The disclosure relates to structures of, and methods for forming electromagnetic band gap (EBG) element. Specifically, the disclosure is directed to methods for additively manufacturing electronic mushroom-type EBG elements having a periodic cell structure enabling a reduced footprint and increased band gap range for a very wide range of frequencies, for example between 500 MHz to about 30 GHz, by altering both the EBG structure's superstrate as well as the ground plane.

An electromagnetic band gap structure apparatus includes a first conducting layer having at least one first slot. Each of the at least one slot is arranged with a planar conductor unit, and the each planar conductor unit is coupled to a first via. The electromagnetic band gap structure apparatus further includes a second conducting layer in parallel with the first conducting layer. The second conducting layer has a second slot. The second slot is arranged with at least one planar transmission line unit. The each of the at least one planar transmission line unit is coupled to the first conducting layer through a second via, and the each first via is coupled to the second conducting layer.

Embodiments described herein are directed to methods and apparatus for power distribution. The apparatus can include a power distribution network for a plurality of integrated circuits (IC). According to embodiments, the power distribution network includes a plurality of overlapping power/ground (PG) plane segments and one or more non-overlapping PG (no-PG) plane segments. Each overlapping-PG plane segment is separated from another overlapping-PG plane segment by at least one no-PG plane segment. The no-PG plane segments can include at least one of a multilayered power (P) plane segment with no ground reference of any PG plane and a multilayered ground (G) plane segment with no power reference of any PG plane.

Embodiments described herein may be related to apparatuses, processes, and techniques related to EMI shielding and thermal conduction without using any surface area of a PCB. Embodiments of the EMI shield may include a planar top, with one or more walls extending from the planar top to a bottom surface of the PCB, the PCB having a top surface disposed between the bottom surface of the PCB and the planar top. A ground of the PCB may electrically couple with the one or more walls. The bottom of the walls may couple with an EMI gasket applied to a bottom chassis to increase the volume of EMI shielding. Other embodiments may be described and/or claimed.

The present disclosure relates to an electronic device, and the electronic device may include a circuit board provided within a main body of the electronic device, on which a conductive layer made of a conductive material and a dielectric layer made of an insulating material are alternately laminated; at least one or more patch antennas disposed on the circuit board; a core layer located at a central portion inside the circuit board, and configured with any one of the dielectric layers; a ground layer disposed below the core layer; and an EBG structure located inside the circuit board in a symmetrical shape at the top and bottom with respect to the core layer, and the EBG structure restricts operating frequency signals radiated from the respective patch antennas from being interfered with each other.

A printed circuit board has: a first wiring pattern laid in a first layer such that, when a predetermined component is mounted in a predetermined mounting region, a first current path in an open ring shape leading from a first end to a second end is formed; a second wiring pattern laid in a second layer different from the first layer such that a second current path in an open ring shape leading from a third end to a fourth end is formed; a first conductive member formed between the second and third ends; and a second conductive member formed between the first and fourth ends. The first and second wiring patterns are so laid that, as seen in their respective plan views, the directions of the currents flowing across the first and second current paths, respectively, are opposite to each other.

The invention relates to an improved electromagnetic band gap (EBG) structure. The invention also relates to an electromagnetic band gap (EBG) component for use in an EBG structure according to the invention. The invention further relates to an antenna device comprising at least one EBG structure according to the invention.

The present disclosure relates to an electronic device, and the electronic device may include a circuit board provided within a main body of the electronic device, on which a conductive layer made of a conductive material and a dielectric layer made of an insulating material are alternately laminated; at least one or more patch antennas disposed on the circuit board; a core layer located at a central portion inside the circuit board, and configured with any one of the dielectric layers; a ground layer disposed below the core layer; and an EBG structure located inside the circuit board in a symmetrical shape at the top and bottom with respect to the core layer, and the EBG structure restricts operating frequency signals radiated from the respective patch antennas from being interfered with each other.

A PCBA for use in a high-energy broadband electric field includes a low-voltage power supply and alternating conductive and dielectric layers. An outermost one of the conductive layers includes a dielectric surface switch having closely-spaced switch contacts. The first switch contact is connected to the positive terminal and the second switch contact is connected to the negative terminal. Vias connect the conductive layers to the terminals through the respective first and second switch contacts to form power and ground planes. A metamaterial layer of nickel is doped with up to 20 percent phosphorus or chromium by weight, has a uniform thickness of less than 5 m, is sandwiched between interfacing surfaces of a pair of the conductive and dielectric layers, and evenly coats one of the interfacing surfaces. A sonobuoy system includes the PCBA, e.g., an Electronic Function Select board, a cylindrical housing, and an acoustic array.

A communication device includes a ground plane, an antenna array, and an EBG (Electromagnetic Band Gap) structure. The antenna array includes a plurality of antenna elements. The EBG structure includes a plurality of EBG units. The EBG units are coupled to the ground plane. The antenna array is surrounded by the EBG structure. The EBG structure is configured to suppress the front-to-back ratio of the radiation efficiency of the antenna array.