A touch panel includes a first electrode formed of first thin metal wires arranged in the transmissive region and a second electrode insulated from the first electrode and formed of second thin metal wires arranged to intersect the first thin metal wire in the transmissive region, in which the second thin metal wires is arranged on the side opposite to the viewing side than the first thin metal wires.

The application relates to a transparent conductive film (1) according to one embodiment, wherein the first transparent layer (31) having a first pattern of first electrodes is provided, e.g. deposited, on the first side (2a) of a transparent base film (2) and the second transparent layer (32) having a second pattern of second electrodes is provided, e.g. deposited, on the second side (2b) of the transparent base film (2). Further, the application relates to a method for producing a transparent conductive film. Further, the application relates to a touch sensing device and to different uses.

An automated breadboard wiring assembly includes a breadboard with holes therein defining at least two nodes and at least a primary wiring board. The primary wiring board has a wiring matrix composed of a plurality of interconnected wiring segments, each wiring segment having a switch therealong. A plurality of contacts are interconnected with the wiring matrix with a switch positioned between each contact and the wiring matrix. Each contact is configured to engage a respective one of the breadboard nodes. An input device is configured to indicate desired wires between nodes and the locations of the desired wires define wiring information. A microprocessor configured to receive wiring information from the input device and open selective ones of the switches such that an electrical path along selective ones of the contacts and the wire segments is defined to correspond to each desired wire set forth in the wiring information.

The present disclosure provides a touch substrate and a method for manufacturing the same, and a touch panel, belonging to the field of touch technology. The touch substrate is divided into a touch area and a wiring area located at a periphery of the touch area, including: a black matrix pattern arranged on the wiring area; a plurality of conductive lines located on the black matrix pattern; and a ground conductive pattern located between two adjacent conductive lines of the plurality conductive lines on the black matrix pattern.

A touch panel includes a first electrode formed of first thin metal wires arranged in the transmissive region and a second electrode insulated from the first electrode and formed of second thin metal wires arranged to intersect the first thin metal wire in the transmissive region, in which the second thin metal wires is arranged on the side opposite to the viewing side than the first thin metal wires.

A chip part includes a substrate, a first electrode and a second electrode which are formed apart from each other on the substrate and a circuit network which is formed between the first electrode and the second electrode. The circuit network includes a first passive element including a first conductive member embedded in a first trench formed in the substrate and a second passive element including a second conductive member formed on the substrate outside the first trench.

The transparent conductor involves a first laminate part including a transparent resin substrate and a transmittance-controlling layer, and a second laminate part including the transparent resin substrate, the transmittance-controlling layer, a metal layer containing silver or a silver alloy, and a metal oxide layer in the order presented. The first laminate part and the second laminate part are adjacent to each other in a direction perpendicular to the direction of lamination of the first laminate part and the second laminate part, and the difference between the transmittance of the first laminate part in the direction of lamination, T1, and the transmittance of the second laminate part in the direction of lamination, T2, (T2T1) is 4% or more.

A touch panel includes a first electrode formed of first thin metal wires arranged in the transmissive region and a second electrode insulated from the first electrode and formed of second thin metal wires arranged to intersect the first thin metal wire in the transmissive region, in which the second thin metal wires is arranged on the side opposite to the viewing side than the first thin metal wires.

A multi-layer circuit board comprising a carrier plate with an upper surface and a lower surface, and at least one electrically conductive upper inner layer located on the upper surface of the carrier plate and an electrically insulating upper intermediate layer located thereon, and an electrically conductive upper outer layer located thereon, forming the outermost layer of the upper surface. At least one electrically conductive lower inner layer is located on the lower surface of the carrier plate and an electrically insulating lower intermediate layer located thereon, and an electrically conductive lower outer layer located thereon, forming the outermost layer of the lower surface. The upper and/or lower outer layers are populated with components, and conductor paths in one of the inner layers are oriented in different directions from conductor paths in the other inner layer, and the region between the conductor paths is flooded with a voltage.

Provided is a printed circuit board using thermally and electrically conductive layer, and a manufacturing method thereof. The manufacturing method for mounting a plurality of elements includes forming an electrode layer on a substrate of a PCB, forming a photo solder resist (PSR) layer in a patterned manner on a first area of the electrode layer; forming a conductive layer on the PSR layer in the patterned manner, the conductive layer being configured to conduct heat and static electricity; and mounting a plurality of elements on a second area of the side of the PCB, the second area being different from the first area.