Patent classifications
H03H2009/0244
ACOUSTICALLY DECOUPLED MEMS DEVICES
Embodiments of the present disclosure relate generally to acoustically decoupled microelectromechanical system devices and, more particularly, to acoustically decoupled microelectromechanical system devices anchored upon phononic crystals. In some embodiments described herein, a device may comprise a resonator, a handle layer, and a pedestal disposed between the resonator and the handle layer, the pedestal connecting the resonator to the handle layer. In the devices described herein, the resonator and the handle layer may be non-coplanar. In some embodiments, the handle layer comprises a phononic crystal to acoustically decouple the resonator from the substrate of the handle layer.
Resonator and device including the same
According to one embodiment, a resonator is disclosed. The resonator includes a vibrator and an attenuation mechanism. The attenuation mechanism selectively attenuates vibration of a spurious mode that is mechanically coupled to a first mode when the vibrator vibrates in the first mode.
Microelectromechanical system resonator devices and oscillator control circuits
Reference oscillators are ubiquitous in timing applications generally, and in modern wireless communication devices particularly. Microelectromechanical system (MEMS) resonators are of particular interest due to their small size and potential for integration with other MEMS devices and electrical circuits on the same chip. In order to support their use in high volume low cost applications it would be beneficial for MEMS designers to have MEMS resonator designs and manufacturing processes that whilst employing low cost low resolution semiconductor processing yield improved resonator performance thereby reducing the requirements of the oscillator circuitry. It would be further beneficial for the oscillator circuitry to be able to leverage the improved noise performance of differential TIAs without sacrificing power consumption.
Micromechanical resonator having reduced size
A micromechanical resonator is provided that enables a smaller total package size with an acceptable quality factor for timing applications. The MEMS resonator includes a vibration portion with a base and three or more vibrating beams extending therefrom. Moreover, the MEMS resonator includes a frame that surrounds a periphery of the vibration portion and a pair of anchor between the vibrating beams for stabilizing the vibration portion within the frame. Furthermore, support beams couple the base of the vibration portion to the pair of anchors.
MEMS resonator with a high quality factor
A symmetrical MEMS resonator is disclosed with a high quality factor. The MEMS resonator includes a silicon layer with a top surface and bottom surface opposite the top surface. A pair of first metal layers is provided above the top surface of the silicon layer and a corresponding pair of second metal layers is symmetrically provided below the second surface of the silicon layer relative to the pair of first metal layers. Furthermore, a first piezoelectric layer is disposed between the pair of first metal layers and a second piezoelectric layer is disposed between the pair of second metal layers.
HIGH QUALITY FACTOR MEMS SILICON FLOWER-OF-LIFE VIBRATORY GYROSCOPE
A resonator includes an anchor, an outer stiffener ring on an outer perimeter of the resonator, and a plurality of curved springs between the anchor and the outer stiffener ring.
High quality factor MEMS silicon flower-of-life vibratory gyroscope
A resonator includes an anchor, an outer stiffener ring on an outer perimeter of the resonator, and a plurality of curved springs between the anchor and the outer stiffener ring.
Stacked balanced resonators
A resonator array comprises substantially paralleled first and second resonant layers having resonating masses. A first set of lateral drive electrodes cause the first resonating mass to vibrate along an axis in a first geometric plane. A second set of lateral drive electrodes cause the second resonating mass to vibrate along an axis in a second geometric plane in an opposite direction of the first resonating mass by about 180 degrees. Rotation in the system causes the masses to vibrate out-of-plane in opposite directions. The opposite vibrational directions of the first and second resonating masses produces a balanced system with small motion in a bonding area between the stacked resonators. As a result, there is minimal propagation of mechanical waves from the balanced system to a substrate resulting in lower anchor loss and a high Q-factor.
Acoustically Decoupled MEMS Devices
A resonator element of the monocrystalline 4H or 6H polytype of silicon carbide. A MEMS device including the resonator element and a substrate, wherein the resonator element and the substrate are not coplanar, and acoustic decoupling of the resonator element and the substrate is at least partially dependent upon a degree to which the resonator element and the substrate are not coplanar. A MEMS gyroscope including the resonator element, a substrate, one or more electrodes disposed proximate the resonator element, and a capacitive gap disposed between each electrode and the resonator element. A MEMS device including the resonator element having has a Q greater than 1,000,000, a phononic crystal substrate, and a gap disposed between a perimeter edge of the resonator element and the phononic crystal substrate, wherein acoustic decoupling of the resonator element and the phononic crystal substrate is at least partially dependent upon a size of the gap.
RESONATOR AND DEVICE INCLUDING THE SAME
According to one embodiment, a resonator is disclosed. The resonator includes a vibrator and an attenuation mechanism. The attenuation mechanism selectively attenuates vibration of a spurious mode that is mechanically coupled to a first mode when the vibrator vibrates in the first mode.