This invention provides electromechanical resonators based on metal chalcogenide nanotubes. The invention further provides methods of fabrication of electromechanical resonators and methods of use of such electromechanical resonators.

A micro-electro-mechanical-system (MEMS) device comprises an inertial component configured for being connected to a structure by a flexible connection allowing the inertial component to deform or move relative to the structure in response to an external stimulus applied to the structure. One or more resonant components are connected to the structure or inertial component, the resonant component(s) having resonant mode(s). Transduction unit(s) measures an oscillatory motion of the resonant component relative to the inertial component and/or structure. An electronic control unit applies a pump of electrostatic force to induce an oscillatory motion of the resonant component(s) in the resonant mode, the oscillatory motion being a non-linear function of a strength of the electrostatic force. The resonant component is configured to be coupled to the inertial component and/or the structure such that a deformation and/or motion of the inertial component in response to an external stimulus changes the strength of the pump, the electronic control unit configured for producing and outputting an output signal being a mathematical function of the measured oscillatory motion. A system for producing a neuromorphic output for a MEMS device exposed to external stimuli is also provided.

A continuous or distributed resonator geometry is defined such that the fabrication process used to form a spring mechanism also forms an effective mass of the resonator structure. Proportional design of the spring mechanism and/or mass element geometries in relation to the fabrication process allows for compensation of process-tolerance-induced fabrication variances. As a result, a resonator having increased frequency accuracy is achieved.

MEMS based sensors, particularly capacitive sensors, potentially can address critical considerations for users including accuracy, repeatability, long-term stability, ease of calibration, resistance to chemical and physical contaminants, size, packaging, and cost effectiveness. Accordingly, it would be beneficial to exploit MEMS processes that allow for manufacturability and integration of resonator elements into cavities within the MEMS sensor that are at low pressure allowing high quality factor resonators and absolute pressure sensors to be implemented. Embodiments of the invention provide capacitive sensors and MEMS elements that can be implemented directly above silicon CMOS electronics.

A logic system includes a microelectromechanical system, MEMS, resonator having an arch beam and first and second side beams, wherein the first side beam is attached with a first end to a first end of the arch beam and the second side beam is attached with a first end to a second end of the arch beam to form a U-shape; an input electrode facing the second side beam; a selector electrode facing the second side beam; a first output electrode facing the first side beam; and a second output electrode facing the arch beam.

A microelectromechanical resonator, including a support structure, a resonator element suspended to the support structure, the resonator element including a plurality of sub-elements, and an actuator for exciting the resonator element into a resonance mode. The sub-elements are dimensioned such that they are dividable in one direction into one or more fundamental elements having an aspect ratio different from 1 so that each of the fundamental elements supports a fundamental resonance mode, which together define a compound resonance mode of the sub-element. The sub-elements are further coupled to each other by connection elements and positioned with respect to each other such that the fundamental elements are in a rectangular array configuration, wherein each fundamental element occupies a single array position, and at least one array position of the array configuration is free from fundamental elements.

Embodiments of the invention include a filtering device that includes a first electrode, a piezoelectric material in contact with the first electrode, and a second electrode in contact with the piezoelectric material. The piezoelectric filtering device expands and contracts laterally in a plane of an organic substrate in response to application of an electrical signal between the first and second electrodes.

MEMS based sensors, particularly capacitive sensors, potentially can address critical considerations for users including accuracy, repeatability, long-term stability, ease of calibration, resistance to chemical and physical contaminants, size, packaging, and cost effectiveness. Accordingly, it would be beneficial to exploit MEMS processes that allow for manufacturability and integration of resonator elements into cavities within the MEMS sensor that are at low pressure allowing high quality factor resonators and absolute pressure sensors to be implemented. Embodiments of the invention provide capacitive sensors and MEMS elements that can be implemented directly above silicon CMOS electronics.

The present disclosure relates to a MEMS vibrator or the like that has excellent chemical resistance and an excellent mechanical strength and that is easily thinned. The present disclosure is a MEMS vibrator comprising: a vibrating film including a graphite film; and a silicon member supporting the vibrating film, the graphite film having a thickness of 50 nm or more and less than 20 m, and the graphite film having a Young's modulus along a graphite film plane direction of 700 GPa or more.

A MEMS resonator system has a micromechanical resonant structure and an electronic processing circuit including a first resonant loop that excites a first vibrational mode of the structure and generates a first signal at a first resonance frequency. A compensation module compensates, as a function of a measurement of temperature variation, a first variation of the first resonance frequency caused by the temperature variation to generate a clock signal at a desired frequency that is stable relative to temperature. The electronic processing circuit further includes a second resonant loop, which excites a second vibrational mode of the structure and generates a second signal at a second resonance frequency. A temperature-sensing module receives the first and second signals and generates the measurement of temperature variation as a function of the first variation of the first resonance frequency and a second variation of the second resonance frequency caused by the temperature variation.