Embodiments of the present invention include a novel continuous or semi-continuous process which results in the partial or total improvement of heavy oil. The improvement of the heavy oil is a result of thermally heating the oil at an interval where visbreaking occurs, thereby reducing a viscosity of the heavy oil. The core of the heating step occurs through a heating apparatus of the packed bed type including superparamagnetic, paramagnetic, and/or magnetic materials.

Examples of a substrate processing apparatus includes a substrate carrier apparatus including a shaft, at least one carrier arm that is fixed to the shaft and rotates as the shaft rotates, and at least one thermometer fixed to the carrier arm, a susceptor, a heater that heats the susceptor, a temperature regulator that controls the heater, and a control unit that acquires a measured temperature, which is a surface temperature, of the susceptor obtained by the thermometer by bringing the carrier arm close to the susceptor and control the temperature regulator.

A method of thermally processing a material with a thermal processing system includes providing a material for treating in an in-line thermal process to a heating system, providing a force to the material at a portion of the material configured to be heated by the heating system, adjusting the heating system to a specified temperature value, and heating the portion of the material to the specified temperature value while the portion of the material is under the force to change a magnetic property in the portion of the material. The heating system is moveable from a first position that is away from a path of the material through the in-line thermal process to a second position in which the heating system is configured to heat the portion of the material to the specified temperature value. The heating system can include induction-based heating.

Provided are a wafer heating and holding mechanism for a rotary table, a wafer heating method for a rotary table, and a wafer rotating and holding device with which a wafer put on a rotary table can be heated while being rotated stably under a state in which an in-plane temperature distribution of the wafer is maintained. The wafer heating and holding mechanism for a rotary table of a wafer rotating and holding device comprises: a rotary shaft; a rotary table placed on an end of the rotary shaft and configured to hold a wafer on an upper surface of the rotary table; a drive motor configured to supply motive power to the rotary shaft; and heating means provided above the rotary table and below the wafer while avoiding contact with the wafer to heat the wafer.

A fluid heating component including: a porous body made of ceramics and formed with through channels through which a fluid passes, and a conductive coating layer disposed on a through channel surface of at least a part of each through channel, wherein the conductive coating layer is electrically connected, and is continuous.

A fluid heating component including: a pillar-shaped member made of ceramics and formed with through channels through which a fluid passes, and a conductive coating layer disposed on at least a part of a circumferential surface of the pillar-shaped member, wherein the conductive coating layer is disposed on coats the whole circumference of a cut surface of the pillar-shaped member in a state where the conducive coating layer is electrically connected, in the cut surface of the pillar-shaped member which is perpendicular to a passing direction of the fluid.

Pasteurization systems, devices and methods are generally described that use synchronized peak electric and magnetic fields. Example pasteurization systems may include a first resonant circuit that includes a first capacitive element coupled to a first inductive element, a second resonant circuit that includes a second capacitive element coupled to a second inductive element. The first inductive element and the second capacitive element may be positioned about the first treatment region, and the second inductive element and the first capacitive element may be positioned about the second treatment region. A controller coupled to the first and second resonant circuits may provide a first signal to the first resonant circuit and a second signal to the second resonant circuit, phase shifted by a predetermined amount.

Adjustable system and methods are provided that are used in curing a foam item. Induction heating assemblies, cooling mechanisms and a dynamic conveyance mechanism may be used in combination to heat and cool a mold containing the foam item as it is conveyed. The dynamic conveyance mechanism may have removable rollers that allow for chambers, such as the induction heating assemblies, to be placed into areas where removable rollers have been removed. As such, utilizing a dynamic conveyance mechanism chambers to be placed into, taken out of, and moved around the dynamic conveyance mechanism. The flexibility of a dynamic conveyance mechanism allows for a curing process to be automated, adjusted, and customized.

Systems, methods, and apparatuses for treating petroleum in a container are disclosed herein. The method includes electrically heating a portion of the container to generate heat sufficient to create convection currents in the petroleum. The method also includes stopping heating after the petroleum cools below a threshold temperature. The systems, methods, and apparatuses mitigate yield stress in petroleum susceptible to gelling.

Systems and methods are provided that are used in curing a foam item. Induction heating assemblies, cooling mechanisms and a dynamic conveyance mechanism may be used in combination to heat and cool a mold containing the foam item as it is conveyed. The dynamic conveyance mechanism may have removable rollers that allow for chambers, such as the induction heating assemblies, to be placed into areas where removable rollers have been removed. As such, utilizing a dynamic conveyance mechanism chambers to be placed into, taken out of and moved around the dynamic conveyance mechanism. The flexibility of a dynamic conveyance mechanism allows for a curing process to be automated, adjusted, and customized.