductive layer formed over a first dielectric layer. The inductor may be electrically connected at a first location with the signal path and electrically connected at a second location with at least one of the signal path or a ground. The multilayer filter may include a capacitor including a first electrode and a second electrode that is separated from the first electrode by a second dielectric layer. The multilayer filter has a characteristic frequency that is greater than about 6 GHz.
Multilayer filter including a low inductance via assembly
A multilayer filter may include a dielectric layer having a top surface, a bottom surface, and a thickness in a Z-direction between the top surface and the bottom surface. The multilayer filter may include a conductive layer formed on the top surface of the dielectric layer. The multilayer filter may include a via assembly formed in the dielectric layer and connected to the conductive layer on the top surface of the dielectric layer. The via assembly may extend to the bottom surface of the dielectric layer. The via assembly may have a length in the Z-direction and a total cross-sectional area in an X-Y plane that is perpendicular to the Z-direction. The via assembly may have an area-to-squared-length ratio that is greater than about 3.25.
Low temperature co-fired ceramic band-pass filter
The present application provides an LTCC band-pass filter, including a shell and a filtering assembly. The shell includes a top wall and a bottom wall. The filtering assembly includes a first layer, two second layers respectively overlapped on two opposite sides of the first layer, two third layers respectively overlapped on two sides of the two second layers far away from the first layer, and a fourth layer sandwiched between one of the second layers and the third layers. The first layer is served as an inductance L. The second layer is served as a grounding capacitor C. The second layer and the first layer are coupled together to form an LC resonance unit. The third layer is connected with the ground, and is served as a shielding layer of the LTCC band-pass filter.
Filter and front end circuit
A filter includes: first and second parallel resonant circuits including a first capacitor, a first line, a second capacitor, and a second line that are shunt-connected to a series pathway connecting the input and output terminals; and first to sixth vias penetrating through a second dielectric layer on which the first and second lines are disposed, the first via connecting the first line to the series pathway, the second via connecting the first line to the ground terminal, the third via connecting the first line at a position between the first and second vias to the first connection line at a first position, the fourth via connecting the second line to the series pathway, the fifth via connecting the second line to the ground terminal, the sixth via connecting the second line at a position between the fourth and fifth vias to the first connection line at a second position.
Frontend module
A frontend module includes a first filter having a passband of a first frequency band, a second filter having a passband of a second frequency band, the second frequency band being higher than the first frequency band, a third filter having a passband of a third frequency band, the third frequency band being higher than the second frequency band, and a sub-filter, connected to the second filter, configured to provide attenuation characteristics for the first frequency band, wherein the second filter comprises a plurality of parallel LC resonance circuits arranged between a ground and different nodes, from among a plurality of nodes between a first terminal and a second terminal, wherein an inductor is connected to a portion of the plurality of parallel LC resonance circuits.
Providing a programmable inductor to enable wide tuning range
In one embodiment, a tuning network includes: a controllable capacitance; a first switch coupled between the controllable capacitance and a reference voltage node; a second switch coupled between the controllable capacitance and a third switch; the third switch coupled between the second switch and a second voltage node; a fourth switch coupled between the second voltage node and a first inductor; the first inductor having a first terminal coupled to the fourth switch and a second terminal coupled to at least the second switch; and a second inductor having a first terminal coupled to the second terminal of the first inductor and a second terminal coupled to the controllable capacitance.
Wideband Reconfigurable Impedance Matching Network
Embodiments relate to a transformer-based impedance matching network that may dynamically change its characteristic impedance by engaging different inductor branches on a primary side and optionally, on the secondary side. A primary side transformer circuit includes a primary inductor (311) and secondary inductor (321) configured to provide impedance matching over a first frequency band. One or more additional inductor branches (314A, 314B, are switchably coupled to either or both of the primary and secondary inductors to modify the impedance matching characteristics over additional operating frequencies. One or more LC filter branches (321, 322, 326, 327, 336, 330) can be included at the output of the secondary side to filter harmonic frequencies in each of the operating frequency bands.
Electronic component
An electronic component is mounted on a circuit board such that a mounting surface of an element body to which a first outer electrode and a second outer electrode are exposed is directed toward the circuit board. A coil is formed of a spiral coil in which a plurality of coil conductor layers arranged in a direction perpendicular to a first side surface and a second side surface orthogonal to the mounting surface are connected in series. Then, an intermediate point between a lowest point closest to the mounting surface and an uppermost point farthest from the mounting surface in an inner circumference of the coil is offset from the center of the element body in a direction perpendicular to the mounting surface toward the opposite side to the mounting surface.
N-Channel High-Power RF Multiplexer
A method for reducing a quantity of cable runs to antennas can include the step of providing a circuit of reactive elements coupled between an input terminal and at least two output terminals. The circuit can be used to separate a broadband signal into two or more disjoint expected frequency ranges. The circuit can match the impedance at the at least two output terminals to the impedance expected by the antennas. The elements of the circuit can have reactances and arrangement so that when a broadband RF signal is applied at the input terminal, two or more disjoint expected frequencies can be applied to the respective output terminals. The power at each output terminal can sufficiently match the antennas' expected power, and insertion losses can be minimized.
HARMONIC TRAP FILTER USING COUPLED RESONATORS
A harmonic trap filter suppresses at least one harmonic signal produced by an amplifier and includes an input terminal and a ground terminal. The harmonic trap filter further includes a plurality of resonators electrically coupled one to another between the input terminal and the ground terminal in a spatial order defined by relative phase shift of alternating voltage bias signals respectively applied thereto. The resonators are tuned to resonate at a frequency at which a phase delay is imparted to the at least one harmonic signal by the resonators to effect cancelation of the at least one harmonic signal at the input terminal.