The present disclosure discloses an acoustic output apparatus. The acoustic output apparatus may include at least one acoustic driver, a housing structure, and at least two sound guide holes. The at least one acoustic driver may output sounds having opposite phases from the at least two sound guide holes. The housing structure may be configured to carry the at least one acoustic driver. The housing structure may include a user contact surface to be in contact with a user. When the user wears the acoustic output apparatus, the user contact surface may be in contact with a body of the user. An included angle between a connection line between the at least two sound guide holes and the user contact surface may be in a range of 75°-105°.

A compact directional acoustic sensor having an improved signal-to-noise ratio is disclosed. The disclosed directional acoustic sensor includes a first sensing device configured to generate different output gains based on different input directions of external energy, and configured to generate at least one first output signal having a first polarity based on external energy received from an input direction; a second sensing device configured to generate different output gains based on different input directions of external energy, and configured to generate at least one second output signal having a second polarity, that is different than the first polarity, based on the external energy received from the input direction; and at least one signal processor configured to generate at least one final output signal based on the at least one first output signal and the at least one second output signal.

The present disclosure relates to a pair of glasses. The pair of glasses may include a frame, one or more lenses, and one or more temples. The pair of glasses may further include at least one low-frequency acoustic driver, at least one high-frequency acoustic driver, and a controller. The at least one low-frequency acoustic driver may be configured to output sounds from at least two first guiding holes. The at least one high-frequency acoustic driver may be configured to output sounds from at least two second guiding holes. The controller may be configured to direct the low-frequency acoustic driver to output the sounds in a first frequency range and direct the high-frequency acoustic driver to output the sounds in a second frequency range. The second frequency range may include one or more frequencies higher than one or more frequencies in the first frequency range.

The present disclosure relates to a pair of glasses. The pair of glasses may include a frame, one or more lenses, and one or more temples. The pair of glasses may further include at least one low-frequency acoustic driver, at least one high-frequency acoustic driver, and a controller. The at least one low-frequency acoustic driver may be configured to output sounds from at least two first guiding holes. The at least one high-frequency acoustic driver may be configured to output sounds from at least two second guiding holes. The controller may be configured to direct the low-frequency acoustic driver to output the sounds in a first frequency range and direct the high-frequency acoustic driver to output the sounds in a second frequency range. The second frequency range may include one or more frequencies higher than one or more frequencies in the first frequency range.

A speaker includes: a diaphragm having a dome shape; a tubular member having the diaphragm disposed inside, and having an inner diameter increasing toward a front; and a phase plug. The phase plug includes: a front surface, a rear surface facing a central portion on a front surface of the diaphragm at a constant interval in parallel, and a side surface connecting the front surface and the rear surface. A front surface of the phase plug is larger than a rear surface of the phase plug as viewed in a front-rear direction of a speaker. At least a part of a side surface of the phase plug has an inclined surface extending outward while extending forward, faces an inner circumferential surface of the tubular member and a front surface of the diaphragm, and directs a sound wave generated from the diaphragm toward an inner circumferential surface of the tubular member.

A speaker includes: a diaphragm having a dome shape; a tubular member having the diaphragm disposed inside, and having an inner diameter increasing toward a front; and a phase plug. The phase plug includes: a front surface, a rear surface facing a central portion on a front surface of the diaphragm at a constant interval in parallel, and a side surface connecting the front surface and the rear surface. A front surface of the phase plug is larger than a rear surface of the phase plug as viewed in a front-rear direction of a speaker. At least a part of a side surface of the phase plug has an inclined surface extending outward while extending forward, faces an inner circumferential surface of the tubular member and a front surface of the diaphragm, and directs a sound wave generated from the diaphragm toward an inner circumferential surface of the tubular member.

An open audio device includes an acoustic radiator that emits front-side acoustic radiation from its front side and emits rear-side acoustic radiation from its rear side, a front acoustic cavity that receives front-side acoustic radiation, and a rear acoustic cavity that receives rear-side acoustic radiation. At least one sound-emitting opening is acoustically coupled to the front acoustic cavity or the second acoustic cavity. The open audio device also includes a removable accessory that includes an acoustic transmission line that is acoustically coupled to the at least one sound-emitting opening when the removable accessory is attached to the open audio device.

A method of fabricating a micro-electrical-mechanical system (MEMS) transducer chip scale package. The method comprising: providing (101) a front side pre-fabricated semiconductor die wafer (1) comprising a plurality of individual die that each comprise at least a MEMS transducer. And back etching (104) the semiconductor die wafer (1) at the back side (4) of the semiconductor die wafer (1) by etching an acoustic die channel (5) through each respective die of the plurality of die and etching a die back volume (6) into each respective die of the plurality of die. The semiconductor die wafer (1) is capped with a cap wafer (16) such that a wafer level packaged MEMS transducer wafer is provided containing multiple MEMS transducer chip scale packages.

A MEMS and/or NEMS pressure sensor including, in a substrate: a stationary portion and a portion movable relative to the stationary portion, the movable portion including a sensitive element configured to move in the plane of the sensor under effect of a pressure variation; a stress gauge detecting movement of the sensitive element in the plane of the sensor due to the pressure variation; electrodes actuating the sensitive element, the actuating electrodes being borne partially by the stationary portion and partially by the movable portion, the actuating electrodes being commanded to automatically control positionwise the movement of the sensitive element; a mechanism commanding the actuating electrodes, which are configured, on the basis of signals emitted by the gauge, to bias the actuating electrodes to automatically control positionwise the movement of the sensitive element.

An acoustic vector sensor and a method of detecting an acoustic vector are described. An object suspended in the fluid medium by a non-contact support structure. The object and the non-contact support structure are configured so that the object moves in response to any disturbance of the fluid by an acoustic wave; The non-contact support structure of the object comprises a plurality of solenoids that each produce a magnetic field in a fluid medium. A measurement measures movement of the object. A processing device determines an acoustic intensity vector of the acoustic wave based on the measured movement of the object.