A heating appliance includes a housing having interior walls with interior surfaces defining a cooking chamber for heating food, a microwave heating source configured to generate microwave radiation for heating the food, and a thermoresistive heating plate disposed in an opening defined in an interior wall. The thermoresistive heating plate has a substrate having an inner surface aligned with the interior surface of the interior wall, and a bottom surface opposite to the inner surface. The thermoresistive heating plate includes a thermoresistive coating disposed on the bottom surface configured to generate heat upon application of an electric current such that the heat is transmitted through the substrate to the cooking chamber from the thermoresistive coating, the microwave heating source, or both, and the substrate is transparent to microwave radiation to allow microwave emission through the substrate.

An embodiment includes an apparatus for controlling temperature of a substrate, an apparatus for treating a substrate comprising the same, and a method of controlling the same, which may control the temperature of the substrate by each area and not increasing the volume of the apparatus. The substrate temperature control apparatus comprises: a support plate for supporting a substrate; a plurality of heating units placed in different area of the substrate and controlling a temperature of the substrate by each area; a power supply unit for providing a power to control the temperature of the substrate; a switch unit connected between the plurality of heating units and the power supply unit, and obtaining one or more of a transistor device; and a controller for controlling a power which is supplied to each heating units by controlling unit.

A water detecting and ejecting sensor device includes a housing, a ceramic substrate, an integrated circuit and a sensor. The housing includes a cavity and the integrated circuit is disposed on a ceramic substrate. The sensor is disposed on the integrated circuit. The ceramic substrate includes one or more ports to expose the cavity to a surrounding environment, and each port includes at least two mesh layers.

A thermal emitter includes a freestanding membrane supported by a substrate, wherein the freestanding membrane includes in a lateral extension a center section, a conductive intermediate section and a border section, wherein the conductive intermediate section laterally surrounds the center section and is electrically isolated from the center section, the conductive intermediate section including a conductive semiconductor material that is encapsulated in an insulating material, wherein the border section at least partially surrounds the intermediate section and is electrically isolated from the conductive intermediate section, and wherein a perforation is formed through the border section.

An integral resistance heater is disclosed. The heater includes a beryllium oxide (BeO) ceramic body having a first surface and a second surface. A heating element is formed from a metal foil or metallizing paint and is printed onto the top or second surface of the beryllium oxide ceramic body.

A ceramic heater with a shaft includes: a ceramic plate in which a resistance heating element is embedded; a hollow ceramic shaft having an upper end bonded to a surface on an opposite side of a wafer placement surface of the ceramic plate; and a shaft heater embedded in a side wall near an upper end of the ceramic shaft.

A ceramic structure 10 includes a heater electrode 14 within a disk-shaped AlN ceramic substrate 12. The heater electrode 14 contains a metal filler in the main component WC. The metal filler (such as Ru or RuAl) has a lower resistivity and a higher thermal expansion coefficient than AlN. An absolute value of a difference |ΔCTE| between a thermal expansion coefficient of the AlN ceramic substrate 12 and a thermal expansion coefficient of the heater electrode 14 at a temperature in the range of 40° C. to 1000° C. is 0.35 ppm/° C. or less.

The present invention relates to a ceramic heater for independently controlling a middle region, and more specifically, to a ceramic heater comprising: a center-edge heating element provided at a position corresponding to a center region and an edge region of a heating surface of the ceramic heater; and a middle heating element provided at a position corresponding to a middle region which is surrounded by the center region and the edge region of the heating surface of the ceramic heater, and thus the present invention has an effect whereby the respective temperatures of three divided regions may be

An electrostatic chuck heater includes an electrostatic chuck including an electrostatic electrode embedded in a ceramic sintered body, a cooling member cooling the electrostatic chuck, and a heater layer disposed between the electrostatic chuck and the cooling member and including a plurality of metal layers embedded therein in multiple stages, the metal layers including resistance heating element layers. The heater layer includes a ceramic insulating layer with a thickness of 2 μm or more and 50 μm or less between the metal layers.

A PTC heating device exhibits a good degree of efficiency while providing good electrical insulation of the device's PTC element. The insulation of the PTC heating device comprises a film and a layer that is bonded to the film and made of brown compact which comprises non-sintered ceramic particles. Also disclosed is a method in which ceramic particles are provided with a binding agent, and the mass thus produced is applied in a planar manner onto a film and bonded to the film. The multilayer insulation thus produced is placed around the PTC element and the conductor tracks, and the binding agent is subsequently removed, at least in part.