The present invention relates to a microelectromechanical system (MEMS) microphone array capsule. In one embodiment, a MEMS microphone includes a MEMS microphone die; an acoustic sensor array formed into the MEMS microphone die, the acoustic sensor array comprising a plurality of MEMS acoustic sensor elements, wherein respective ones of the plurality of MEMS acoustic sensor elements are tuned to different resonant frequencies; and an interconnect that electrically couples the acoustic sensor array to an impedance converter circuit.

The present disclosure relates to a waterproof open earphone. The waterproof open earphone may include a housing, at least one button, at least one elastic pad, and at least one pair of speaker units. The housing may be placed on a head or at least one ear of a user while not blocking an ear canal of the user. The at least one button may be set on the housing, wherein each of the at least one button corresponds to a button hole. The at least one elastic pad may correspond to the at least one button, respectively, wherein each elastic pad prevents the corresponding button from moving relative to the button hole. Each pair of the at least one pair of speaker units may generate sound within a frequency range from two sound guiding holes through two sound guiding tubes.

The present disclosure relates to a waterproof open earphone. The waterproof open earphone may include a housing, at least one button, at least one elastic pad, and at least one pair of speaker units. The housing may be placed on a head or at least one ear of a user while not blocking an ear canal of the user. The at least one button may be set on the housing, wherein each of the at least one button corresponds to a button hole. The at least one elastic pad may correspond to the at least one button, respectively, wherein each elastic pad prevents the corresponding button from moving relative to the button hole. Each pair of the at least one pair of speaker units may generate sound within a frequency range from two sound guiding holes through two sound guiding tubes.

The present disclosure relates to an acoustic output device. The acoustic output device may include an earphone core, a controller, a power source, and a flexible circuit board. The earphone core may include at least one low-frequency acoustic driver configured to output sounds from at least two first guiding holes and the at least one high-frequency acoustic driver configured to output sounds from at least two second guiding holes. The controller may be configured to direct the at least one low-frequency acoustic driver to output the sounds in a first frequency range and direct the at least one high-frequency acoustic driver to output the sounds in a second frequency range. The power source may be configured to provide power supply for the earphone core. The flexible circuit board may be configured to connect the earphone core with the power source.

The present disclosure relates to an acoustic output device. The acoustic output device may include an earphone core, a controller, a power source, and a flexible circuit board. The earphone core may include at least one low-frequency acoustic driver configured to output sounds from at least two first guiding holes and the at least one high-frequency acoustic driver configured to output sounds from at least two second guiding holes. The controller may be configured to direct the at least one low-frequency acoustic driver to output the sounds in a first frequency range and direct the at least one high-frequency acoustic driver to output the sounds in a second frequency range. The power source may be configured to provide power supply for the earphone core. The flexible circuit board may be configured to connect the earphone core with the power source.

Disclosed are a method of manufacturing a microphone, a microphone, and a control method thereof. The method includes forming a sound sensing module on a main substrate including a first sound aperture such that the sound sensing module is connected to the first sound aperture. The method further include forming a cover for receiving the sound sensing module formed therein with a second sound aperture corresponding to the first sound aperture on the main substrate. The method also includes forming a sound delay filter at a receiving space of the cover to be connected to the second sound aperture. The method also includes forming a semiconductor chip electrically connected to the sound sensing module at the receiving space, to selectively operate the sound delay filter according to a signal output from the sound sensing module.

A diaphragm structure including a suspension side edge and a central part is provided. The suspension side edge is connected to a periphery of the central part and surrounds the central part. The central part includes a main body part and a structural strengthening part, and the structural strengthening part is formed at a top end of the main body part.

An object is to provide a speaker device in which vibrations generated from a vibration device can be efficiently transmitted to a diaphragm, and thus sound volume can be secured and clear sound with a wide range can be produced. A speaker device 1 is a device in which a vibration device 3 is brought into contact with one flat surface of a diaphragm 2, and the device emits vibrations transmitted through the vibration device 3 from the diaphragm 2 as sound. The speaker device 1 includes: the diaphragm 2; the vibration device 3; a frame body 4 provided to the diaphragm 2 so as to surround the vibration device 3; and an elastic body 5 provided facing the flat surface of the diaphragm 2 with the frame body 4 and the vibration device 3 interposed therebetween. The frame body 4 is provided with a gap interposed between itself and an outer circumference of the vibration device 3. The elastic body 5 is laid across the frame body 4 and the vibration device 3, and fastened to the frame body 4 and the vibration device 3. The frame body 4, the vibration device 3, and the elastic body 5 are integrated with each other.

An object is to provide a speaker device in which vibrations generated from a vibration device can be efficiently transmitted to a diaphragm, and thus sound volume can be secured and clear sound with a wide range can be produced. A speaker device 1 is a device in which a vibration device 3 is brought into contact with one flat surface of a diaphragm 2, and the device emits vibrations transmitted through the vibration device 3 from the diaphragm 2 as sound. The speaker device 1 includes: the diaphragm 2; the vibration device 3; a frame body 4 provided to the diaphragm 2 so as to surround the vibration device 3; and an elastic body 5 provided facing the flat surface of the diaphragm 2 with the frame body 4 and the vibration device 3 interposed therebetween. The frame body 4 is provided with a gap interposed between itself and an outer circumference of the vibration device 3. The elastic body 5 is laid across the frame body 4 and the vibration device 3, and fastened to the frame body 4 and the vibration device 3. The frame body 4, the vibration device 3, and the elastic body 5 are integrated with each other.

Disclosed are an acoustic module and an electronic product. The acoustic module comprises: a module housing, comprising an upper housing and a lower housing, wherein the upper housing of the module has a side wail and a top wall, the side wall has a through hole thereon, a distance between an upper edge of the through hole and the top wall is greater than or equal to one half of an overall height of the side wall, and the upper housing is capable of being fastened onto the lower housing; a fixing member; and a microphone; wherein the fixing member is fastened and fixed in the upper housing, the fixing member is configured to fix the microphone on an inner surface of the top wall, and the fixing member has a sound channel formed therein through which the microphone and the through hole are connected and are in communication.