An electrical connector includes a power feeding portion and a powered portion that contacts the power feeding portion. At least one of the power feeding portion and the powered portion includes a surface layer, a primary coat layer, and an exposed portion. The surface layer is made of a first conductive metal and includes a contact portion where the power feeding portion contacts the powered portion. The primary coat layer mounts the surface layer and is made of a second conductive metal. The exposed portion is separated from the contact portion and exposed to an atmosphere.

An evaporator assembly for an aerosol generating device is described. The evaporator assembly comprises a first body having a first plurality of through-channels, a second body having a second plurality of through-channels, wherein the first body and the second body are arranged such that the first and second plurality of through-channels overlap to allow the passage of a liquid from an inlet end to an outlet end of the evaporator assembly through the through-channels; and a heater arranged to heat the liquid as it passes through the through-channels, wherein the second body is moveable with respect to the first body such that the area of overlap is adjustable.

A heater assembly having a laminate heater plate and a shaft. The laminate heater plate is formed from a plurality of layers, wherein one or more layers may comprise one or more of a heating element, an RF electrode, a cooling channel, and an RTD sensor.

A heater section includes a plate-like ceramic body (a first substrate layer 1, a second substrate layer 2, and a third substrate layer 3) having a longitudinal direction (front-rear direction) and a short-length direction (left-right direction), and a heater 72 disposed within the plate-like ceramic body and including a lead section 79 and a heating section 76 connected to the lead section 79. The heating section 76 includes a straight portion 78 extending along the longitudinal direction, and a lead side curved portion 77b connected to one of the ends of the straight portion 78 closer to the lead section 79. The lead side curved portion 77b has a lower resistance per unit length than the straight portion 78 at one or more temperatures in the range of 700° C. to 900° C.

A method for producing an electromigration-resistant crystalline transition-metal silicide layer of a layer sequence, for example, to provide a micro heater includes, supplying a semiconductor substrate including an electrically insulating layer; physically depositing a transition metal on the electrically insulating layer; carrying out a plasma-enhanced chemical vapor deposition while forming an inert gas plasma; conveying monosilane to the inert gas plasma, with the monosilane decomposing into silicon and hydrogen and the silicon in the gaseous phase entering into a chemical reaction with the transition metal in order to form the electromigration-resistant crystalline transition-metal silicide layer.

A substrate processing method includes forming, by supplying a chemical liquid onto a central portion of a substrate while rotating a rotary table at a first speed, a liquid film of the chemical liquid having a first thickness; forming, by supplying the chemical liquid onto the central portion while rotating the rotary table at a second speed lower than the first speed after the forming of the liquid film having the first thickness, a liquid film of the chemical liquid having a second thickness larger than the first thickness; and heating, by heating the rotary table in a state that the rotary table is rotated at a third speed lower than the second speed or in a state that the rotating of the rotary table is stopped after the forming of the liquid film having the second thickness, the substrate and the liquid film of the chemical liquid.

Provided are a plate type heater and a vapor deposition apparatus including the same including: a ceramic plate substrate; a heating wire layer located on the inside or on an upper surface of the ceramic plate substrate; a power supply line; and a bridge located on the heating wire layer and connecting the heating wire and the power supply line, wherein the bridge connects the heating wire and the power supply line by curving a bridge material having a length of 1.2 to 5 times based on the shortest distance between the heating wire and the power supply line.

A heater includes a plate-shaped part, one or more resistance heating element, a columnar part, and a plurality of relay conductors. The plate-shaped part has an insulation property and includes an upper surface on which a wafer is to be superimposed and a lower surface on an opposite side to the upper surface. The one or more resistance heating element is buried in the plate-shaped part. The columnar part has an insulation property and projects downward from the lower surface of the plate-shaped part. The plurality of relay conductors respectively include extension portions vertically extending inside the columnar part and are electrically connected to the one or more resistance heating elements.

A heater includes a base body and an internal conductor. The base body is made of ceramic. The internal conductor is located inside the base body and includes a connection portion. The base body includes a space extending from the connection portion to a lower surface of the base body. The space includes a first space and a second space. The first space contacts with the connection portion. The second space connects the first space and an outer side of the lower surface of the base body, and is smaller than the first space in a planar perspective of the lower surface of the base body.

Disclosed is a multilayer structure, comprising: a first heater layer comprising a CNT heater, wherein the CNT heater comprises a composite of carbon nanotubes and silicone; and a second heater layer comprising a PTC heater, wherein the PTC heater comprises a composite of carbon black and polymer; wherein the first heater layer and the second heater layer are first and second respectively in an electrical series; wherein the first heater layer has a negative temperature coefficient with respect to electrical resistivity; and wherein the second heater layer has a positive temperature coefficient with respect to electrical resistivity. Also disclosed is an aircraft component comprising the multilayer structure.