WAFER HEATING AND HOLDING MECHANISM AND METHOD FOR ROTARY TABLE, AND WAFER ROTATING AND HOLDING DEVICE

Abstract

Provided are a wafer heating and holding mechanism for a rotary table, a wafer heating method for a rotary table, and a wafer rotating and holding device with which a wafer put on a rotary table can be heated while being rotated stably under a state in which an in-plane temperature distribution of the wafer is maintained. The wafer heating and holding mechanism for a rotary table of a wafer rotating and holding device comprises: a rotary shaft; a rotary table placed on an end of the rotary shaft and configured to hold a wafer on an upper surface of the rotary table; a drive motor configured to supply motive power to the rotary shaft; and heating means provided above the rotary table and below the wafer while avoiding contact with the wafer to heat the wafer.

Claims

1. A wafer heating and holding mechanism for a rotary table of a wafer rotating and holding device, the wafer heating and holding mechanism comprising: a rotary shaft; a rotary table placed on an end of the rotary shaft and the rotary table being configured to hold a wafer on an upper surface of the rotary table; a drive motor configured to supply motive power to the rotary shaft; and a heating means provided above the rotary table and below the wafer while avoiding contact with the wafer to for heating the wafer.

2. A wafer heating and holding mechanism according to claim 1, further comprising a reflective board provided between the rotary table and the heating means.

3. A wafer heating and holding mechanism according to claim 1, further comprising: a contactless electric power supply mechanism for the rotary table, the contactless electric power supply mechanism comprising: a fixed-side primary coil wound around the rotary shaft; an electric power supply source connected to the fixed-side primary coil; a rotary table-side secondary coil provided so as to correspond to the fixed-side primary coil and separated from the fixed-side primary coil by a predetermined distance, the rotary table-side secondary coil being mounted to the rotary table; and a load connected to the rotary table-side secondary coil, wherein the heating means is supplied with electric power via the rotary table-side secondary coil by electromagnetic induction.

4. A wafer heating method for a rotary table, the method comprising: heating a wafer by a wafer heating and holding mechanism for the rotary table, the wafer heating and holding mechanism comprising: a rotary shaft, the rotary table placed on an end of the rotary shaft and the rotary table being configured to hold a wafer on an upper surface of the rotary table; a drive motor configured to supply motive power to the rotary shaft; and a heating means provided above the rotary table and below the wafer while avoiding contact with the wafer for heating the wafer.

5. A wafer rotating and holding device, comprising: a wafer heating and holding mechanism for a rotary table, the wafer heating and holding mechanism comprising: a rotary shaft, the rotary table placed on an end of the rotary shaft and the rotary table being configured to hold a wafer on an upper surface of the rotary table; a drive motor configured to supply motive power to the rotary shaft; and a heating means provided above the rotary table and below the wafer while avoiding contact with the wafer for heating the wafer.

6. A wafer rotating and holding device according to claim 5, further comprising a spin processing mechanism.

7. A wafer rotating and holding device according to claim 5, further comprising a reflective board provided between the rotary table and the heating means.

8. A wafer rotating and holding device according to claim 5, further comprising: a contactless electric power supply mechanism for the rotary table, the contactless electric power supply mechanism comprising: a fixed-side primary coil wound around the rotary shaft; an electric power supply source connected to the fixed-side primary coil; a rotary table-side secondary coil provided so as to correspond to the fixed-side primary coil and separated from the fixed-side primary coil by a predetermined distance, the rotary table-side secondary coil being mounted to the rotary table; and a load connected to the rotary table-side secondary coil, wherein the heating means is supplied with electric power via the rotary table-side secondary coil by electromagnetic induction.

9. A wafer rotating and holding device according to claim 7, further comprising: a contactless electric power supply mechanism for the rotary table, the contactless electric power supply mechanism comprising: a fixed-side primary coil wound around the rotary shaft; an electric power supply source connected to the fixed-side primary coil; a rotary table-side secondary coil provided so as to correspond to the fixed-side primary coil and separated from the fixed-side primary coil by a predetermined distance, the rotary table-side secondary coil being mounted to the rotary table; and a load connected to the rotary table-side secondary coil, wherein the heating means is supplied with electric power via the rotary table-side secondary coil by electromagnetic induction.

10. A wafer heating method according to claim 4, further comprising providing a reflective board provided between the rotary table and the heating means.

11. A wafer heating method according to claim 4, further comprising: providing a contactless electric power supply mechanism for the rotary table, the contactless electric power supply mechanism comprising: a fixed-side primary coil wound around the rotary shaft; an electric power supply source connected to the fixed-side primary coil; a rotary table-side secondary coil provided so as to correspond to the fixed-side primary coil and separated from the fixed-side primary coil by a predetermined distance, the rotary table-side secondary coil being mounted to the rotary table; and a load connected to the rotary table-side secondary coil, wherein the heating means is supplied with electric power via the rotary table-side secondary coil by electromagnetic induction.

12. A wafer heating method according to claim 10, further comprising: providing a contactless electric power supply mechanism for the rotary table, the contactless electric power supply mechanism comprising: a fixed-side primary coil wound around the rotary shaft; an electric power supply source connected to the fixed-side primary coil; a rotary table-side secondary coil provided so as to correspond to the fixed-side primary coil and separated from the fixed-side primary coil by a predetermined distance, the rotary table-side secondary coil being mounted to the rotary table; and a load connected to the rotary table-side secondary coil, wherein the heating means is supplied with electric power via the rotary table-side secondary coil by electromagnetic induction.

13. A wafer heating method according to claim 4, further comprising providing a spin processing mechanism.

14. A wafer heating and holding mechanism according to claim 2, further comprising: a contactless electric power supply mechanism for the rotary table, the contactless electric power supply mechanism comprising: fixed-side primary coil wound around the rotary shaft; an electric power supply source connected to the fixed-side primary coil; a rotary table-side secondary coil provided so as to correspond to the fixed-side primary coil and separated from the fixed-side primary coil by a predetermined distance, the rotary table-side secondary coil being mounted to the rotary table; and a load connected to the rotary table-side secondary coil, wherein the heating means is supplied with electric power via the rotary table-side secondary coil by electromagnetic induction.

15. A wafer heating and holding mechanism according to claim 1, further comprising a spin processing mechanism.

Description

BRIEF DESCRIPTION OF DRAWINGS

[0016] FIG. 1 is a schematic diagram of one embodiment of a wafer rotating and holding device comprising a wafer heating and holding mechanism for a rotary table according to the present invention.

[0017] FIG. 2 is an enlarged view of a main part of the wafer rotating and holding device comprising the wafer heating and holding mechanism for the rotary table according to the present invention.

[0018] FIG. 3 is a block diagram of a heating mechanism of the wafer heating and holding mechanism for the rotary table according to the present invention.

[0019] FIG. 4 is a schematic diagram for illustrating a mode of carrying out an electric power supply mechanism, which can be used in the wafer holding mechanism for the rotary table according to the present invention.

MODES FOR CARRYING OUT THE INVENTION

[0020] An embodiment of the present invention is described below, but the embodiment is described as an example, and hence it is to be understood that various modifications may be made thereto without departing from the technical idea of the present invention. In addition, the same members are denoted by the same reference symbols.

[0021] In FIG. 1, a wafer heating and holding mechanism for a rotary table according to the present invention is denoted by a reference symbol 10. The wafer heating and holding mechanism 10 for the rotary table is a wafer heating and holding mechanism for a rotary table of a wafer rotating and holding device 11, and comprises: a rotary shaft 18; a rotary table 12 placed on an end of the rotary shaft 18 and configured to hold a wafer W on an upper surface of the rotary table 12; a drive motor 20 configured to supply motive power to the rotary shaft 18; and heating means 14 provided above the rotary table 12 and below the wafer W without being in contact with the wafer W to heat the wafer W. In the present invention, the heating means 14 is disposed between the rotary table 12 and the wafer W to heat the wafer W directly while avoiding contact between the heating means 14 and the wafer W. It is therefore possible to cause the temperature of the wafer W alone to rise, to thereby heat the wafer W efficiently under reduced external influence. As a result, it is possible to perform spin processing under a state in which an in-plane temperature distribution is maintained.

[0022] In FIG. 1, a reflective board is denoted by a reference symbol 16. As illustrated in FIG. 1, it is preferred for the wafer heating and holding mechanism 10 for the rotary table to comprise the reflective board 16 and to dispose the heating means 14 on the reflective board 16 so that heat is not transmitted to the rotary table 12. It is also preferred to provide a space between the reflective board 16 and the rotary table 12 with the use of a spacer 28. A resin sheet 26 is preferred to be provided on the heating means 14 in order to prevent liquids from coming into contact with the heating means 14. A synthetic resin sheet, for example, a fluororesin sheet, is a preferred resin sheet. The resin sheet used in FIG. 1 is a PFA sheet.

[0023] The heating means 14 is not particularly limited and can be a known heater. A preferred heater is a carbon heater or a halogen heater, for example. There is no particular limitation on how the heating means 14 is disposed in the rotary table 12, but it is preferred to provide a plurality of heaters 14 evenly. It is further preferred to provide a plurality of heaters 4 in a radial pattern, a swirl pattern or a donut pattern. An example in which eight 150-watt heaters 14 are provided evenly in a radial pattern is illustrated in FIG. 2.

[0024] FIG. 3 is a block diagram of a heating mechanism in the wafer heating and holding mechanism for the rotary table according to the present invention. The temperature of the wafer W is detected with a temperature sensor 34 constantly while current from a power source 30 is applied. The wafer W is rotated, and the heating means 14, which is a heater or the like, is powered on with the use of a SW circuit 36 to start heating by the heating means 14. A signal received from the temperature sensor 34 is used to control the powering on/off of the heater 14 with the SW circuit 36. Other than the SW circuit 36, a temperature fuse 38 and a bimetal 40 may be used to control the powering on/off of the heating means 14.

[0025] In FIG. 1, outer peripheral pins, which support the outer periphery of the wafer, are each denoted by a reference symbol 22 and support pins, which support a lower surface of the wafer W, are each denoted by a reference symbol 24. It is preferred to configure at least one of the outer peripheral pins 22 as a movable pin, which can be moved so as to open and close when the wafer is set.

[0026] In the illustrated example, the rotary shaft 18 is made of stainless steel (SUS), and the rotary table 12 is made of industrial plastic or other types of synthetic resin. The number of revolutions of the rotary table 12 is not particularly limited, but 100 rpm to 1,000 rpm is preferred. A silicon wafer is preferred as the wafer W.

[0027] There is no particular limitation on how electric power is supplied to the heating means 14. However, it is preferred to supply required electric power to the heating means disposed above the rotary table from a power source built in the rotary table. As methods of supplying electric power, there can be given, for example, one in which electric power is supplied from a battery embedded in the rotary table and motor driving is switched with a centrifugal force obtained by rotating the rotary table, one in which electric power is supplied from the rotary shaft by utilizing a slip ring to start rotation at the same time as electric power feeding, and one in which electric power is supplied to the rotary table with the use of electromagnetic induction to start rotation at the same time as electric power feeding. In FIG. 1, electric power is supplied to the heating means 14 from a power source provided in a lower part of the rotary table 12, via electric wires 32.

[0028] An electric power supply mechanism 70 is illustrated in FIG. 4 as a mode of carrying out electric power supply means that uses the method of using the electromagnetic induction. The electric power supply mechanism 70 in FIG. 4 comprises: the rotary shaft 18; the rotary table 12 placed on an end of the rotary shaft 18 and configured to hold the wafer W on the upper surface of the rotary table 12; the drive motor 20 configured to supply motive power to the rotary shaft 18; a fixed-side primary coil 72 wound around the rotary shaft 18; an electric power supply source 74 connected to the fixed-side primary coil 72; and a rotary table-side secondary coil 76, which is provided so as to correspond to the fixed-side primary coil 72 and be separated from the fixed-side primary coil 72 by a predetermined distance, and is mounted to the rotary table 12. A rotation control motor is connected to the rotary table-side secondary coil 76 via electric wires 80 so that electric power is supplied to the heating means 14 by electromagnetic induction via the secondary coil 76.

[0029] It is preferred for the wafer rotating and holding device according to the present invention to comprise a spin processing mechanism. The spin processing mechanism is, for example, an etching processing mechanism in a spin etching device, a drying mechanism in a spin drying device, or a coating mechanism in a spin coating device. As other spin processing mechanisms, there can be given, as processing to be performed on a wafer surface in manufacturing processes for a device, in addition to the etching processing mechanism for removing a damaged layer after back-grinding, a mechanism for applying developer to the wafer, a mechanism for performing developing processing on the wafer, which has a surface that has circuit patterns exposed thereon and is applied with developer, and which is printed with a semiconductor circuit, and a mechanism for cleaning the wafer surface, and the like. Chemical solutions to be used in the processing are not particularly limited, and acid-based/alkaline-based etching cleaning liquids and rinse water can be suitably used.

[0030] In the present invention, a wafer substrate is heated directly and constantly during spin processing by heating means disposed between the rotary table and the wafer substrate, with the result that it is possible to perform stable spin processing under a state in which the in-plane temperature distribution is maintained. Etching can be performed under reduced external influence because of the direct heating of the wafer. For instance, when SiO.sub.2 is to be removed with an HF etchant and the etchant is supplied at room temperature without being heated, the HF etchant is heated on the wafer by heating the wafer directly, and the etching rate thereof is raised as a result. This lessens the deterioration of HF etchant and prolongs the life thereof. According to the present invention, the risk of using HF, which is highly volatile and thus dangerous at a raised temperature, is reduced as well.

[0031] A wafer heating method for a rotary table according to the present invention is a method of heating a wafer with the use of the wafer heating and holding mechanism for the rotary table. The wafer rotating and holding device is a device comprising the wafer heating and holding mechanism for the rotary table.

REFERENCE SIGNS LIST

[0032] 10: wafer heating and holding mechanism for rotary table according to the present invention, 11: wafer rotating and holding device according to the present invention, 12, 32: rotary table, 14: heating means, heater, 16: reflective board, 18: rotary shaft, 20: drive motor, 22: outer peripheral pin, 24: support pin, 26: resin sheet, 28: spacer, 30: power source, 32: electric wire, 34: temperature sensor, 36: SW circuit, 38: temperature fuse, 40: bimetal, 70: electric power supply mechanism, 72: fixed-side primary coil, 74: electric power supply source, 76: rotary table-side secondary coil, W: wafer