A heater for a semiconductor processing chamber is disclosed that includes a ceramic body, and a resistive heating element embedded in the ceramic body, the resistive heating element disposed in a heater coil having an inner central sector and an outer central sector, the inner central sector having a plurality of first peaks and the outer central sector having a plurality of second peaks, wherein the number of first peaks is less than about fifty-six, and the number of second peaks is less than about eighty.

An electronic vaporizer includes a main unit, an atomizer and a mouthpiece. The atomizer is removably coupled to the main unit. The mouthpiece is removably coupled to the atomizer. The atomizer includes an atomizer base, a heating electrode coupled to the atomizer base, a temperature sensing electrode coupled to the atomizer base, a heating element electrically coupled to the heating electrode and the temperature sensing electrode, and a heating crucible thermally coupled to the heating element. The heating element includes a heating element base, a heating circuit encapsulated within the heating element base and a temperature sensing circuit encapsulated within the heating element base.

A method for creating an electric heating source, including a body equipped with one or more housings containing mineral-insulated heating cables. The housings communicate with one or more reservoirs which accept a purely metallic solder material in solid, powder or sheet form. The device is heated in a vacuum degassing plateau, followed by a casting plateau during which the solder melts and fills the housing around the heating cables, resulting in full metal contact between the cables and the body, providing a more uniform temperature and a shorter response time to heating or cooling. Also, a heating source obtained in this manner, including an infrared faired source or an immersion heater for the heating of a liquid bath of molten metal.

The present invention relates to a ceramic heater. The ceramic heater of the present invention comprises: a heater plate in which a heating element is disposed and which is made of a ceramic material; a shaft which has a tubular shape with a through-hole and is coupled to the bottom surface of the heater plate and in which a rod for supplying power to the heating element through the through-hole is received; and a continuous or discontinuous air pocket which is provided in a joint with which the heater plate and the shaft come into contact and by which the heater plate and the shaft are coupled to each other, wherein the air pocket is formed along the joining surface of the joint.

An electronic vaporizer includes a main unit, an atomizer and a mouthpiece. The atomizer is removably coupled to the main unit. The mouthpiece is removably coupled to the atomizer. The atomizer includes an atomizer base, a heating electrode coupled to the atomizer base, a temperature sensing electrode coupled to the atomizer base, a heating element electrically coupled to the heating electrode and the temperature sensing electrode, and a heating crucible thermally coupled to the heating element. The heating element includes a heating element base, a heating circuit encapsulated within the heating element base and a temperature sensing circuit encapsulated within the heating element base.

A heater assembly having a laminate heater plate and a shaft. The laminate heater plate is formed from a plurality of layers, wherein one or more layers may comprise one or more of a heating element, an RF electrode, a cooling channel, and an RTD sensor.

A wafer placement table includes a ceramic plate, an electrode embedded in the ceramic plate, a hollow ceramic shaft attached to a surface of the ceramic plate, a power-supplying member running inside the ceramic shaft and connected to a terminal of the electrode, a plate-side attaching site defined on the ceramic plate and to which the power-supplying member is attached, and a power-source-side attaching site defined at a free end of the ceramic shaft and to which the power-supplying member is attached. The power-source-side attaching site is defined in correspondence with the plate-side attaching site and in such a manner as to be shifted from the plate-side attaching site in plan view. The power-supplying member includes a redirecting portion where the power-supplying member extending from the power-source-side attaching site is forcibly redirected toward the plate-side attaching site.

A wafer placement table includes a ceramic plate, an electrode embedded in the ceramic plate, a hollow ceramic shaft attached to a surface of the ceramic plate, a power-supplying member running inside the ceramic shaft and connected to a terminal of the electrode, a plate-side attaching site defined on the ceramic plate and to which the power-supplying member is attached, a power-source-side attaching site defined at a free end of the ceramic shaft and to which the power-supplying member is attached, and a redirecting member provided inside the ceramic shaft. The power-source-side attaching site is defined in correspondence with the plate-side attaching site and in such a manner as to be shifted from the plate-side attaching site in plan view. The redirecting member holds the power-supplying member such that the power-supplying member extending from the power-source-side attaching site is forcibly redirected toward the plate-side attaching site.

A heater includes: a first cordierite substrate; a glass portion provided on the first cordierite substrate; and an electrically heating portion embedded in the glass portion, wherein the glass portion comprises MgO, Al.sub.2O.sub.3 and SiO.sub.2.

An ultrafine bubble generating apparatus and an ultrafine bubble generating method capable of efficiently generating an ultrafine bubble-containing liquid with high purity are provided. In order to this, a heating element provided in a liquid is caused to generate heat, and film boiling is made on an interface between the liquid and the heating element. A film boiling bubble is generated by the film boiling, and ultrafine bubbles are thus generated near the film boiling bubble.