Systems and methods related to multi-die integrated circuits that may include dies having high-speed core interconnects. The high-speed core interconnects may be used to directly connect two adjacent dies.

Systems and methods related to multi-die integrated circuits that may include dies having high-speed core interconnects. The high-speed core interconnects may be used to directly connect two adjacent dies.

A bit line (BL) may be coupled at a first end to a BL driver (BLD) and at a second end to a BL receiver (BLR). The BL include a plurality of sections and each BL section may be coupled to at least one corresponding sectional configuration memory latch controlled by: at least one sectional word line write (WLW-k) signal, which when asserted enables data to be written into the at least one corresponding sectional configuration memory latch when a corresponding tri-stateable sectional driver (SD-k) is activated, and at least one sectional word line read (WLR-k) signal, which when asserted enables data to be from the at least one corresponding sectional configuration memory latch when the corresponding sectional pull-up (PU-k) is activated.

A programmable integrated circuit may include soft and hard logic for implementing a reduced instruction set computing (RISC) processor. Processor generator tools implemented on specialized computing equipment may be used to specify desired parameters for the processor architecture, including the data word size of one or more data paths, the instruction word size, and a set of instruction formats. The processor generator tools may also be used to determine the appropriate amount of pipelining that is required for each data path to satisfy performance criteria. The processor generator tools can also be used to analyze the processor architecture and to provide options for mitigating potential structural and data hazards.

A display device includes a display panel, a driving circuit board, and an electronic connector. The electronic connector connects the display panel and the driving circuit board. The driving circuit board is configured with a first wire, a second wire, a third wire, a fourth wire and a fifth wire arranged in order. The first wire, the second wire, the third wire and the fifth wire extend to the electronic connector and connect to the display panel. A first convergence point of the second wire and the third wire is located on the electronic connector, and a second convergence point of the fourth wire and the third wire is located on the driving circuit board. A detection method of the display device is also disclosed.

A System-on-Chip includes a first partition configured to implement a first application using of at least a first portion of one or more of a plurality of subsystems of the System-on-Chip and a second partition configured to implement a second application concurrently with the first partition. The second application uses at least a second portion of one or more of the plurality of subsystems. The first partition is isolated from the second partition.

A drive system (300) includes a plurality of power cells (312) supplying power to one or more output phases (A, B, C), each power cell (312) having multiple switching devices (315a-d) incorporating semiconductor switches, and a control system (400) in communication with the plurality of power cells (312) and controlling operation of the plurality of power cells (312), wherein the control system (400) includes a system on chip (410) with one or more central processing units (412, 414) and a field programmable gate array (416) in communication with the one or more central processing units (412, 414).

A field-programmable gate array (FPGA) architecture capable of performing immutable hardware Root-of-Trust updates and patches. In embodiments, the architecture utilizes the dielectric breakdown mechanism of magneto tunnel junctions (MTJ) to operate both as: 1) multi-time programmable (MTP) configuration memory for reconfigurable FPGA designs, and 2) one-time programmable (OTP) memory for FPGA Root-of-Trust sections.

The presently disclosed programmable fabric die includes a direct fabric die-to-fabric die interconnect interface column disposed in a sector of programmable logic fabric. Each row of the interconnect interface column includes at least one interconnect interface that is electrically coupled to a microbump. The microbump is configured to be electrically coupled to another microbump of another interconnect interface of another fabric die through an interposer. The fabric die may include multiple interconnect interface columns that each extend deep into the sector, enabling low latency connections between the fabric dies and reducing routing congestion. In some embodiments, the fabric die may include interconnect interfaces that are instead distributed throughout logic blocks of the sector.

The presently disclosed programmable fabric die includes a direct fabric die-to-fabric die interconnect interface column disposed in a sector of programmable logic fabric. Each row of the interconnect interface column includes at least one interconnect interface that is electrically coupled to a microbump. The microbump is configured to be electrically coupled to another microbump of another interconnect interface of another fabric die through an interposer. The fabric die may include multiple interconnect interface columns that each extend deep into the sector, enabling low latency connections between the fabric dies and reducing routing congestion. In some embodiments, the fabric die may include interconnect interfaces that are instead distributed throughout logic blocks of the sector.