A channel structure for signal transmission is provided. The channel structure includes a first common pad, disposed on a first layer; a second common pad, disposed on a second layer; a via, for electrically connecting the first common pad and the second common pad; a first device path pad, disposed on the second layer and located in a first direction of the second common pad; and a second device path pad disposed on the second layer and located in a second direction of the second common pad. The channel structure includes a first electrical element electrically coupled between the second common pad and the first device path pad, or includes a second electrical element electrically coupled between the second common pad and the second device path pad.

Interconnections for connecting flex circuit boards in classical and/or quantum computing systems can include a first flex circuit board having a removed portion that exposes one or more signal lines and a second flex circuit board having a removed portion that exposes one or more other signal lines. The flex circuit boards can be aligned at the removed portions to form a signal trace gap near the exposed signal lines. Exposed signal lines of the first flex circuit board can be coupled with exposed signal lines of the second flex circuit board. A ground support layer can be coupled to the first flex circuit board and the second flex circuit board along the same side. An isolation plate at least partially covering the signal trace gap can be coupled to the first flex circuit board and/or the second flex circuit board on a side opposite of the ground support layer.

The present disclosure provides a circuit board and a method for manufacturing the circuit board. The circuit board may include: a base board, an embedded component, and an attached component. The base board may define a groove, the embedded component can be disposed in the groove. The attached component can be attached to at least one surface of the base board and connected to the embedded component.

A circuit assembly is provided and includes a printed circuit board (PCB) having a circuit element region and defining a trench surrounding an entirety of the circuit element region, a circuit element disposed within the circuit element region of the PCB; and a Faraday wall. The Faraday wall includes a solid, unitary body having a same shape as the trench. The Faraday wall is disposed within the trench to surround an entirety of the circuit element.

A printed circuit board assembly and an electronic apparatus using the same are provided. The printed circuit board assembly includes a circuit board and a first bridging unit. The circuit board includes a first wiring layer, and the first wiring layer includes a plurality of first ground traces, a plurality of first signal traces, and at least one first ground region. Each of the first signal traces is disposed between one of the first ground traces and the first ground region. The first bridging unit is disposed on the first wiring layer of the circuit board. The first bridging unit extends over, without contacting, at least one of the first signal traces from one of the first ground traces to another one of the first ground traces or the first ground region, so as to form at least one first conductive ground path.

An affixation film 101 for a printed wiring board includes a circuit pattern concealing layer 112, and an adhesive layer 111 put on top of the circuit pattern concealing layer 112. An opposite surface of the circuit pattern concealing layer 112 from the adhesive layer 111 has an Rku of 2.5-3.0.

A circuit assembly is provided and includes a printed circuit board (PCB) having a circuit element region and defining a trench surrounding an entirety of the circuit element region, a circuit element disposed within the circuit element region of the PCB; and a Faraday wall. The Faraday wall includes a solid, unitary body having a same shape as the trench. The Faraday wall is disposed within the trench to surround an entirety of the circuit element.

An electronic module having at least two electronic components mounted on a substrate. The electronic components are covered by a dielectric material. The dielectric material has a recess between adjacent electronic components. The surface of the recess facing at least one electronic component is coated with a conductive layer while the opposite surface to that coated recess surface is substantially free of a conductive layer. Also disclosed is a process for making the above-specified electronic module.

A shield case, joined to a circuit board on which electronic components are mounted and covering the electronic components, has a top plate portion covering the electronic components, and a plurality of terminal leg portions formed in a way of projecting in a direction intersecting with the top plate portion from a peripheral edge portion of the top plate portion. Each of the plurality of terminal leg portions has: a leg portion stretching from the top plate portion; a terminal portion which extends in a direction intersecting with the leg portion from a front-end of the leg portion and is joined to the circuit board; and an expansion terminal portion which is formed by bending a front-end portion of each of the terminal portions along an end surface of the circuit board and has a length exceeding a thickness of the circuit board.

A semiconductor composite device is provided that includes a voltage regulator, a package board, and a load, and converts an input DC voltage into a different DC voltage to supply the converted DC voltage to the load. The VR includes a semiconductor active element. The package board includes a C layer in which a capacitor is formed, and an L layer in which an inductor is formed. A plurality of through holes penetrate the C layer and the L layer in a direction perpendicular to the mounting face in the package board. The capacitor is connected to the load through the through hole. The inductor is connected to the load through the through hole and to the VR through the through hole.