A structure having imbedded array of components is described. An example structure includes an imbedded component array layer having an array of imbedded passive devices contained therein. The structure further includes an Integrated Fan-Out (InFO) layer residing adjacent a first surface of the imbedded component array layer having traces and vias formed therein. The structure further includes an insulator layer residing adjacent a second surface of the imbedded component array layer and electrically coupled to at least the InFO layer and vias passing through the imbedded component array layer and electrically coupled to some of vias of the InFO layer.

A multicore cable-with-connector includes: a connector, which includes a first ground guard between first and second pads and connected to first and second central conductors on a first surface of a substrate and a second ground guard between third and fourth pads connected to third and fourth central conductors on a second surface. When viewed in a first direction, a projected image of the first guard overlaps 50% or more of projected images of first and second layered structures respectively composed of the first pad and portion of the first conductor and the second pad and portion of the second conductor, and a projected image of the second guard overlaps 50% or more of projected images of third and fourth layered structures respectively composed of the third pad and portion of the third central conductor and the fourth pad and portion of the fourth conductor.

An electronic assembly includes a first printed circuit board (PCB), a second PCB, and a grounding shield. The first PCB includes a first plurality of electronic components and a first conductive layer. The second PCB includes a second plurality of electronic components and a second conductive layer. The grounding shield is electrically connected between the first conductive layer of the first PCB and the second conductive layer of the second PCB to electrically connect the first PCB and the second PCB. The first PCB and the second PCB are arranged in a stack such that the first conductive layer and the second conductive layer mutually shield at least one of the first plurality of electronic components and at least one of the second plurality of electronic components from electromagnetic interference.

An electrical connector assembly including an electrical connecting member, at least one connector, and at least one metal cover is provided. The connector is disposed at and electrically connected to the electrical connecting member. The metal cover is disposed on the electrical connecting member, such that the electrical connecting member is located between the metal cover and the connector, and the connector is covered by the electrical connecting member.

In described examples, an enclosure for circuitry includes a platform, a charge source, a first capacitive plate, a second capacitive plate, and a capacitive sensor. The circuitry is fixedly coupled to the platform. The first capacitive plate is also fixedly coupled to the platform, and either alone, or together with the platform, surrounds a volume containing the circuitry and the charge source, the charge source electrically coupled to and configured to charge the first capacitive plate. The second capacitive plate is fixedly coupled to the platform without touching the first capacitive plate, and either alone, or together with the platform, surrounds the first capacitive plate. The second capacitive plate is configured so that there is an electric potential difference between the first capacitive plate and the second capacitive plate. The capacitive sensor is electrically connected to the first capacitive plate and configured to determine when a capacitance between the first and second capacitive plates is changed.

An assembly comprises a flexible circuit board (FCB) having a substrate with a top side, and a circuit pattern layer on the top side of the substrate. The circuit pattern layer has a connection region for facilitating electrical interconnection to the FCB, and one or more cavities extending through both the substrate and the circuit pattern layer. A first conductive layer for electro-magnetic interference (EMI) shielding is positioned on a top side of the FCB, and a second conductive layer for EMI shielding is positioned on a back side of the FCB. Electrically conductive adhesive extends through the one or more cavities for electrically connecting the first conductive layer and the second conductive layer. The electrically conductive adhesive further extends from the first conductive layer to the connection region for facilitating electrical interconnection of the first conductive layer and the second conductive layer.

This document describes an access point device and associated systems and methods. The techniques and systems include an access point device that includes a housing with an antenna carrier, a circuit board assembly, a heat sink, and a heat shield positioned within the housing. The housing includes a top housing member connected to a bottom housing member. The top housing member includes a concave-down top-end portion connected to a generally cylindrical vertical wall via rounded corners. The antenna carrier supports multiple antennas positioned proximate to an inner surface of the vertical wall. The heat sink is positioned between the antenna carrier and the circuit board assembly. The circuit board assembly is positioned between the heat shield and the heat sink, and the heat shield is positioned between the circuit board assembly and the bottom housing member.

An electronic module having at least two electronic components mounted on a substrate. The electronic components are covered by a dielectric material. The dielectric material has a recess between adjacent electronic components. The surface of the recess facing at least one electronic component is coated with a conductive layer while the opposite surface to that coated recess surface is substantially free of a conductive layer. Also disclosed is a process for making the above-specified electronic module.

A network communication device has a circuit board, a network communication chip, an antenna, and a metal cover. The circuit board has a first surface and a second surface opposite to each other. An interior of the circuit board has a ground layer. An edge of the first surface has a ground ring. The ground ring surrounds the first surface and is electrically connected to the ground layer. The network communication chip is disposed on the first surface. The antenna is electrically connected to the circuit board. The metal cover has an annular support rib. The circuit board is disposed on the annular support rib with the first surface facing the metal cover. The ground ring is in physical contact with and electrically connected to the annular support rib.

In an example there is provided a method for electro-magnetically shielding a circuit board assembly. The method comprises depositing a solder material at multiple locations on a substrate, heating the solder material according to a predetermined thermal profile and coupling an enclosure to the substrate at the locations to provide an electromagnetic shielding for components attached to the substrate. The locations are arranged on the substrate such that a size of a largest aperture of the circuit board assembly is below a pre-determined threshold size value.