A method for preventing corona effects in an electronic circuit comprising applying a coating of a first material to a surface of the electronic circuit, and applying a second material having a dielectric constant that is lower than that of the first material on an exposed surface of the first material, wherein the second material comprises a solid dielectric.

The present disclosure relates to a printed circuit board (PCB) device and methods for fabricating a PCB device. In some aspects, the PCB device can comprise a surface or internal layer including one or more electrically conductive traces configured to carry a signal or power plane. The PCB device can also comprise at least one thin film comprising an electrically insulating material disposed on the surface or the internal layer. Additionally, the PCB device can comprise one or more electrically conductive layers on the at least one thin film. In some aspects, the one or more electrically conductive layers and the one or more electrically conductive traces can be separated by the at least one thin film in a configuration that defines a capacitive frequency response between the one or more electrically conductive layers and the one or more electrically conductive traces.

Devices, methods, and systems for forming an electrical circuit out of a conductor embedded in two layers of substrate are disclosed. Portions of the two layers of substrate and the conductor are removed, forming a cavity through the two layers and the conductor. A blocker material is deposited along the wall of the cavity. A portion of the blocker material and adjacent layer of the substrate is removed forming another cavity in contact with a part of the conductor. A surface of the second cavity is then electroless plated by a conductive metal to form part of the electrical circuit.

A highly thermally conductive printed circuit board prevents electrochemical migration by inhibiting elution of copper ions. The printed circuit board is a metal-base printed circuit board including a metal base plate having an insulating resin layer and a copper foil layer stacked thereon in this order. In the printed circuit board, the insulating resin layer contains a first inorganic filler made of inorganic particles having particle diameters of 0.1 nm to 600 nm with an average particle diameter (D.sub.50) of 1 nm to 300 nm, and a second inorganic filler made of inorganic particles having particle diameters of 100 nm to 100 m with an average particle diameter (D.sub.50) of 500 nm to 20 m, and the first inorganic filler and the second inorganic filler are uniformly dispersed in the insulating resin layer.

An injection molded article is provided with: a flat molded resin body that has a flat rectangular parallelepiped shape and is formed from an injection molded resin; and a base sheet affixed to the surface of the molded resin body. The base sheet has formed therein a first conductive layer on a first surface and a through hole passing through from the first surface to a second surface. The through hole is filled with a conductive material, and a second conductive layer is formed so as to be electrically connected with the first conductive layer via the conductive material with which the through hole is filled. In addition, a sealing material is formed on the first conductive layer so as to cover the through hole. The molded resin body is fixed together with the first surface side of the base sheet so as to cover the sealing material.

A flexible printed circuit board according to an aspect of the present invention includes a base film having insulating properties and a conductive pattern laminated to one surface side of the base film. The conductive pattern forms part of a circuit and includes at least one fuse portion having a cross section smaller than the other part. The flexible printed circuit board includes at least one opening passing through front and rear surfaces on at least one of the right and left sides of the fuse portion in a two-dimensional view.

A high density region for a low density circuit. At least a first liquid dielectric layer is deposited on the first surface of a first circuitry layer. The dielectric layer is imaged to create plurality of first recesses. Surfaces of the first recesses are plated electro-lessly with a conductive material to form first conductive structures electrically coupled to, and extending generally perpendicular to, the first circuitry layer. A plating resist is applied. A conductive material is electro-plated to the first conductive structure to substantially fill the first recesses, and the plating resist is removed.

Provided are an organic light-emitting display device and a method of manufacturing the same. The organic light-emitting display device includes a panel including a display unit on which an image is formed and a pad unit including a plurality of terminals connected to the display unit and arranged in a plurality of rows on a substrate, and a flexible circuit board including metal wirings arranged in a plurality of layers so as to be respectively connected in correspondence to the plurality of rows of terminals in the pad unit and being coupled to the pad unit, in which the pad unit includes a one-row terminal zone in which only terminals in a single row from among the plurality of rows of terminals electrically connect the metal wirings to the display unit.

A circuit board includes: a bus bar; a first prepreg that is overlaid on the bus bar; and a sheet-like leakage prevention portion that is overlaid on the surface of the first prepreg and suppresses leakage of the first prepreg to the outside.

A power conversion circuit board (1) is a circuit board on which a power conversion circuit configured to convert a direct current into an alternating current is mounted. A low-voltage circuit (10b) to which a low voltage is applied and a high-voltage circuit (10a) to which a high voltage is applied are separately disposed in different areas on the same circuit board surface. Furthermore, part of wiring of the high-voltage circuit (10a) is formed on the circuit board surface, and the other wiring is constituted by a bus bar provided at a predetermined distance from the circuit board surface.