A digitizer including a flexible printed circuit film including a folding area configured to be folded, and having a first surface and a second surface opposite to the first surface, a plurality of first lines disposed on the first surface of the flexible printed circuit film and extending in a first direction, and a plurality of second lines disposed on the second surface of the flexible printed circuit film and extending in a second direction crossing the first direction, in which the first lines and the second lines define a grid area overlapping the folding area on a plane, and the flexible printed circuit film includes a penetration hole in the grid area.

Provided is a printed circuit board using thermally and electrically conductive layer, and a manufacturing method thereof The manufacturing method for mounting a plurality of elements includes forming an electrode layer on a substrate of a PCB, forming a photo solder resist (PSR) layer in a patterned manner on a first area of the electrode layer; forming a conductive layer on the PSR layer in the patterned manner, the conductive layer being configured to conduct heat and static electricity; and mounting a plurality of elements on a second area of the side of the PCB, the second area being different from the first area.

According to one embodiment, a flexible substrate includes a flexible insulation base material and a plurality of wiring lines provided on one surface side of the insulation base material, and the insulation base material includes a thinned first area and a second area having a thickness larger than that of the first area, the first area includes a first lower surface, the second area includes a second lower surface, the first lower surface and the second lower surface are formed on an opposite side of a surface on which the wiring lines are provided, and the first lower surface includes an inclined portion inclined towards the second lower surface.

The present disclosure includes an adjustable circuit board assembly including a circuit board, a header connected to the circuit board, and a matrix connector. The header may be configured for connection with the circuit board via a connection matrix and the matrix connector. A method of manufacturing a circuit board assembly may include providing a circuit board, providing a terminal header having a plurality of terminals, providing a connection matrix to at least one of the circuit board and the terminal header, providing a matrix connector, connecting the terminal header with the circuit board via the matrix connector and the connection matrix, and connecting the plurality of terminals to the circuit board.

A touch panel includes a substrate having insulating properties and including a sensing region and a non-sensing region, a plurality of sensor electrodes formed in the sensing region, a plurality of external connection terminals formed in the non-sensing region, and a lead-out wiring line electrically connecting one end of each of the plurality of sensor electrodes to each of the plurality of external connection terminals. The external connection terminal and the lead-out wiring line are continuously divided by a single slit along an extension direction of the external connection terminal and the lead-out wiring line in an entire length, or in a portion of the entire length from which an end portion in a sensor electrode side of the lead-out wiring line is excluded.

An automated breadboard wiring assembly includes a breadboard with holes therein defining at least two nodes and at least a primary wiring board. The primary wiring board has a wiring matrix composed of a plurality of interconnected wiring segments, each wiring segment having a switch therealong. A plurality of contacts are interconnected with the wiring matrix with a switch positioned between each contact and the wiring matrix. Each contact is configured to engage a respective one of the breadboard nodes. An input device is configured to indicate desired wires between nodes and the locations of the desired wires define wiring information. A microprocessor configured to receive wiring information from the input device and open selective ones of the switches such that an electrical path along selective ones of the contacts and the wire segments is defined to correspond to each desired wire set forth in the wiring information.

A touch panel includes a substrate having insulating properties and including a sensing region and a non-sensing region, a plurality of sensor electrodes formed in the sensing region, a plurality of external connection terminals formed in the non-sensing region, and a lead-out wiring line electrically connecting one end of each of the plurality of sensor electrodes to each of the plurality of external connection terminals. The external connection terminal and the lead-out wiring line are continuously divided by a single slit along an extension direction of the external connection terminal and the lead-out wiring line in an entire length, or in a portion of the entire length from which an end portion in a sensor electrode side of the lead-out wiring line is excluded.

A light assembly and method of forming light assemblies includes a flexible light layer, a thermoplastic housing, and an IMC layer. The flexible light layer has a flexible substrate, a printed circuit, and a plurality of LEDs extending outward from the flexible substrate. The IMC layer is formed opposite the flexible light layer from the thermoplastic housing and covers the LEDs. Forming may include placing the flexible light layer within a mold cavity, injecting the thermoplastic structure on one side of the flexible light layer, and injecting the IMC layer on the opposite side of the flexible light layer from the thermoplastic structure. Injecting the thermoplastic structure into the mold cavity may change the shape of the flexible light layer. Datum features of the flexible light layer may align the thermoplastic structure relative to the datum features.

An electronic device and a manufacturing method thereof are provided. The pattern circuit of each surface mount structure of the electronic device is disposed on the substrate; at least two through holes are respectively corresponding to at least two signal lines of the pattern circuit; and the two ends of at least one optoelectronic element are respectively electrically connected to at least two signal lines of the pattern circuit. Each connection pad group of the driving circuit board is corresponding to each surface mount structure, and at least two connection pads are respectively corresponding to the at least two through holes of the surface mount structure. At least two conductive members of each conductive member unit are disposed in the at least two through holes of the surface mount structure, respectively, and extending to the first surface and the second surface of the substrate. The conductive member disposed in each through hole electrically connects the signal lines of each surface mounting structure to the connection pads of each connection pad group of the driving circuit board.

A display device is provided. The display device includes an auxiliary substrate, a display substrate, and a circuit board. The auxiliary substrate includes an auxiliary circuit. The display substrate is disposed on the auxiliary substrate. The display substrate includes a circuit. The circuit board is electrically connected to the auxiliary substrate. The circuit of the display substrate is electrically connected to the auxiliary circuit through a first conductive via, and the circuit board provides a signal to the auxiliary circuit.