A resonator defining a longitudinal axis that includes a mounting pad, a pad connector, at least one isolation mechanism, and a pair of elongated tines extending in the direction of the longitudinal axis. The isolation mechanism including an outer block defining a first outer end and a second outer end on opposite sides, an inner block defining a first inner end and a second inner end on opposite sides, and a pair of interconnect members, where each respective interconnect member of the pair of interconnect members connects the second outer end to the first inner end. The respective first ends of the pair of elongated tines being connected to the second inner end and the pad connector connects the mounting pad to the first outer end.

A vibrating beam accelerometer (VBA) with an in-plane pendulous proof mass, which may include one or more resonators, planar geometry, a single primary mechanical anchor between the support base and the VBA, a resonator connector structure connecting the resonators to the single primary anchor and a hinge flexure mechanically connecting the proof mass to the single primary anchor. The techniques of this disclosure specify how the resonators can be solidly attached to the single anchor without compromising performance caused by forces applied on or by the support base. The geometry of the VBA may prevent bias errors that may otherwise result from a force applied to the support base that reaches the mechanism of the VBA. An example of force applied to the support base, may include the thermal expansion mismatch between the material of the support base and the material of the VBA.

A vibrating beam accelerometer (VBA) with an in-plane translational proof mass that may include at least two or more resonators and be built with planar geometry, discrete lever arms, four-fold symmetry and a single primary mechanical anchor between the support base and the VBA. In some examples, the VBA of this disclosure may be built according to a micro-electromechanical systems (MEMS) fabrication process. Use of a single primary mechanical anchor may minimize bias errors that can be caused by external mechanical forces applied to the circuit board, package, and/or substrate that contains the accelerometer mechanism.

A micromechanical resonator is provided that enables a smaller total package size with an acceptable quality factor for timing applications. The MEMS resonator includes a vibration portion with a base and three or more vibrating beams extending therefrom. Moreover, the MEMS resonator includes a frame that surrounds a periphery of the vibration portion and a pair of anchor between the vibrating beams for stabilizing the vibration portion within the frame. Furthermore, support beams couple the base of the vibration portion to the pair of anchors.

MEMS based sensors, particularly capacitive sensors, potentially can address critical considerations for users including accuracy, repeatability, long-term stability, ease of calibration, resistance to chemical and physical contaminants, size, packaging, and cost effectiveness. Accordingly, it would be beneficial to exploit MEMS processes that allow for manufacturability and integration of resonator elements into cavities within the MEMS sensor that are at low pressure allowing high quality factor resonators and absolute pressure sensors to be implemented. Embodiments of the invention provide capacitive sensors and MEMS elements that can be implemented directly above silicon CMOS electronics.

MEMS based sensors, particularly capacitive sensors, potentially can address critical considerations for users including accuracy, repeatability, long-term stability, ease of calibration, resistance to chemical and physical contaminants, size, packaging, and cost effectiveness. Accordingly, it would be beneficial to exploit MEMS processes that allow for manufacturability and integration of resonator elements into cavities within the MEMS sensor that are at low pressure allowing high quality factor resonators and absolute pressure sensors to be implemented. Embodiments of the invention provide capacitive sensors and MEMS elements that can be implemented directly above silicon CMOS electronics.

MEMS based sensors, particularly capacitive sensors, potentially can address critical considerations for users including accuracy, repeatability, long-term stability, ease of calibration, resistance to chemical and physical contaminants, size, packaging, and cost effectiveness. Accordingly, it would be beneficial to exploit MEMS processes that allow for manufacturability and integration of resonator elements into cavities within the MEMS sensor that are at low pressure allowing high quality factor resonators and absolute pressure sensors to be implemented. Embodiments of the invention provide capacitive sensors and MEMS elements that can be implemented directly above silicon CMOS electronics.

A MEMS device may include: (i) a lower cavity, including a first island, formed within a first layer of the MEMS device; (ii) an upper cavity, including a second island, formed within a second layer of the MEMS device; (iii) a MEMS resonating element arranged in a device layer of the MEMS device and anchored via the first and second islands; (iv) a first set of electrodes for electrostatic actuation and sensing of the MEMS resonating element in an in-plane mode that is arranged in the device layer of the MEMS device; and (v) a second set of electrodes for electrostatic actuation and sensing of the MEMS resonating element in an out-of-plane mode that is electrically isolated from the first set of electrodes and located in the first or second layer of the MEMS device, and wherein the out-of-plane mode is a torsional mode or a saddle mode.

An active type temperature compensation resonator structure is provided, including a resonant body and a temperature compensation element embedded in the resonant body for a compensation current to pass therethrough. The temperature compensation element has a specified temperature coefficient of resistance that reflects the temperature of the resonant body. The magnitude of the compensated current corresponds to the reflected temperature of the resonant body. With the active type temperature compensation resonator structure, the temperature of the resonant body can be accurately reacted by the specified temperature coefficient of resistance, such that the temperature compensation element, through which the compensated current passes, can dynamically correspond to the temperature of the resonant body and accurately provide the resonant body with temperature compensation.

A microelectromechanical (MEMS) resonator includes a spring-mass system having a first weight portion (M1), a second weight portion (M2), and a central spring portion (SP) in between the weight portions. The weight portions are connected (or mechanically attached) to the central spring portion and thus improving stability.