A solid-state imaging element includes a first substrate including a pixel circuit having a pixel array unit, and a second substrate. The second substrate includes signal processing circuits to process signals from the pixel array unit, and a wiring layer with wiring regions electrically connected to respective ones of the signal processing circuits. Each signal processing circuit has a same circuit pattern. The second substrate and the first substrate are stacked. A wiring pattern of each wiring region is different.

To provide a programmable logic device in which the number of elements per bit in a memory array can be reduced and with which power consumption or operation frequency can be estimated accurately at a testing stage. Provided is a programmable logic device including a plurality of programmable logic elements and a memory array which stores configuration data that determines logic operation executed in the plurality of programmable logic elements. The memory array includes a plurality of memory elements. The memory element includes a node which establishes electrical connection between the programmable logic element and the memory array, a switch for supplying charge whose amount is determined by the configuration data to the node, holding the charge in the node, or releasing the charge from the node, and a plurality of wirings. Capacitance is formed between the node and the wiring.

A programmable semiconductor device includes a user programmable switch comprising a configurable element positioned above a transistor material layer deposited on a substrate layer.

An integrated circuit comprising a plurality of logic tiles, wherein each logic tile (i) is physically adjacent to at least one other logic tile of the plurality and (ii) includes a configurable switch interconnect network including a plurality of switches electrically interconnected and arranged into a plurality of switch matrices, wherein the plurality of switch matrices are arranged into a plurality of stages including: (a) at least two of the stages which is configured in a hierarchical network, and (b) a mesh stage, wherein each switch matrix of the mesh stage includes an output that is directly connected to an input of a plurality of different switch matrices of the mesh stage and wherein the mesh stage of switch matrices of each logic tile is directly connected to the mesh stage of switch matrices of at least one other logic tile of the plurality of the logic tiles.

Embodiments of the disclosure are drawn to apparatuses and methods for arranging configurable logic circuits such that the configurable logic circuit may be configured to form one or more of several logic circuits by coupling a combination of nodes included in the logic circuit. Configuring the configurable logic circuit may include modification of a single wiring layer.

A method includes receiving a selection signal from a third-party device and a status signal from the third-party device. A data signal from the third-party device is latched when both the selection signal and the status signal are active. In addition, a second selection signal and a second status signal can be received from a second third-party device and a second data signal latched when both the second selection signal and the second status signal are active.

A device includes a first AND logic gate comprising a first input, a second input, and an output, a second AND logic gate comprising a first input, a second input, and an output, and a first OR logic gate comprising a first input coupled to the output of the first AND logic gate and a second input coupled to the output of the second AND logic gate. A first selection circuit has first and second data inputs, a first control input coupled to the first input of the first AND logic gate and a second control input coupled to the first input of the second AND logic gate. A first D latch includes a data input coupled to an output of the first selection circuit and an activation input coupled to an output of the first OR logic gate and a second D latch includes a data input coupled to the output of the first selection circuit and an activation input coupled to the output of the first OR logic gate.

A three-dimensional semiconductor device, comprising: a first module layer having a plurality of circuit blocks; and a second module layer positioned substantially above the first module layer, including a plurality of configuration circuits; and a third module layer positioned substantially above the second module layer, including a plurality of circuit blocks; wherein, the configuration circuits in the second module control a portion of the circuit blocks in the first and third module layers.

A semiconductor integrated circuit according to an embodiment includes: first to third wiring lines; first memory elements disposed in a cross region between the first wiring lines and the second wiring lines; second memory elements disposed in a cross region between the first wiring lines and the third wiring lines; a first write control circuit connected to the first wiring lines: a first circuit connected to one of the second wiring lines and supplying a first potential; a second circuit connected to the other one of the second wiring lines and supplying a second potential lower than the first potential; SRAM cells connected to the third wiring lines; and a selection circuit including input terminals electrically connected to the first wiring lines and an output terminal, the selection circuit connecting one of the input terminals to the output terminal in accordance with an input signal.

A crossbar switch includes a plurality of first wires extending in a first direction and second wires extending in a second direction. The switch includes third wires extending in a third direction and fourth wires extending in a fourth direction. The switch includes switch cells connected to the first and second wires. The first wires are skewed relative to the second and fourth wires, while the third wires are skewed relative to the second and fourth wires. The switch cells are connected to the third and fourth wires, and the third wires are also connected to the switch cells connected to the first wires adjacent to the respective first wires, or alternatively the fourth wires are also connected to the switch cells connected to the second wires adjacent to the respective second wires.