A multilayer circuit board includes a resin body, signal wires, ground conductors, and a via conductor. The resin body includes resin layers made from thermoplastic resin. The signal wires and the ground conductors are each on or inside the resin body. The via conductor connects corresponding ones of the signal wires to each other or corresponding ones of the ground conductors to each other. The ground conductors include a counter ground conductor on or inside the resin body, facing a signal wire in a stacking direction in which the resin layers are stacked, and overlapping the signal wire in plan view in the stacking direction. The counter ground conductor is made of a graphite sheet including main surfaces and end surfaces covered with a conductor layer. The graphite sheet extends over rigid and flexible portions in plan view in the stacking direction.

A member for a window module includes a base layer which is foldable and in which a groove defined. The base layer includes a first dam structure in which the groove is defined. The member further includes a filler filled in the groove.

A novel foldable display device or an electronic device using the same, e.g., a portable information processor or a portable communication information device, is provided. A foldable display device of which a display panel can be folded n times (n≥1, and n is a natural number) at a curvature radius of greater than or equal to 1 mm and less than or equal to 100 mm is obtained. The display device can be miniaturized by being foldable. In addition, in the state where the flexible display panel is opened, display which is unbroken and continuous over a plurality of housings is possible. The plurality of housings can store a circuit, an electronic component, a battery and the like inside as appropriate, and the thickness of each housing can be small.

A display device includes a display substrate, a touch module and a ring structure. The display substrate includes a first portion for display, a second portion located at a non-display side of the first portion of the display substrate, and a first bent portion for connecting the first portion and the second portion, and a first driver is provided at a side of the second portion away from the first portion. The touch module includes a touch layer and a touch flexible circuit board connected with the touch layer, the touch flexible circuit board includes a flat portion located at a side of the second portion away from the first portion and a second bent portion for connecting the touch layer and the flat portion. The ring structure is located between the flat portion of the touch flexible circuit board and the second portion of the display substrate.

An electronic device including a housing; a first printed circuit board disposed in the housing; a second printed circuit board disposed in the housing; a flexible printed circuit board configured to electrically connect the first printed circuit board to the second printed circuit board, the flexible printed circuit board including: a first connector connected to the first printed circuit board, a second connector connected to the second printed circuit board, and a bending part which extends from the first connector away from the second printed circuit board and bends to extend toward the second printed circuit board; an electrical component disposed in the housing, wherein at least a portion of the electrical component faces the flexible printed circuit board; and a buffer member disposed between a first portion of the bending part and a second portion of the bending part which faces the first portion of the bending part.

Disclosed are a display panel and a display device. The display panel includes a display area, a wiring area, and a bending area connecting the display area and the wiring area; the bending area includes a first boundary on a side closer to the display area; in the first direction, an extension length of the first boundary is less than an extension length of the wiring area; in the second direction, a vertical projection of the first boundary in the wiring area is located within the coverage of the wiring area; in the second direction, the display area includes sub-pixel rows, and the last sub-pixel row is located on a side of the display area closer to the wiring area; in the first direction, a first sub-pixel in the last sub-pixel row is located on a side of the wiring area boundary closer to the center of the display panel.

Methods, devices, and systems for producing a flexible electronic device that reduces stress and forces on electronic components are provided. In particular, one or more transition layers with intermediate flexibility, or flexural modulus, are positioned between rigid components and flexible outer layers. This gradually reduces the flexural modulus of the flexible electronics device rather than have an interface between a rigid material and a flexible material. Various materials and methods of forming the layers are described. In addition, an encapsulate layer can be cured to varying flexural moduli to gradually reduce the flexural moduli from the rigid component to the flexible outer layers or bulk structure of the flexible electronic device.

An optical unit includes a movable body including an optical module, a fixed body, a support mechanism, a flexible printed circuit board, and a fixing part. The fixing part is superposed on a bent part formed by bending the flexible printed circuit board. At least a part of the fixing part is fixed to the bent part of the flexible printed circuit board.

According to one embodiment, an electronic device includes a flexible film-like insulating base and a sensor disposed on the insulating base, and the insulating base includes a detection area in which the sensor is disposed and a peripheral area on an outer side of the detection area, and the peripheral area includes a reinforcement member provided thereon to extend along an outer circumference of the insulating base.

A flexible circuit board and an electronic device including a flexible circuit board are provided. The flexible circuit board may include a substrate having a bending area and a non-bending area, a wiring pattern layer provided on the bending area and the non-bending area, a plating layer provided on the wiring pattern layer and including an open area in an area corresponding to the bending area, and a protective layer that directly contacts one surface of the wiring pattern layer exposed at the open area and a side surface of the plating layer. The protective layer may have a larger thickness than a thickness of the plating layer.