The disclosure provides a display panel and a displaying device. The display panel comprises a bonding area and an active area; a flexible printed circuit board, the flexible printed circuit board being arranged on a side, away from the active area, of the bonding area, and comprising a display signal line which extends in a first direction and is electrically connected to the bonding area; and a touch driving line and a signal receiving line, the touch driving line and the signal receiving line being connected to the flexible printed circuit board from the active area via the bonding area, and the display signal line not overlapping with the touch driving line or the signal receiving line.

The present disclosure provides an assembly structure for providing power for a chip and an electronic device using the same. The assembly structure includes: a circuit board, configured to provide a first electrical energy; a chip; a power converting module, configured to electrically connect the circuit board and the chip, convert the first electrical energy to a second electrical energy, and supply the second electrical energy to the chip, wherein the chip, the circuit board and the power converting module are stacked; and a connection component, configured to electrically connect the circuit board and the power converting module. The present disclosure assembles a power converting module with a circuit board and a chip in a stacking manner, which may shorten a current path between the power converting module and the chip, reduce current transmission losses, improve efficiency of a system, reduce space occupancy and save system resource.

An electronic device includes a microphone module and a printed circuit board on which the microphone module is disposed. The printed circuit board includes a first layer having at least one first microphone pad coupled to the microphone module, a first ground spaced apart from the first microphone pad, and a second microphone pad coupled to the microphone module and connected to the first ground; and a second layer disposed under the first layer and having a second ground opposite to the first microphone pad and at least a part of the first ground.

Provided are a flexible flat cable and a method of producing the same. The flexible flat cable includes a plate-shaped first insulation portion comprising an insulating material; a first ground, a second ground, and a third ground disposed at predetermined intervals on the first insulation portion; at least one first signal transmission line positioned between the first ground and the second ground and disposed on the first insulation portion; at least one second signal transmission line positioned between the second ground and the third ground and disposed on the first insulation portion; a first second insulation portion disposed on at least a portion of the first ground and at least a portion of the at least one first signal transmission line and the second ground; a second second insulation portion disposed on at least a portion of the second ground and at least a portion of the at least one second signal transmission line, and the third ground; a conductive adhesive layer configured to enclose the first insulation portion, the first second insulation portion, and the second second insulation portion; and a shielding portion comprising a shielding material adhered to an outside of the conductive adhesive layer. Therefore, by improving shielding efficiency of a plurality of signal transmission lines, while having good electromagnetic interference and crosstalk characteristics, a plurality of signals can be simultaneously transmitted.

A printed circuit board (PCB) module may include a PCB with at least one internal PCB element and at least one external PCB element, a shielding layer fabricated from a tunable metamaterial absorber, and a structure housing the PCB. The at least one internal PCB element may be embedded between adjacent layers of the PCB. The at least one external PCB element may be coupled to an exterior surface of the PCB. The shielding layer may be tuned in response to the at least one measurement of the EMI emission and a determination of a frequency of the EMI emission from the at least one measurement. The tuning of the shielding layer may include adjusting a plurality of fins within a plurality of elements of the metamaterial absorber to absorb at least a portion of the EMI emission.

A circuit board includes a substrate, a first inner circuit layer, a second inner circuit layer, a first insulating layer, a first optical fiber extending along a first direction, an optical component, an electrical component, a transparent insulating layer, a first inclined surface, a first reflective layer, a second inclined surface, a second reflective layer, and a second optical fiber extending along a second direction.

A high frequency module includes a mounting substrate, an inductor, and a plurality of electronic components. The inductor is arranged on the mounting substrate. The inductor is arranged in an inside of the mounting substrate and has a winding portion formed by winding a conductor portion a plurality of times in a thickness direction of the mounting substrate. A first ground layer is formed in a region that is on an inner side of an outer edge of the winding portion in plan view of the mounting substrate, and the first ground layer is arranged closest to the winding portion in the thickness direction of the mounting substrate among ground layers formed in the region in a plurality of ground layers. The first ground layer is overlapped with an inner region but is not overlapped with at least part of the winding portion in plan view of the mounting substrate.

Provided are a display device and a manufacturing method thereof. The display device includes a display assembly, an antenna, and a feed circuit board. At least part of the antenna is disposed on the side of the light emission surface of the display assembly. The antenna includes a radiator and a first feed structure connected to the radiator. The feed circuit board is disposed on the side of the display assembly facing away from the light emission surface. The feed circuit board includes a power division network and a second feed structure connected to the power division network. The first feed structure at least partially overlaps the second feed structure along the thickness direction of the display assembly.

Embodiments provide a multilayer printed circuit board intended to connect electronic components, the board comprising a stack of a plurality of conductive layers, the conductive layers comprising two surface layers and one or more internal layers, the board comprising one or more counterbored holes, each counterbored hole comprising a portion with metallization opening onto one of the two surface layers and a portion without metallization opening onto the other surface layer; the multilayer printed circuit board may advantageously comprise one or more metal pads, each metal pad being joined to one of the two surface layers so as to occult the portion without metallization of a corresponding counterbored hole.

A power module for operating an electric vehicle drive, comprising power switches for generating an output current based on an input current; control electronics for controlling the power switches including a first region, to which a first electric potential is applied, and a second region, to which a second electric potential is applied, wherein the second electric potential is higher than the first electric potential; a heatsink for discharging heat generated by the power switches and the control electronics; a shielding layer for electrically shielding the control electronics placed between the heatsink and the control electronics, such that the control electronics lies on the shielding layer, and the shielding layer lies on the heatsink; wherein the shielding layer is designed to connect the heatsink thermally and electrically to the first region, and thermally to the second region, and electrically insulate it therefrom.