An isolated switched-mode power converter converts power from an input source into power for an output load. A digital controller senses a secondary-side voltage, such as a rectified voltage, of the power converter. The secondary-side voltage is divided down using a high-impedance voltage divider. The resultant divided-down voltage is provided to a voltage sensor within the digital controller. The voltage sensor level shifts the provided voltage, and buffers the resulting level-shifted voltage. The buffered, level-shifted voltage is provided to a tracking analog-to-digital converter (ADC) for digitization. The buffered signal provided to the tracking ADC has a high current capability, such that the voltage input to the tracking ADC may quickly converge before the tracking ADC outputs a digital value for the sensed secondary-side voltage.

GaN-based half bridge power conversion circuits employ control, support and logic functions that are monolithically integrated on the same devices as the power transistors. In some embodiments a low side GaN device communicates through one or more level shift circuits with a high side GaN device. Various embodiments of level shift circuits and their inventive aspects are disclosed.

Various embodiments of the present application are directed towards a level shifter with temperature compensation. In some embodiments, the level shifter comprises a transistor, a first resistor, and a second resistor. The first resistor is electrically coupled from a first source/drain of the transistor to a supply node, and the second resistor is electrically coupled from a second source/drain of the transistor to a reference node. Further, the first and second resistors have substantially the same temperature coefficients and comprise group III-V semiconductor material. By having both the first and second resistors, the output voltage of the level shifter is defined by the resistance ratio of the resistors. Further, since the first and second resistors have the same temperature coefficients, temperature induced changes in resistance is largely cancelled out in the ratio and the output voltage is less susceptible to temperature induced change than the first and second resistors individually.

A semiconductor device, includes: a first first-conductivity-type transistor supplied with a first power source voltage and controlled by an output signal of a first input inverter; a second first-conductivity-type transistor supplied with the first power source voltage and controlled by an output signal of a second input inverter that inverts an output signal of the first input inverter; a first and a second second-conductivity-type transistor supplied with a second power source voltage; and a third and a fourth first-conductivity-type transistor that are connected in parallel either between the first first-conductivity-type transistor and the first second-conductivity-type transistor or between the second first-conductivity-type transistor and the second second-conductivity-type transistor, and that are configured to isolate either a first node connected to the first first-conductivity-type transistor or a second node connected to the second first-conductivity-type transistor from the second power source voltage in accordance with the first power source voltage.

A semiconductor integrated circuit device includes: first and second transistors provided between a first power source and an output terminal; a step-down circuit that generates a second power source from the first power source; a power source switch circuit that outputs, as a fourth power source, a higher one of potentials of the second power source and a third power source; and a level shifter circuit that transits between the first power source and a fourth power source. The first transistor has a gate connected to an output of the level shifter circuit; the second transistor has a gate connected to the fourth power source.

An integrated circuit includes a first time delay circuit, a second time delay circuit, and a master-slave flip-flop having a gated input circuit and a transmission gate. The first time delay circuit has a first input configured to receive a first clock signal and having a first output configured to generate a second clock signal. The second time delay circuit has a second input configured to receive the second clock signal and having a second output configured to generate a third clock signal. The transmission gate is configured to receive the first clock signal and the second clock signal to control a transmission state of the transmission gate. The gated input circuit is configured to have an input transmission state controlled by the third clock signal at the second output of the second time delay circuit.

A semiconductor integrated circuit device includes: first and second transistors provided between a first power source and an output terminal; a step-down circuit that generates a second power source from the first power source; a power source switch circuit that outputs, as a fourth power source, a higher one of potentials of the second power source and a third power source; and a level shifter circuit that transits between the first power source and a fourth power source. The first transistor has a gate connected to an output of the level shifter circuit; the second transistor has a gate connected to the fourth power source.

Certain aspects of the present disclosure are directed to a regulator. The regulator generally includes a source follower circuit and a low-voltage assist circuit. The low-voltage assist circuit generally includes a first transistor having a gate coupled to an output node of the source follower circuit, a voltage comparison circuit having a first input coupled to a source of the first transistor and a second input coupled to a control input node of the source follower circuit, and a second transistor having a gate coupled to an output of the voltage comparison circuit and a drain coupled to the output node of the source follower circuit.

A method of forming a semiconductor device includes forming active regions, forming S/D regions, forming MD contact structures and forming gate lines resulting in corresponding transistors that define a first time delay circuit having a first input configured to receive a first clock signal and having a first output configured to generate a second clock signal from the first clock signal; and corresponding transistors that define a second time delay circuit having a second input configured to receive the second clock signal and having a second output configured to generate a third clock signal from the first clock signal; forming a first gate via-connector in direct contact with the first gate line atop the first-type active region in the first area; and forming a second gate via-connector in direct contact with the second gate line atop the second-type active region in the second area.

A semiconductor device includes: a first conductivity type base body; a second conductivity type well region provided on the base body and formed with a high potential side circuit; a second conductivity type voltage blocking area provided to surround a periphery of the well region; a level shifter having a second conductivity type drift region provided on the base body, a second conductivity type carrier reception region provided in an upper part of the drift region, a first conductivity type base region provided in contact with the drift region, a first gate electrode provided on the base region, and a second conductivity type carrier supply region provided in an upper part of the base region; a first conductivity type isolation region provided between the voltage blocking area and the drift region on the base body; and a second gate electrode on the isolation region.