An assembly configured to dissipate heat in a gateway, the assembly including: a bracket, the bracket including one or more openings extending from a front side to a back side of the vertically oriented bracket; and a plurality of heat sink fins attached to a base member, and wherein the base member is configured to be attachable to a front side of the bracket and the plurality of heat sink fins extend through the one or more openings to a back side of the bracket.

A high-speed circuit assembly includes a high-speed circuit including at least one waveguide/transmission line, and a radiation absorbing material disposed in contact with or in close proximity with the waveguide/transmission line.

An electronic component module includes a first board comprising a component insertion portion, at least one heat-generating component mounted on a first surface of the first board and in which at least a portion of an active surface is exposed through the component insertion portion, a radiating component inserted into the component insertion portion and mounted on the active surface of the heat-generating component, a second board mounted on a second surface of the first board and configured to electrically connect the first board to an external source, and a connection conductor disposed on an inactive surface of the radiating component and configured to allow contact between the inactive surface of the radiating component and a main board.

A heat dissipating circuit board assembly includes a heat sink having a first wall, a second wall spaced from the first wall, and an end wall extending between the first and second walls. The first wall, the second wall, and the end wall collectively define a cavity. The assembly additionally includes a printed circuit board having a first face and a second face opposite the first face. The printed circuit board is located within the cavity such that the first wall of the heat sink extends over the first face and the second wall of the heat sink extends over the second face to allow heat to be transferred from the printed circuit board to the heat sink. The heat sink is configured to interface with a connector socket when the circuit board is connected to the connector socket for stabilizing the printed circuit board.

An optical module includes a shell, a circuit board, a light source, and a silicon optical chip. The circuit board is located in the shell, a hollow portion is provided in the circuit board, and the hollow portion penetrates the circuit board. The light source includes at least one laser assembly, and the at least one laser assembly is mounted on the shell and is located in the hollow portion, and the at least one laser assembly is electrically connected to the circuit board. The silicon optical chip is mounted on the shell and is located in the hollow portion. The silicon optical chip is electrically connected to the circuit board and is connected to the light source.

An electrical apparatus is provided with a power semiconductor module, at least one capacitor, a circuit carrier, and a first heat sink. The power semiconductor module and the circuit carrier are arranged on the first heat sink. The electrical apparatus comprises a second heat sink arranged on the power semiconductor module and connected to the first heat sink.

A heat dissipation substrate includes a substrate, a heat conducting element, an insulating filling material, a first circuit layer, and a second circuit layer. The substrate has a first surface, a second surface opposite the first surface, and a through groove communicating the first surface with the second surface. The heat conducting element is disposed in the through groove. The heat conducting element includes an insulating material layer and at least one metal layer. The insulating filling material is filled in the through groove for fixing the heat conducting element into the through groove. The first circuit layer is disposed on the first surface of the substrate and exposes a portion of the heat conducting element. The second circuit layer is disposed on the second surface of the substrate. The first circuit layer and the metal layer are respectively disposed on two opposite sides of the insulating material layer.

A first substrate includes a first surface and a second surface opposite to the first surface. A second substrate includes a third surface and a fourth surface opposite to the third surface. A third substrate includes a fifth surface and a sixth surface opposite to the fifth surface. The first substrate is made of an insulator, and includes a mounting portion for mounting an electronic element at the first surface, and the mounting portion is a rectangular shape. The third substrate is made of a carbon material, and the fifth surface is connected to at least the second surface at location overlapped with the mounting portion in plan view. The third substrate has a larger heat conduction in a direction perpendicular to the longitudinal direction of the mounting portion than heat conduction in the longitudinal direction of the mounting portion in plan view.

An image capture device having a housing and a heatsink. The image capture device includes an integrated sensor and lens assembly. The heatsink is located partially or completely within the housing. The heatsink includes a through which a portion of the integrated sensor and lens assembly extends, and a planar surface located adjacent to the cutout. The planar surface includes a front side and a rear side. A printed circuit board in communication with a rear side of the planar surface of the heatsink. An LCD recess located in a front side of the planar surface of the heatsink that is configured to receive a liquid crystal display, wherein the LCD recess is opposite the printed circuit board.

A heat dissipation structure includes a heat sink, a first thermal interface material, a second thermal interface material, a circuit board and a circuit element. The first thermal interface material is connected to the heat sink and has fluidity. The second thermal interface material is connected to the first thermal interface material and has no fluidity. The circuit board is connected to the second thermal interface material and has an opening, a top board surface and a bottom board surface. The circuit element includes a convex portion and a base portion. The convex portion has a top convex surface and is disposed in the opening. The base portion is connected to the convex portion and the bottom board surface. The second thermal interface material is connected to the top board surface and the top convex surface.