A computing device and a series power supply method are disclosed. The computing device includes: a hash board, including a series power supply circuit, which includes m layers of to-be-powered chips that are connected in series between a power supply positive electrode and a power supply negative electrode of the hash board, wherein highest-layer to-be-powered chips are connected to the power supply positive electrode, and bottommost-layer to-be-powered chips are connected to the power supply negative electrode, wherein the power supply positive electrode is configured to receive a higher potential relative to the power supply negative electrode; a control board, configured to provide, to the hash board, control signals and communication signals that are accessed to the series power supply circuit through a communication interface of the highest-layer to-be-powered chips and communicated to lower layers through the m layers of to-be-powered chips that are connected in series.

Provided is a method for producing a wired circuit board in which a first preparation step of preparing a first substrate having an insulating layer and a conductive layer disposed on one surface of the insulating layer; a second preparation step of preparing a second substrate having a metal layer; a bonding step of laminating the first substrate and the second substrate so that the conductive layer and the metal layer are in contact with each other, and metal-bonding the conductive layer and the metal layer; and a patterning step of forming a conductive pattern on the other surface of the insulating layer are carried out.

A printed circuit board (PCB), including: a processing unit; a plurality of layers; and a plurality of vias, each via extending through two or more of the layers, wherein a first via of the plurality of vias has a first pad at a first layer of the plurality of layers and a second via of the plurality of vias has a second pad at the first layer of the plurality of layers, wherein the first pad is conjoined with the second pad to form a first heatsink at the first layer that dissipates heat away from the processing unit.

A component package includes a printed circuit board; a first electronic component disposed in a first region on the printed circuit board; a second electronic component disposed in a second region on the printed circuit board; and a metal wall disposed on the printed circuit board and spatially partitioning the first region and the second region on a plane. The metal wall is directly connected to the printed circuit board.

The present invention relates to an assembly to be used in an inkjet printer, an inkjet printer and a method for printing. The assembly comprises (i) a first fixture configured to hold a first print head; and (ii) at least two processing lines A, B, C, D, wherein each processing line A, B, C, D includes a first printing section in which a functional layer is printed on a surface of an electronic device, a sintering section spaced apart from the first printing section and configured to sinter the functional layer, wherein the sintered functional layer exhibits a crystal lattice structure, and a transport mechanism (4) configured to move from the printing section to the sintering section. The first fixture is movable from one processing line A, B, C, D to another processing line A, B, C, D.

A multilayer resin substrate includes resin layers that are laminated, a first copper foil on the resin layers and including first and second main surfaces having first and second surface roughnesses, respectively, and a second copper foil on the resin layers and including third and fourth main surfaces having third and fourth surface roughnesses, respectively. A distance between the first main surface and the second copper foil is shorter than a distance between the second main surface and the second copper foil. When the first, second, third, and fourth surface roughnesses are denoted as SR1, SR2, SR3, and SR4 respectively, a relationship SR1<SR3≤SR4<SR2 is satisfied.

An electronic device includes a housing, a first substrate, a second substrate, and an interposer disposed between the first substrate and the second substrate and configured to electrically connect the first substrate and the second substrate. The interposer includes a substrate, a first surface, a second surface, and a side surface. The interposer further includes a plurality of first conductive pads, a plurality of second conductive pads, a plurality of conductive posts, a plurality of third conductive terminals at least partially exposed on the first surface and electrically connected to the plurality of first conductive pads via a first conductive via (CV), and a plurality of fourth conductive terminals at least partially exposed on the second surface and electrically connected to the plurality of second conductive pads via a second CV.

A battery module includes a lower housing and a plurality of battery cells. The plurality of battery cells are electrically coupled together to produce a voltage. The module also includes an assembly disposed over the battery cells and coupled to the lower housing. The assembly may include a lid and a plurality of bus bar interconnects mounted on the lid. The module also includes a printed circuit board (PCB) assembly disposed on and coupled to the assembly. The PCB assembly may include a PCB. The module also includes a cover disposed over and coupled to the lower housing to hermetically seal the battery module. Also disclosed is a method of manufacturing the battery module.

An electronic device includes first and second circuit boards. The second circuit board includes a first portion facing a first main surface of the first circuit board, a second portion facing a second main surface opposite to the first main surface, and a bent portion connecting the first portion and the second portion to each other. The second circuit board includes an element, signal conductors, and a first opening. The first opening is between the signal conductors when viewed in a thickness direction of the element. The first opening extends from the first portion to the second portion through the bent portion. The first portion and the second portion each include a portion not including the first opening between the signal conductors.

In an electronic device, a circuit board connects different systems or structures such that heat of a system with a relatively large amount of heat can be transferred to a position or a heat dissipation structure with a relatively small amount of heat, thereby mitigating local high temperatures in the electronic device and distributing heat more evenly throughout the electronic device.