The present disclosure relates to an electronic device, and the electronic device may include a circuit board provided within a main body of the electronic device, on which a conductive layer made of a conductive material and a dielectric layer made of an insulating material are alternately laminated; at least one or more patch antennas disposed on the circuit board; a core layer located at a central portion inside the circuit board, and configured with any one of the dielectric layers; a ground layer disposed below the core layer; and an EBG structure located inside the circuit board in a symmetrical shape at the top and bottom with respect to the core layer, and the EBG structure restricts operating frequency signals radiated from the respective patch antennas from being interfered with each other.

Disclosed are an electromagnetic bandgap structure and a method for manufacturing the same. The electromagnetic bandgap structure includes a ground layer, a middle layer configured to include one or more patches, and to face the ground layer with a first dielectric layer interposed between the middle layer and the ground layer, wherein the first dielectric layer is stacked on a top of the ground layer, and a power layer configured to face the middle layer with a second dielectric layer interposed between the power layer and the middle layer, wherein the second dielectric layer is stacked on a top of the patches, wherein the patches and the power layer are electrically connected to each other through a via.

Some novel features pertain to an integrated device that includes a first metal layer and a second metal layer. The first metal layer includes a first set of regions. The first set of regions includes a first netlist structure for a power distribution network (PDN) of the integrated device. The second metal layer includes a second set of regions. The second set of regions includes a second netlist structure of the PDN of the integrated device. In some implementations, the second metal layer further includes a third set of regions comprising the first netlist structure for the PDN of the integrated device. In some implementations, the first metal layer includes a third set of regions that includes a third netlist structure for the PDN of the integrated device. The third set of regions is non-overlapping with the first set of regions of the first metal layer.

Antenna of a shape that allows for its integration in a laptop or tablet computer, which antenna has dual band or multi band functionality, and comprises: an elongate carrier structure of electrically insulating material, and an electric circuitry provided on the carrier structure, which comprises the following electrically conductive elements: a ground plane, two or more antenna elements spaced apart from each other, one or more filter elements which are positioned between a pair of adjacent antenna elements, wherein the antenna elements and the filter elements are electrically connected to the ground plane, and wherein the carrier structure contains a feed connector system that allows for an electrical connection between an external feed line and the antenna elements, and wherein the parts of the carrier structure on which the antenna elements are provided, has a relative dielectric constant of at least 2.0, and is of a substantially solid design, which preferably has a minimum cross-sectional area of 0.30 to 1.5 cm2.

Apparatus including meta-materials and methods for making the apparatus are described. Circuit components, such as split ring resonators and/or spiral loops, may be formed on substrates to form the meta-materials. The meta-materials may be used in various types of apparatus. The methods of making the apparatus may include forming two and/or three-dimensional structures comprising the meta-materials.

A multiple-layer circuit board has a signaling layer, an exterior layer, and a ground layer. A pair of differential signal lines implemented as strip lines are within the signaling layer, and propagate electromagnetic interference (EMI) along the signaling layer. An element conductively extends inwards from the exterior layer. A void of a defected ground structure within the ground layer has a size, shape, and a location in relation to the element to suppress the EMI propagated by the strip lines. A resistive material of the defected ground structure along a perimeter of the void improves suppression of the EMI propagated by the strip lines, via the resistive material absorbing the EMI.

A printed wiring board includes a digital circuit, an analog circuit, and a power supply path that is disposed on an insulating layer between the digital circuit and the analog circuit. A plurality of open stub EBG structures are disposed at an end of a bridge section in a power supply plane. The open stub EBG structure is an open stub state whose one end is connected to the power supply path and other end is in an open state.

A circuit board includes a dielectric layer, a conductive layer disposed on a surface of the dielectric layer, and an electromagnetic bandgap (EBG) structure disposed in the dielectric layer. The electromagnetic bandgap structure includes a via and a signal suppression board. Two opposite ends of the via are respectively connected to the electrically conductive layer and the signal suppression board respectively. The signal suppression board has at least one hollow pattern.

There is provided an antenna device configured to be shaped as a sheet. The antenna device includes an antenna portion provided on one surface of the sheet and configured to implement at least one of transmission of a transmission wave and reception of a reflected wave from a target, and an absorption unit provided on the other surface of the sheet and configured to absorb spurious.

A method of making an electrically active structure includes applying a backplane onto a substrate, applying a paint layer onto said backplane, applying a stencil layer on said paint layer, patterning an electrically active structure onto said paint layer through said stencil layer, and removing said stencil layer.