A heater for a radio frequency (RF) antenna and method for using the same are disclosed. In one embodiment, an antenna comprises a physical antenna aperture having an array of RF antenna elements; and a plurality of heating elements, each heating element being between pairs of RF elements of the array of RF elements.

The present disclosure relates to a control circuit for an electric blanket. The control circuit includes a main control circuit composed of a relatively low voltage power conversion circuit, a heating main loop, a micro control unit (MCU) main control circuit, an active/passive protection circuit and a main power carrier serial port circuit. The control circuit further includes a sub-control circuit. The sub-control circuit is composed of an auxiliary power carrier serial port circuit, a sub-control power extraction circuit, an MCU sub-control circuit, a function key input circuit and a display circuit. The main control circuit and the sub-control circuit exchange operating state information and user control information through the main power carrier serial port circuit and the auxiliary power carrier serial port circuit to implement heating control of the electric blanket in a mutually cooperative control mode.

A heating element includes an electrically insulating layer; resistive layer formed of a positive temperature coefficient material; and an electrically conductive layer disposed between the electrically insulating layer and the resistive layer and including a first bus and a second bus that is spaced apart from the first bus, the resistive layer electrically connecting the first bus and the second bus. The electrically insulating layer, the electrically conductive layer, and the resistive layer are stacked to form a lamination and the lamination having a thickness and a width and length extending orthogonal to the thickness. The lamination may have slits extending through the thickness thereof and along a portion of the length thereof. Terminals may be connected to the buses and arranged to provide a counter current flow pattern across the lamination. The lamination may be used in a warming device and in connection with a patient warming system.

An apparatus may include an enclosure that includes a plurality of mounting features that are configured to receive information handling systems; one or more environmental sensors configured to determine environmental conditions associated with the enclosure; a position sensor configured to determine a geodetic location of the enclosure; a heater configured to heat the enclosure; and a heater control system. The heater control system may be configured to: receive information regarding an origin for the enclosure, a destination for the enclosure, and a desired destination temperature for the enclosure; establish a model for the enclosure, wherein the model incorporates data from the one or more environmental sensors and data from the position sensor; and based on the model, predictively determining control parameters for the heater configured to cause the enclosure to reach the desired destination temperature at or before a time of arrival at the destination.

The invention relates to an electrically conductive film (10) having an electrically nonconductive substrate layer (12), and an electrically conductive metal layer (14) that has a structure produced by material removal and that on a first side is joined, at least in sections, to the substrate layer (12).

A method and apparatus for thermally processing material on a low-temperature substrate using pulsed light from a flash lamp is disclosed. Material is conveyed past the flash lamp. The pulses of light are formed by Pulse Width Modulation to tailor the shape of the pulses to generate a thermal gradient in the substrate that enables the material to be heated beyond the maximum working temperature of the substrate without damage. Its shaped pulse rate is synchronized to the conveyance speed of a conveyance system. By using the information from a feedback sensor, the thermal gradient is recalculated to alter the shape of the pulses in real time for optimizing subsequent curings in real time without powering down the curing apparatus. The combined pulse shaping and synchronization allow a temperature profile to be tailored in the sample that is uniformly cured in the conveyance direction.

Provided are a structure, a planar heater including the same, a heating device including the planar heater, and a method of preparing the structure. The structure includes a metal substrate, an insulating layer disposed on the metal substrate, an electrode layer disposed on the insulating layer, and an electrically conductive layer disposed on the electrode layer, wherein a difference in a coefficient of thermal expansion (CTE) between the metal substrate and the insulating layer is 4 parts per million per degree Kelvin change in temperature (ppm/K) or less.

A liquid crystal device, including two substrates disposed opposite to each other, a liquid crystal layer disposed between the two substrates, and multiple heating units disposed on at least one of the two substrates, is provided. Each heating unit includes a heater and a switch element coupled to the heater. The liquid crystal device according to the embodiments of the disclosure may operate in different ambient temperatures.

A system and method for heating a surface. The system can be a solar panel system and the surface can be a solar panel. The system includes a heat source and a processor. The processor determines an amount of heating energy for removing an accumulated material from the solar panel to obtain an unobstructed solar panel, determines an amount of energy production of the unobstructed solar panel, and controls the heat source to apply the determined amount of heating energy to the solar panel when the determined amount of energy production is greater than the amount of heating energy.

Provided are a structure, a planar heater including the same, a heating device including the planar heater, and a method of preparing the structure. The structure includes a metal substrate, an insulating layer disposed on the metal substrate, an electrode layer disposed on the insulating layer, and an electrically conductive layer disposed on the electrode layer, wherein a difference in a coefficient of thermal expansion (CTE) between the metal substrate and the insulating layer is 4 parts per million per degree Kelvin change in temperature (ppm/K) or less.