Patent classifications
H03H7/1775
Band antenna EMP filter apparatus having hemp protection capability
A band antenna EMP filter apparatus having HEMP protection capability is disclosed. The apparatus includes a discharging part, a band pass filtering part, and a residual current eliminating part. The discharging part primarily discharges a transient voltage due to a high altitude electromagnetic pulse (HEMP) when the HEMP is inputted through an input part receiving a radio frequency (RF) signal of an antenna. The band pass filtering part secondarily blocks a residual current primarily discharged by the discharging part and passes only a signal of a preset frequency band to output it through an output part. The residual current eliminating part limits a transient voltage of the HEMP by eliminating a residual current passing through the band pass filtering part.
Radio frequency filtering circuitry on integrated passive die
An integrated passive die includes a substrate, an input node, an output node, and RF filtering circuitry. The RF filtering circuitry includes a number of LC tank circuits coupled between the input node and the output node. Each one of the LC tank circuits include an inductor and a capacitor. The inductor is formed by a metal trace over the substrate. The capacitor is coupled in parallel with the inductor over the substrate. The inductor and the capacitor are provided such that a resonance frequency of the combination of the inductor and the capacitor is less than a self-resonance frequency of the inductor.
TRANSMISSION-LINE-BASED RESONANT QUADRATURE CLOCK DISTRIBUTION WITH HARMONIC FILTERING
An integrated circuit having a transmission-line-based resonant clock distribution network for distributing a clock signal to one or more nodes, the integrated circuit including a transmission-line-based resonant network formed by one or more clock distribution units. Each clock distribution unit includes a transmission line segment having first and second ends and a resonant circuit connected to the transmission line segment at a position equidistant from the first end and the second end, where the resonant circuit includes an inductor connected in parallel with a capacitor such that the resonant circuit, along with the transmission line segment, collectively has a resonant frequency about a frequency of the clock signal.
CIRCUIT BOARD
A circuit board having excellent reliability of connection between layers while being capable of achieving a compact and low-profile electronic device. In the circuit board has an LC circuit built therein with the use of a glass core having a through hole, a conductor layer formed in the through hole is connected to a wiring pattern formed on one surface of the glass core, and connected to a wiring pattern formed on the other surface of the glass core, with the conduction layer projected from the surface of the glass core. Thus, the area of contact between the conduction layer and the through hole is increased, thus making it possible to prevent the reliability of connection between layers in the through hole from being decreased, even when the glass core is reduced in thickness for achieving a low-profile device.
FILTER DEVICE AND MULTIPLEXER
A filter device includes an unbalanced terminal, balanced terminals, and first and second resonant circuits. The first resonant circuit is connected to the unbalanced terminal. The second resonant circuit is connected to the balanced terminals and electromagnetically coupled with the first resonant circuit. The first resonant circuit includes a resonator in which an inductor and a capacitor are connected in parallel between the unbalanced terminal and a reference potential. The second resonant circuit includes a resonator including an inductor connected between the balanced terminals and capacitors connected in series between the balanced terminals.
MULTILAYER ELECTRONIC COMPONENT
An electronic component includes a stack and an inductor wound about an axis orthogonal to a stacking direction. The inductor includes a first conductor layer portion and two through hole columns. The first conductor layer portion includes two conductor layers disposed at positions different from each other in the stacking direction and connected in parallel to each other. Area of a first conductor layer is larger than area of a second conductor layer.
MULTILAYER ELECTRONIC COMPONENT
An electronic component includes a stack and first to third inductors. Area of a region obtained by perpendicularly projecting a first space including a first axis and surrounded by the first inductor onto an XZ plane is larger than area of a region obtained by perpendicularly projecting a second space including a second axis and surrounded by the second inductor onto a YZ plane. The third inductor is disposed such that a third axis does not intersect the first space but intersects the second space.
MULTILAYER ELECTRONIC COMPONENT
An electronic component includes a stack and first to fourth inductors. The second inductor is disposed after the first inductor in a −Y direction. The third inductor and the fourth inductor are disposed after the first inductor and the second inductor, respectively, in a −X direction. Two or more through hole columns are connected in parallel to a part near each end of a conductor layer portion in each of the first inductor and the fourth inductor in a longitudinal direction. One through hole column is connected to a part near each end of a conductor layer portion in each of the second inductor and the third inductor in a longitudinal direction.
MULTILAYER ELECTRONIC COMPONENT
An electronic component includes a stack and first and second inductors. The first inductor includes a first through hole column, a second through hole column, a first conductor layer portion, a second conductor layer portion, and a third conductor layer portion. The second conductor layer portion is connected to an end of the first through hole column and extends close to the second through hole column. The third conductor layer portion is connected to the second through hole column and extends close to the first through hole column.
HYBRID RESONATORS
A hybrid resonator includes an acoustic wave resonator (AWR) having a piezoelectric material; a first electrical contact, electrically conductively connected to the piezoelectric material; and a second electrical contact, electrically conductively connected to the piezoelectric material. The hybrid resonator further includes a first resonant circuit, electrically conductively connected in series or parallel to the acoustic wave resonator via at least one of the first electrical contact and the second electrical contact. The resonant circuit includes a first inductor, and a first capacitor; wherein, if the first resonant circuit is electrically conductively connected to the acoustic wave resonator in series, the first inductor and the first capacitor are electrically conductively connected to one another in parallel, and if the first resonant circuit is electrically conductively connected to the acoustic wave resonator in parallel, the first inductor and the first capacitor are electrically conductively connected to one another in series.