Provided is a printed circuit board using thermally and electrically conductive layer, and a manufacturing method thereof. The manufacturing method for mounting a plurality of elements includes forming an electrode layer on a substrate of a PCB, forming a photo solder resist (PSR) layer in a patterned manner on a first area of the electrode layer; forming a conductive layer on the PSR layer in the patterned manner, the conductive layer being configured to conduct heat and static electricity; and mounting a plurality of elements on a second area of the side of the PCB, the second area being different from the first area.

A modular computer system includes a plurality of circuit modules, each of which includes one or more components that are subject to failure, such as a vacuum tube. A carrier assembly is added to each circuit module of the modular computer system. The carrier assembly hosts monitoring circuitry that indicates the proper functioning of one or more components on the attached module. In one implementation, each module includes a vacuum tube, and a coil located on the carrier assembly is connected in series with the heater of the vacuum tube. A Hall effect sensor is positioned near the coil. If the heater of the vacuum tube fails, the flow of current through the coil is interrupted and is detected by the Hall effect sensor. The Hall effect sensor is connected to an LED that indicates failure of the vacuum tube.

A printed circuit board (PCB) assembly of a micro light emitting diode (LED) display is provided. The PCB assembly includes a PCB including a first face disposed in a first direction and a second face disposed in a second direction opposite to the first direction, at least one thin film transistor (TFT) circuitry constructed directly on the first face, and a plurality of pixels arranged on the first face and electrically coupled to the at least one TFT circuitry.

An automated breadboard wiring assembly includes a breadboard with holes therein defining at least two nodes and at least a primary wiring board. The primary wiring board has a wiring matrix composed of a plurality of interconnected wiring segments, each wiring segment having a switch therealong. A plurality of contacts are interconnected with the wiring matrix with a switch positioned between each contact and the wiring matrix. Each contact is configured to engage a respective one of the breadboard nodes. An input device is configured to indicate desired wires between nodes and the locations of the desired wires define wiring information. A microprocessor configured to receive wiring information from the input device and open selective ones of the switches such that an electrical path along selective ones of the contacts and the wire segments is defined to correspond to each desired wire set forth in the wiring information.

A touch panel includes: a substrate having a first region and a second region. A plurality of sensing cells are disposed in the first region and a pad portion is disposed in the second region. An insulating interlayer is disposed on the plurality of sensing cells, a connection pattern is disposed on the insulating interlayer, with the connection pattern being electrically connected to adjacent sensing cells through contact holes. A transparent conductive pattern is disposed in the second region and on the insulating interlayer, with the transparent conductive pattern being electrically connected to the plurality of sensing cells and the pad portion.

The application relates to a transparent conductive film (1) according to one embodiment, wherein the first transparent layer (31) having a first pattern of first electrodes is provided, e.g. deposited, on the first side (2a) of a transparent base film (2) and the second transparent layer (32) having a second pattern of second electrodes is provided, e.g. deposited, on the second side (2b) of the transparent base film (2). Further, the application relates to a method for producing a transparent conductive film. Further, the application relates to a touch sensing device and to different uses.

A display device includes gate lines disposed on a substrate in a first direction, data lines disposed on the substrate in a second direction crossing the first direction, the data lines being insulated from the gate lines, a first insulating film disposed between the data lines, a second insulating film disposed on the data lines and the first insulating film, and a first electrode disposed on the second insulating film. The first insulating film does not overlap the data lines in a direction perpendicular to the substrate.

The present invention relates generally to electric circuit testing, building, or implementing using a breadboard-style printed circuit board (PCB). Aspects of the present invention include eliminating the need to use hookup wires when building and testing electric circuits on PCBs. In one or more embodiments, a PCB system having rows and columns of signal tie points connected in a breadboard layout and using an embedded wire and a solder bridge to form partial connections between signal tie points may be built. In one or more embodiments, an embedded wire and solder bridge is capable of connecting a column of signal tie points, and/or an embedded wire and solder bridge is capable of connecting a power rail to a signal tie point. Thus, a circuit may be implemented and tested by applying a small amount of solder to the solder bridge without the need for hookup wire.

A multi-layer circuit board comprising a carrier plate with an upper surface and a lower surface, and at least one electrically conductive upper inner layer located on the upper surface of the carrier plate and an electrically insulating upper intermediate layer located thereon, and an electrically conductive upper outer layer located thereon, forming the outermost layer of the upper surface. At least one electrically conductive lower inner layer is located on the lower surface of the carrier plate and an electrically insulating lower intermediate layer located thereon, and an electrically conductive lower outer layer located thereon, forming the outermost layer of the lower surface. The upper and/or lower outer layers are populated with components, and conductor paths in one of the inner layers are oriented in different directions from conductor paths in the other inner layer, and the region between the conductor paths is flooded with a voltage.

The present disclosure provides a touch substrate and a method for manufacturing the same, and a touch panel, belonging to the field of touch technology. The touch substrate is divided into a touch area and a wiring area located at a periphery of the touch area, including: a black matrix pattern arranged on the wiring area; a plurality of conductive lines located on the black matrix pattern; and a ground conductive pattern located between two adjacent conductive lines of the plurality conductive lines on the black matrix pattern.