According to the various aspects, the present device includes a printed circuit board having a top surface and a bottom surface, with a plurality of semiconductor devices coupled to the top surface and a flexible electromagnetic shield wrap conformally positioned over and between the plurality of semiconductor devices and the top surface of the printed circuit board. The flexible electromagnetic shield wrap is conformally positioned by applying a vacuum and is removable after the vacuum seal is broken.

A system and a method are disclosed for placing hardware components on a printed circuit board (“PCB”) in a way that enables all hardware components on the PCB to be passively cooled without using active cooling systems. Components are selected to be placed onto the PCB and heat metrics for each component is obtained (e.g., from a server). The components are ranked based on the amount of heat that each component generates. A corresponding position for each of the hardware components is determined based on the ranking of the components and the orientation of the PCB. The placement is based on the concept that air having higher temperature rises while air having cooler temperature falls. A representation of the PCB according to corresponding positions of the hardware components may be generated for display.

According to certain embodiments, an electronic device comprises: a housing; an electronic component disposed in the housing, wherein the electronic component generates heat during operation; a support cover disposed on the electronic component; a metal member overlapping with the electronic component while interposing the support cover between the metal member and the electronic component; a switching unit selectively forming or disconnecting an electrical connection path of the support cover and the metal member; and at least one processor configured to select an antenna tuning code, based at least in part on whether the switching unit forms or disconnects the electrical connection path, wherein the switching unit includes: a receiving member electrically connected to the support cover and providing a receiving space; a thermally deforming member received in the receiving space, wherein the thermally deforming member deforms based on a temperature; and an elevating member configured to move upwardly to electrically connect the metal member to the support cover, when the thermally deforming member deforms.

The present invention relates to a power module comprising: an upper ceramic substrate (300); a PCB substrate (400) disposed spaced apart from the upper ceramic substrate (300); a plurality of semiconductor chips (G1, G2, G3, G4) spaced apart from each other, arranged in parallel, and mounted on the lower surface of the upper ceramic substrate (300); and a plurality of capacitors (310) mounted on the top surface of the PCB substrate (400) to correspond to locations between the semiconductor chips (G1, G2, G3, G4). The present invention has the advantage of forming a short current path through which the semiconductor chips and the capacitors are connected, thereby increasing a circuit stabilization effect.

Provided is: a multicomponent curable thermally conductive silicone gel composition which has a high thermal conductivity, has excellent gap-filling ability and repairability, and has superior storage stability; a thermally conductive member comprising the composition; and a heat dissipating structure using the same. The thermally conductive silicone gel composition comprises: (A) an alkenyl group-containing organopolysiloxane; (B) an organohydrogenpolysiloxane; (C) a catalyst for hydrosilylation reaction; (D) a thermally conductive filler; (E) a silane-coupling agent or a hydrolysis condensation product thereof; and (F) a specific organopolysiloxane having a hydrolyzable silyl group at one end thereof. The thermally conductive silicone gel composition includes (I) a liquid composition that includes components (A), (C), (D), (E), and (F), but does not include component (B) and (II) a liquid composition that includes components (B), (D), (E), and (F), but does not include component (C) which are individually stored.

Provided are a light board, a method for manufacturing the same, a light-emitting diode (LED) backlight module and an LED backlight device. The light board includes a substrate and a LED device. The substrate includes a first surface and a second surface disposed opposite to each other. The first surface and the second surface are each provided with a wiring area and a non-wiring area. A first heat sink assembly and multiple first reinforcement ribs are disposed in the non-wiring area of the first surface. The multiple first reinforcement ribs intersect to form a first encircled area. The first heat sink assembly is disposed in the first encircled area. The LED device is disposed in the wiring area of the second surface.

The disclosure provides an electronic control apparatus including a printed circuit board with a first surface side and a second surface side and with at least one electronic component that is arranged on at least one of the surface sides of the printed circuit board. At least one heat sink is arranged on the printed circuit board on the opposite surface side from the electronic component for the purpose of heat dissipation. The printed circuit board with the electronic component and the heat sink are surrounded by a casing made from a thermosetting plastic material such that at least one outer side of the heat sink is free of thermosetting plastic material.

To achieve reductions in size and weight and a higher functionality of an imaging device, the imaging device comprises a first circuit board mounting a first heat-generating component for processing a signal from the imaging sensor, a first heat dissipation plate for transferring heat from the first heat-generating component to the housing; and a fan disposed adjacent to the first heat dissipation plate, air-cooling the first heat dissipation plate, wherein the fan is configured to take in the air in a rotation axis direction and discharges the air in an outer circumferential direction, and the discharged air is blown to heat dissipation fins of the heat sink of the first heat dissipation plate and discharged from the discharge port.

A power module for the controllable electrical power supply of a consumer includes a plurality of housed power semiconductors each with an electrically non-insulated heat discharge surface, a printed circuit board, a heat sink, one or more insulation plates, wherein the printed circuit board is arranged on a side of the power semiconductor in an orthogonal direction opposite the heat sink, wherein the insulation plate is arranged between the housed power semiconductors and a cooling surface of the heat sink, wherein one insulation plate in each case is interlockingly connected by one side to one electrically non-insulated heat discharge surface of a housed power semiconductor and is interlockingly connected by the other side to the heat sink.

A direct to chip cooling film for two-phase cooling. The film includes a dielectric layer having a first surface for attachment to a cold plate or circuits and having a second surface. A metal layer is on the second surface of the dielectric layer with a pattern of features on a side opposite the dielectric layer. This surface pattern provides increased surface area and multiple nucleation sites for bubbles formation for two-phase cooling. The features can also include metal nodules to further enhance the nucleation.