The embodiments disclosed herein are directed to systems and devices which utilize multiple microwave plasmas can be used to increase the efficiency of traditional single microwave plasma systems. Disclosed herein is a microwave plasma apparatus for processing materials which includes a reaction chamber, a plurality of microwave plasma applicators in communication with the reaction chamber, one or more microwave radiation sources, at least one waveguide for guiding microwave radiation from the one or more microwave radiations sources to multiple plasma applicators, and a material feeding system in communication with the reaction chamber.

A method for plasma coating an object includes an object profile, having the steps of: a) manufacturing a replaceable shield comprising a jet inlet, a nozzle outlet and a sidewall extending from the jet inlet to the nozzle outlet, wherein the nozzle outlet includes an edge essentially congruent to at least part of the object profile; b) detachably attaching the replaceable shield to a jet outlet of a plasma jet generator; c) placing the object at the nozzle outlet such that the object profile fits closely to the nozzle outlet edge; d) plasma coating the object with a low-temperature, oxygen-free plasma at an operating pressure which is higher than the atmospheric pressure by providing a plasma jet in the shield via the plasma jet generator and injecting coating precursors in the plasma jet in the shield.

There is provision of a plasma spraying device including a supplying section configured to convey feedstock powder with a plasma generating gas, and to inject the feedstock powder and the plasma generating gas from an opening of a tip; a plasma generating section configured to generate a plasma by decomposing the injected plasma generating gas using electric power of 500 W to 10 kW; and a chamber causing the supplying section and the plasma generating section to be an enclosed region, which is configured to deposit the feedstock powder on a workpiece by melting the feedstock powder by the plasma generated in the enclosed region. The feedstock powder is any one of lithium (Li), aluminum (Al), copper (Cu), silver (Ag), and gold (Au). A particle diameter of the feedstock powder is between 1 μm and 50 μm.

There is provision of a plasma spraying device including a supplying section configured to convey feedstock powder with a plasma generating gas, and to inject the feedstock powder and the plasma generating gas from an opening of a tip; a plasma generating section configured to generate a plasma by decomposing the injected plasma generating gas using electric power of 500 W to 10 kW; and a chamber causing the supplying section and the plasma generating section to be an enclosed region, which is configured to deposit the feedstock powder on a workpiece by melting the feedstock powder by the plasma generated in the enclosed region. The feedstock powder is any one of lithium (Li), aluminum (Al), copper (Cu), silver (Ag), and gold (Au). A particle diameter of the feedstock powder is between 1 μm and 50 μm.

The present invention provides a plasma torch which comprises: a first pipe having a first flow channel through which a liquid can flow, a first exit through which the liquid is sprayed being provided on an one end side; a second pipe body that surrounds the first pipe body, and has a second flow channel through which a gas can flow, a second exit through which the gas is sprayed being provided on the one end side; and an electrode extending into the second flow channel. The second exit is provided further to the one end side than the first exit, some of the inner peripheral surface of the second pipe decreases in diameter towards the second exit, and the diameter of the inner peripheral surface closer to the second exit than the first exit is equal to or larger than the opening diameter of the first exit.

An apparatus for treating a substrate includes a support unit that supports the substrate and a nozzle that dispenses liquid plasma to etch a film formed on the substrate supported on the support unit.

An apparatus for treating a substrate includes a support unit that supports the substrate and a nozzle that dispenses liquid plasma to etch a film formed on the substrate supported on the support unit.

Systems and methods for highly reproducible and focused plasma jet printing and patterning of materials using appropriate ink containing aerosol through nozzles with narrow orifice and tubes with controlled dielectric constant connected to high voltage power supply, in the presence of electric field and plasma, that enables morphological and/or bulk chemical modification and/or surface chemical modification of the material in the aerosol and/or the substrate prior to printing, during printing and post printing.

Systems and methods for highly reproducible and focused plasma jet printing and patterning of materials using appropriate ink containing aerosol through nozzles with narrow orifice and tubes with controlled dielectric constant connected to high voltage power supply, in the presence of electric field and plasma, that enables morphological and/or bulk chemical modification and/or surface chemical modification of the material in the aerosol and/or the substrate prior to printing, during printing and post printing.

An apparatus for producing metallic powders from molten feedstock includes a heating source for melting a solid feedstock into a molten feed, and a crucible for containing the molten feed. A liquid feed tube is also provided to feed the molten feed as a molten stream. A plasma source delivers a plasma stream, with the plasma stream being adapted to be accelerated to a supersonic N velocity and being adapted : to then impact the molten stream for producing metallic powders. The feed tube extends from the crucible to a location where a supersonic plasma plume atomizes the molten stream. The plasma source includes at least two plasma torches provided with at least one supersonic nozzle aimed towards the molten stream. The multiple plasma torches are disposed symmetrically about the location where the supersonic plasma plumes atomize the molten stream, such as in a ring-shaped configuration.